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公开(公告)号：US10685920B2
公开(公告)日：2020-06-16
申请号：US15823474
申请日：2017-11-27
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor： Ming-Chih Yew , Fu-Jen Li , Po-Yao Lin , Kuo-Chuan Liu
Abstract: Between an adhesive surface of a heat spreader lid and a top surface of a semiconductor package, in addition to a spreader adhesive layer, several warpage control adhesive layers are also provided. The warpage control adhesive layers are disposed on corner areas of the adhesive surface of the heat spreader lid to reduce high temperature warpage of the semiconductor device package.
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公开(公告)号：US10067181B2
公开(公告)日：2018-09-04
申请号：US15594143
申请日：2017-05-12
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor： Mill-Jer Wang , Kuo-Chuan Liu , Ching-Nen Peng , Hung-Chih Lin , Hao Chen
IPC: G01R31/00 , G01R31/28 , G01R1/04 , G01R31/3185
Abstract: A testing holder for a chip unit, a multi site holding frame for plural chip units and a method for testing a die thereof are provided. The proposed multi site holding frame for testing plural chip units simultaneously includes a first holder frame having a plurality of testing holders. Each of the plurality of testing holders includes a holder body containing a specific one of the plural chip units, and a pressure releasing device formed on the holder body to release an insertion pressure when the specific one of the plural chip units is inserted in the holder body.
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公开(公告)号：US11329006B2
公开(公告)日：2022-05-10
申请号：US16900815
申请日：2020-06-12
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor： Ming-Chih Yew , Fu-Jen Li , Po-Yao Lin , Kuo-Chuan Liu
Abstract: Between an adhesive surface of a heat spreader lid and a top surface of a semiconductor package, in addition to a spreader adhesive layer, several warpage control adhesive layers are also provided. The warpage control adhesive layers are disposed on corner areas of the adhesive surface of the heat spreader lid to reduce high temperature warpage of the semiconductor device package.
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公开(公告)号：US09453877B2
公开(公告)日：2016-09-27
申请号：US15098037
申请日：2016-04-13
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor： Mill-Jer Wang , Kuo-Chuan Liu , Ching-Nen Peng , Hung-Chih Lin , Hao Chen
CPC classification number: G01R31/2893 , G01R1/0483 , G01R1/06722 , G01R31/2867 , G01R31/2875 , G01R31/318513
Abstract: A testing holder for a chip unit, a multi site holding frame for plural chip units and a method for testing a die thereof are provided. The proposed multi site holding frame for testing plural chip units simultaneously includes a first holder frame having a plurality of testing holders. Each of the plurality of testing holders includes a holder body containing a specific one of the plural chip units, and a pressure releasing device formed on the holder body to release an insertion pressure when the specific one of the plural chip units is inserted in the holder body.
Abstract translation: 提供了用于芯片单元的测试保持器，用于多个芯片单元的多站点保持框架和用于测试其芯片的方法。 所提出的用于同时测试多个芯片单元的多站点保持框架包括具有多个测试保持器的第一保持架。 多个测试夹具中的每一个包括一个包含多个芯片单元中的特定一个的保持器本体，以及形成在保持器主体上以当多个芯片单元中的特定一个插入保持器中时释放插入压力的压力释放装置 身体。
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公开(公告)号：US11764169B2
公开(公告)日：2023-09-19
申请号：US17739990
申请日：2022-05-09
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor： Ming-Chih Yew , Fu-Jen Li , Po-Yao Lin , Kuo-Chuan Liu
CPC classification number: H01L23/562 , H01L23/36 , H01L23/3128 , H01L23/40 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/0002 , H01L2924/15311 , H01L2924/3511 , H01L2924/0002 , H01L2924/00 , H01L2224/73204 , H01L2224/16225 , H01L2224/32225 , H01L2924/00 , H01L2924/15311 , H01L2224/73204 , H01L2224/16225 , H01L2224/32225 , H01L2924/00
Abstract: A semiconductor device package includes a die, a molding layer, a heat spreader lid, and a warpage control adhesive layer. The molding layer surrounds the die. The molding layer has a first edge and a second edge at least partially defining a corner of the molding layer. The heat spreader lid covers the molding layer and the die. The warpage control adhesive layer is between the heat spreader lid and the molding layer. The warpage control adhesive layer is at the corner of the molding layer and has a bar shape in a top view, and the warpage control adhesive layer extends from the first edge toward the second edge of the molding layer.
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Patent Agency Ranking
公开(公告)号：US11340291B2
公开(公告)日：2022-05-24
申请号：US16912017
申请日：2020-06-25
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor： Mill-Jer Wang , Kuo-Chuan Liu , Ching-Nen Peng , Hung-Chih Lin , Hao Chen
IPC: G01R31/28 , G01R31/3185 , G01R1/04 , G01R1/067
Abstract: A testing holder for a chip unit, a multi site holding frame for plural chip units and a method for testing a die thereof are provided. The proposed multi site holding frame for testing plural chip units simultaneously includes a first holder frame having a plurality of testing holders. Each of the plurality of testing holders includes a holder body containing a specific one of the plural chip units, and a pressure releasing device formed on the holder body to release an insertion pressure when the specific one of the plural chip units is inserted in the holder body.
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公开(公告)号：US09831190B2
公开(公告)日：2017-11-28
申请号：US14151217
申请日：2014-01-09
Applicant: Taiwan Semiconductor Manufacturing CO., LTD.
Inventor： Ming-Chih Yew , Fu-Jen Li , Po-Yao Lin , Kuo-Chuan Liu
CPC classification number: H01L23/562 , H01L23/3128 , H01L23/36 , H01L23/40 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/0002 , H01L2924/15311 , H01L2924/3511 , H01L2924/00
Abstract: Between an adhesive surface of a heat spreader lid and a top surface of a semiconductor package, in addition to a spreader adhesive layer, several warpage control adhesive layers are also provided. The warpage control adhesive layers are disposed on corner areas of the adhesive surface of the heat spreader lid to reduce high temperature warpage of the semiconductor device package.
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公开(公告)号：US10698026B2
公开(公告)日：2020-06-30
申请号：US16119871
申请日：2018-08-31
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor： Mill-Jer Wang , Kuo-Chuan Liu , Ching-Nen Peng , Hung-Chih Lin , Hao Chen
IPC: G01R31/28 , G01R31/3185 , G01R1/04 , G01R1/067
Abstract: A testing holder for a chip unit, a multi site holding frame for plural chip units and a method for testing a die thereof are provided. The proposed multi site holding frame for testing plural chip units simultaneously includes a first holder frame having a plurality of testing holders. Each of the plurality of testing holders includes a holder body containing a specific one of the plural chip units, and a pressure releasing device formed on the holder body to release an insertion pressure when the specific one of the plural chip units is inserted in the holder body.
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公开(公告)号：US09664707B2
公开(公告)日：2017-05-30
申请号：US15250198
申请日：2016-08-29
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor： Mill-Jer Wang , Kuo-Chuan Liu , Ching-Nen Peng , Hung-Chih Lin , Hao Chen
IPC: G01R31/00 , G01R1/067 , G01R1/04 , G01R31/28 , G01R31/3185
CPC classification number: G01R31/2893 , G01R1/0483 , G01R1/06722 , G01R31/2867 , G01R31/2875 , G01R31/318513
Abstract: A testing holder for a chip unit, a multi site holding frame for plural chip units and a method for testing a die thereof are provided. The proposed multi site holding frame for testing plural chip units simultaneously includes a first holder frame having a plurality of testing holders. Each of the plurality of testing holders includes a holder body containing a specific one of the plural chip units, and a pressure releasing device formed on the holder body to release an insertion pressure when the specific one of the plural chip units is inserted in the holder body.
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公开(公告)号：US20150194389A1
公开(公告)日：2015-07-09
申请号：US14151217
申请日：2014-01-09
Applicant: Taiwan Semiconductor Manufacturing CO., LTD.
Inventor： Ming-Chih Yew , Fu-Jen Li , Po-Yao Lin , Kuo-Chuan Liu
IPC: H01L23/00 , H01L23/367
CPC classification number: H01L23/562 , H01L23/3128 , H01L23/36 , H01L23/40 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/0002 , H01L2924/15311 , H01L2924/3511 , H01L2924/00
Abstract: Between an adhesive surface of a heat spreader lid and a top surface of a semiconductor package, in addition to a spreader adhesive layer, several warpage control adhesive layers are also provided. The warpage control adhesive layers are disposed on corner areas of the adhesive surface of the heat spreader lid to reduce high temperature warpage of the semiconductor device package.
Abstract translation: 在散热器盖的粘合表面和半导体封装的顶表面之间，除了吊具粘合剂层之外，还提供了几个翘曲控制粘合剂层。 翘曲控制粘合剂层设置在散热器盖的粘合表面的拐角区域，以减少半导体器件封装的高温翘曲。
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