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公开(公告)号：US10353285B2
公开(公告)日：2019-07-16
申请号：US16010118
申请日：2018-06-15
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Hsin-Chang Lee , Pei-Cheng Hsu , Yun-Yue Lin , Hsuan-Chen Chen , Hsuan-I Wang , Anthony Yen
Abstract: A structure including an EUV mask and a pellicle attached to the EUV mask. The pellicle includes a pellicle frame and a plurality of pellicle membrane layers attached to the pellicle frame. The plurality of pellicle membrane layers include at least one core pellicle membrane layer and an additional pellicle membrane layer is disposed on the at least one core pellicle membrane layer. In some embodiments, the additional pellicle membrane layer is a material having a thermal emissivity greater than 0.2, a transmittance greater than 80%, and a refractive index (n) for 13.5 nanometer source of greater than 0.9.
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公开(公告)号：US10162258B2
公开(公告)日：2018-12-25
申请号：US15381033
申请日：2016-12-15
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Yun-Yue Lin , Hsuan-Chen Chen , Chih-Cheng Lin , Hsin-Chang Lee , Yao-Ching Ku , Wei-Jen Lo , Anthony Yen , Chin-Hsiang Lin , Mark Chien
Abstract: A method for fabricating a pellicle includes forming a first dielectric layer over a back surface of a substrate. After forming the first dielectric layer, and in some embodiments, a graphene layer is formed over a front surface of the substrate. In some examples, after forming the graphene layer, the first dielectric layer is patterned to form an opening in the first dielectric layer that exposes a portion of the back surface of the substrate. Thereafter, while using the patterned first dielectric layer as a mask, an etching process may be performed to the back surface of the substrate to form a pellicle having a pellicle membrane that includes the graphene layer.
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公开(公告)号：US10747103B2
公开(公告)日：2020-08-18
申请号：US16228339
申请日：2018-12-20
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Yun-Yue Lin , Hsuan-Chen Chen , Chih-Cheng Lin , Hsin-Chang Lee , Yao-Ching Ku , Wei-Jen Lo , Anthony Yen , Chin-Hsiang Lin , Mark Chien
Abstract: A method for fabricating a pellicle includes forming a first dielectric layer over a back surface of a substrate. After forming the first dielectric layer, and in some embodiments, a graphene layer is formed over a front surface of the substrate. In some examples, after forming the graphene layer, the first dielectric layer is patterned to form an opening in the first dielectric layer that exposes a portion of the back surface of the substrate. Thereafter, while using the patterned first dielectric layer as a mask, an etching process may be performed to the back surface of the substrate to form a pellicle having a pellicle membrane that includes the graphene layer.
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公开(公告)号：US10001701B1
公开(公告)日：2018-06-19
申请号：US15380121
申请日：2016-12-15
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Pei-Cheng Hsu , Hsin-Chang Lee , Yun-Yue Lin , Hsuan-Chen Chen , Hsuan-I Wang , Anthony Yen
Abstract: A structure including an EUV mask and a pellicle attached to the EUV mask. The pellicle includes a pellicle frame and a plurality of pellicle membrane layers attached to the pellicle frame. The plurality of pellicle membrane layers include at least one core pellicle membrane layer and an additional pellicle membrane layer is disposed on the at least one core pellicle membrane layer. In some embodiments, the additional pellicle membrane layer is a material having a thermal emissivity greater than 0.2, a transmittance greater than 80%, and a refractive index (n) for 13.5 nanometer source of greater than 0.9.
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