公开(公告)号：US12074032B2

公开(公告)日：2024-08-27

申请号：US17340766

申请日：2021-06-07

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Meng-Je Chuang ,  Wan-Chun Kuan ,  Yi-Wei Chiu ,  Tzu-Chan Weng

IPC: H01L21/311 ,  H01J37/32 ,  H01L21/3065 ,  H01L21/67 ,  H01L21/8234 ,  H01L29/66

CPC classification number: H01L21/31116 ,  H01J37/32009 ,  H01J37/3244 ,  H01L21/3065 ,  H01L21/67069 ,  H01L21/67103 ,  H01L21/67126 ,  H01L21/6719 ,  H01L21/67201 ,  H01J2237/334 ,  H01L21/823431 ,  H01L29/66742 ,  H01L29/66795

Abstract: A chamber door, such as an etch chamber door may be heated during etch processing to, e.g., prevent etching by-products from adhering to the etch chamber door. Such heating of the etch chamber door, however, can impact the processing parameters and result in non-uniform processing, such as non-uniform etching characteristics across a semiconductor wafer, for instance. An insulator, such as an insulating film covering surfaces of the heated door, can reduce or eliminate transmission of heat from the door to a work piece such as a semiconductor wafer and this reduce or eliminate the non-uniformity of the process results.

公开(公告)号：US20210296135A1

公开(公告)日：2021-09-23

申请号：US17340766

申请日：2021-06-07

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Meng-Je Chuang ,  Wan-Chun Kuan ,  Yi-Wei Chiu ,  Tzu-Chan Weng

IPC: H01L21/311 ,  H01L21/67 ,  H01J37/32 ,  H01L21/3065

Abstract: A chamber door, such as an etch chamber door may be heated during etch processing to, e.g., prevent etching by-products from adhering to the etch chamber door. Such heating of the etch chamber door, however, can impact the processing parameters and result in non-uniform processing, such as non-uniform etching characteristics across a semiconductor wafer, for instance. An insulator, such as an insulating film covering surfaces of the heated door, can reduce or eliminate transmission of heat from the door to a work piece such as a semiconductor wafer and this reduce or eliminate the non-uniformity of the process results.