METAL GATE STRUCTURE AND METHODS THEREOF
    1.
    发明申请

    公开(公告)号:US20200152757A1

    公开(公告)日:2020-05-14

    申请号:US16741381

    申请日:2020-01-13

    Abstract: Provided is a metal gate structure and related methods that include forming a first fin and a second fin on a substrate. In various embodiments, the first fin has a first gate region and the second fin has a second gate region. By way of example, a metal-gate line is formed over the first and second gate regions. In some embodiments, the metal-gate line extends from the first fin to the second fin, and the metal-gate line includes a sacrificial metal portion. In various examples, a line-cut process is performed to separate the metal-gate line into a first metal gate line and a second gate line. In some embodiments, the sacrificial metal portion prevents lateral etching of a dielectric layer during the line-cut process.

    DUMMY FIN CELL PLACEMENT IN AN INTEGRATED CIRCUIT LAYOUT

    公开(公告)号:US20180004882A1

    公开(公告)日:2018-01-04

    申请号:US15197026

    申请日:2016-06-29

    CPC classification number: H01L27/0207 G06F17/5072 H01L29/6681 H01L29/7851

    Abstract: In a method of forming an integrated circuit (IC) layout, an empty region in the IC layout is identified by a processor circuit, wherein the empty region is a region of the IC layout not including any active fins. A first portion of the empty region is filled with a first plurality of dummy fin cells, wherein each of the first plurality of dummy fin cells is based on a first standard dummy fin cell, and wherein the first standard dummy fin cell has a first gate width and comprises a first plurality of partitions. A second portion of the empty region is filled with a second plurality of dummy fin cells, wherein each of the second plurality of dummy fin cells is based on a second standard dummy fin cell, and wherein the second standard dummy fin cell has a second gate width and comprises a second plurality of partitions.

    METAL GATE STRUCTURE AND METHODS THEREOF
    3.
    发明申请

    公开(公告)号:US20180331199A1

    公开(公告)日:2018-11-15

    申请号:US16044227

    申请日:2018-07-24

    Abstract: Provided is a metal gate structure and related methods that include forming a first fin and a second fin on a substrate. In various embodiments, the first fin has a first gate region and the second fin has a second gate region. By way of example, a metal-gate line is formed over the first and second gate regions. In some embodiments, the metal-gate line extends from the first fin to the second fin, and the metal-gate line includes a sacrificial metal portion. In various examples, a line-cut process is performed to separate the metal-gate line into a first metal gate line and a second gate line. In some embodiments, the sacrificial metal portion prevents lateral etching of a dielectric layer during the line-cut process.

    DUMMY FIN CELL PLACEMENT IN AN INTEGRATED CIRCUIT LAYOUT

    公开(公告)号:US20180137232A1

    公开(公告)日:2018-05-17

    申请号:US15854358

    申请日:2017-12-26

    CPC classification number: H01L27/0207 G06F17/5072 H01L29/6681 H01L29/7851

    Abstract: In a method of forming an integrated circuit (IC) layout, an empty region in the IC layout is identified by a processor circuit, wherein the empty region is a region of the IC layout not including any active fins. A first portion of the empty region is filled with a first plurality of dummy fin cells, wherein each of the first plurality of dummy fin cells is based on a first standard dummy fin cell, and wherein the first standard dummy fin cell has a first gate width and comprises a first plurality of partitions. A second portion of the empty region is filled with a second plurality of dummy fin cells, wherein each of the second plurality of dummy fin cells is based on a second standard dummy fin cell, and wherein the second standard dummy fin cell has a second gate width and comprises a second plurality of partitions.

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