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公开(公告)号：US20240105530A1
公开(公告)日：2024-03-28
申请号：US18151040
申请日：2023-01-06
发明人： Wensen Hung , Tsung-Yu Chen
CPC分类号： H01L23/10 , H01L23/36 , H01L23/42 , H01L23/562 , H01L24/29 , H01L24/32 , H01L25/18 , H01L25/50 , H01L24/13 , H01L24/16 , H01L24/73 , H01L2224/13111 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/16225 , H01L2224/29147 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204
摘要： In an embodiment, a device includes: an integrated circuit package including: a package component; and a package stiffener attached to the package component; and a heat spreader attached to the integrated circuit package, a main portion of the heat spreader disposed above the package stiffener, a protruding portion of the heat spreader extending through the package stiffener; an elastic adhesive material between the main portion of the heat spreader and the package stiffener; and a thermal interface material between the protruding portion of the heat spreader and the package component, the thermal interface material different from the elastic adhesive material.
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公开(公告)号：US20240038627A1
公开(公告)日：2024-02-01
申请号：US18150853
申请日：2023-01-06
发明人： Wensen Hung , Tsung-Yu Chen
CPC分类号： H01L23/42 , H01L21/4875 , H01L25/16 , H01L23/3107 , H01L23/49816 , H01L21/565 , H01L23/49827 , H01L24/27 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/83 , H01L24/29 , H01L2224/26145 , H01L2224/2731 , H01L2224/32225 , H01L2224/32245 , H01L2224/33051 , H01L2224/83097 , H01L2224/83203 , H01L2924/1616 , H01L2924/16235 , H01L2924/16251 , H01L2924/165 , H01L2224/29113 , H01L2224/29105
摘要： A method includes attaching a permeable plate to a metal lid, with the permeable plate including a metallic material, and dispensing a liquid-metal-comprising media to a first package component. The first package component is over and bonded to a second package component. The liquid-metal-comprising media includes a liquid metal therein. The method further includes attaching the metal lid to the second package component. During the attaching, the liquid-metal-comprising media migrates into the permeable plate to form a composite thermal interface material.
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公开(公告)号：US11699674B2
公开(公告)日：2023-07-11
申请号：US17409007
申请日：2021-08-23
发明人： Kuan-Yu Huang , Li-Chung Kuo , Sung-Hui Huang , Shang-Yun Hou , Tsung-Yu Chen , Chien-Yuan Huang
IPC分类号： H01L23/00 , H01L25/065 , H01L23/32 , H01L21/60
CPC分类号： H01L24/27 , H01L23/32 , H01L24/94 , H01L24/95 , H01L25/0657 , H01L2021/60097
摘要： A method of forming a semiconductor device includes applying an adhesive material in a first region of an upper surface of a substrate, where applying the adhesive material includes: applying a first adhesive material at first locations of the first region; and applying a second adhesive material at second locations of the first region, the second adhesive material having a different material composition from the first adhesive material. The method further includes attaching a ring to the upper surface of the substrate using the adhesive material applied on the upper surface of the substrate, where the adhesive material is between the ring and the substrate after the ring is attached.
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公开(公告)号：US11302600B2
公开(公告)日：2022-04-12
申请号：US16718211
申请日：2019-12-18
发明人： Wensen Hung , Ping-Kang Huang , Sao-Ling Chiu , Tsung-Shu Lin , Tsung-Yu Chen , Chien-Yuan Huang , Chen-Hsiang Lao
IPC分类号： H01L23/367 , H01L21/48 , H01L25/065 , H01L25/00 , H01L23/42
摘要： A semiconductor device includes a circuit substrate, a semiconductor package, and a metallic cover. The semiconductor package is disposed on the circuit substrate. The metallic cover is disposed over the semiconductor package and over the circuit substrate. The metallic cover comprises a lid and outer flanges. The lid overlies the semiconductor package. The outer flanges are disposed at edges of the lid, are connected with the lid, extend from the lid towards the circuit substrate, and face side surfaces of the semiconductor package. The lid has a first region that is located over the semiconductor package and is thicker than a second region that is located outside a footprint of the semiconductor package.
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公开(公告)号：US20230369162A1
公开(公告)日：2023-11-16
申请号：US18361332
申请日：2023-07-28
发明人： Wensen Hung , Tsung-Yu Chen , Tsung-Shu Lin , Chen-Hsiang Lao , Wen-Hsin Wei , Hsien-Pin Hu
IPC分类号： H01L23/367 , H01L21/48 , H01L21/56 , H01L23/31 , H01L23/498 , H01L23/00 , H01L25/065 , H01L21/67 , H01L23/40
CPC分类号： H01L23/3675 , H01L21/4882 , H01L21/4878 , H01L21/4853 , H01L21/486 , H01L21/563 , H01L23/3185 , H01L23/49827 , H01L23/562 , H01L24/16 , H01L25/0655 , H01L21/67092 , H01L23/40 , H01L2224/16225
摘要： An apparatus for manufacturing packaged semiconductor devices includes a lower plate having package platforms and clamp guide pins to align an upper plate with the lower plate, and a boat tray having windows configured to receive package devices, and a plurality of upper plates configured to be aligned to respective windows and respective package platforms. Clamping force can be applied by fasteners configured to generate a downward force upon the upper plate. Package devices on the platforms are thus subjected to a clamping force. Load cells measure the clamping force so adjustments can be made.
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公开(公告)号：US20230144244A1
公开(公告)日：2023-05-11
申请号：US18153532
申请日：2023-01-12
发明人： Shih-Chang Ku , Hung-Chi Li , Tsung-Shu Lin , Tsung-Yu Chen , Wensen Hung
IPC分类号： H01L23/427 , H01L21/48 , H01L25/00 , H01L25/065
CPC分类号： H01L23/427 , H01L21/4882 , H01L25/50 , H01L25/0655
摘要： A semiconductor device includes a vapor chamber lid for high power applications such as chip-on-wafer-on-substrate (CoWoS) applications using high performance processors (e.g., graphics processing unit (GPU)) and methods of manufacturing the same. The vapor chamber lid provides a thermal solution which enhances the thermal performance of a package with multiple chips. The vapor chamber lid improves hot spot dissipation in high performance chips, for example, at the three-dimensional (3D-IC) packaging level.
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公开(公告)号：US20210384154A1
公开(公告)日：2021-12-09
申请号：US17409007
申请日：2021-08-23
发明人： Kuan-Yu Huang , Li-Chung Kuo , Sung-Hui Huang , Shang-Yun Hou , Tsung-Yu Chen , Chien-Yuan Huang
IPC分类号： H01L23/00 , H01L25/065 , H01L23/32
摘要： A method of forming a semiconductor device includes applying an adhesive material in a first region of an upper surface of a substrate, where applying the adhesive material includes: applying a first adhesive material at first locations of the first region; and applying a second adhesive material at second locations of the first region, the second adhesive material having a different material composition from the first adhesive material. The method further includes attaching a ring to the upper surface of the substrate using the adhesive material applied on the upper surface of the substrate, where the adhesive material is between the ring and the substrate after the ring is attached.
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公开(公告)号：US20210343619A1
公开(公告)日：2021-11-04
申请号：US17373250
申请日：2021-07-12
发明人： Wensen Hung , Tsung-Yu Chen , Tsung-Shu Lin , Chen-Hsiang Lao , Wen-Hsin Wei , Hsien-Pin Hu
IPC分类号： H01L23/367 , H01L21/48 , H01L25/065 , H01L21/56 , H01L21/67 , H01L23/00 , H01L23/40 , H01L23/31 , H01L23/498
摘要： A packaged semiconductor device and a method and apparatus for forming the same are disclosed. In an embodiment, a method includes bonding a device die to a first surface of a substrate; depositing an adhesive on the first surface of the substrate; depositing a thermal interface material on a surface of the device die opposite the substrate; placing a lid over the device die and the substrate, the lid contacting the adhesive and the thermal interface material; applying a clamping force to the lid and the substrate; and while applying the clamping force, curing the adhesive and the thermal interface material.
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公开(公告)号：US20210233833A1
公开(公告)日：2021-07-29
申请号：US17228018
申请日：2021-04-12
发明人： Shih-Chang Ku , Hung-Chi Li , Tsung-Shu Lin , Tsung-Yu Chen , Wensen Hung
IPC分类号： H01L23/427 , H01L21/48 , H01L25/00 , H01L25/065
摘要： A semiconductor device includes a vapor chamber lid for high power applications such as chip-on-wafer-on-substrate (CoWoS) applications using high performance processors (e.g., graphics processing unit (GPU)) and methods of manufacturing the same. The vapor chamber lid provides a thermal solution which enhances the thermal performance of a package with multiple chips. The vapor chamber lid improves hot spot dissipation in high performance chips, for example, at the three-dimensional (3D-IC) packaging level.
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公开(公告)号：US20160370705A1
公开(公告)日：2016-12-22
申请号：US15249989
申请日：2016-08-29
发明人： Shang-Chieh Chien , Shu-Hao Chang , Jui-Ching Wu , Tsung-Yu Chen , Tzu-Hsiang Chen , Ming-Chin Chien , Chia-Chen Chen , Jeng-Horng Chen
CPC分类号： G03F7/7015 , G02B5/0891 , G02B7/1821 , G03F7/2008 , G03F7/2037 , G03F7/70033 , G03F7/70175 , G03F7/70916 , G03F7/70925 , G21K1/067
摘要： An EUV collector is rotated between or during operations of an EUV photolithography system. Rotating the EUV collector causes contamination to distribute more evenly over the collector's surface. This reduces the rate at which the EUV photolithography system loses image fidelity with increasing contamination and thereby increases the collector lifetime. Rotating the collector during operation of the EUV photolithography system can induce convection and reduce the contamination rate. By rotating the collector at sufficient speed, some contaminating debris can be removed through the action of centrifugal force.
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