公开(公告)号：US20240105530A1

公开(公告)日：2024-03-28

申请号：US18151040

申请日：2023-01-06

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wensen Hung ,  Tsung-Yu Chen

IPC: H01L23/10 ,  H01L23/00 ,  H01L23/36 ,  H01L23/42 ,  H01L25/00 ,  H01L25/18

CPC classification number: H01L23/10 ,  H01L23/36 ,  H01L23/42 ,  H01L23/562 ,  H01L24/29 ,  H01L24/32 ,  H01L25/18 ,  H01L25/50 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16225 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204

Abstract: In an embodiment, a device includes: an integrated circuit package including: a package component; and a package stiffener attached to the package component; and a heat spreader attached to the integrated circuit package, a main portion of the heat spreader disposed above the package stiffener, a protruding portion of the heat spreader extending through the package stiffener; an elastic adhesive material between the main portion of the heat spreader and the package stiffener; and a thermal interface material between the protruding portion of the heat spreader and the package component, the thermal interface material different from the elastic adhesive material.

公开(公告)号：US20240038627A1

公开(公告)日：2024-02-01

申请号：US18150853

申请日：2023-01-06

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wensen Hung ,  Tsung-Yu Chen

IPC: H01L23/42 ,  H01L21/48 ,  H01L25/16 ,  H01L23/31 ,  H01L23/498 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/42 ,  H01L21/4875 ,  H01L25/16 ,  H01L23/3107 ,  H01L23/49816 ,  H01L21/565 ,  H01L23/49827 ,  H01L24/27 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/83 ,  H01L24/29 ,  H01L2224/26145 ,  H01L2224/2731 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33051 ,  H01L2224/83097 ,  H01L2224/83203 ,  H01L2924/1616 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/165 ,  H01L2224/29113 ,  H01L2224/29105

Abstract: A method includes attaching a permeable plate to a metal lid, with the permeable plate including a metallic material, and dispensing a liquid-metal-comprising media to a first package component. The first package component is over and bonded to a second package component. The liquid-metal-comprising media includes a liquid metal therein. The method further includes attaching the metal lid to the second package component. During the attaching, the liquid-metal-comprising media migrates into the permeable plate to form a composite thermal interface material.

公开(公告)号：US11699674B2

公开(公告)日：2023-07-11

申请号：US17409007

申请日：2021-08-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Kuan-Yu Huang ,  Li-Chung Kuo ,  Sung-Hui Huang ,  Shang-Yun Hou ,  Tsung-Yu Chen ,  Chien-Yuan Huang

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/32 ,  H01L21/60

CPC classification number: H01L24/27 ,  H01L23/32 ,  H01L24/94 ,  H01L24/95 ,  H01L25/0657 ,  H01L2021/60097

Abstract: A method of forming a semiconductor device includes applying an adhesive material in a first region of an upper surface of a substrate, where applying the adhesive material includes: applying a first adhesive material at first locations of the first region; and applying a second adhesive material at second locations of the first region, the second adhesive material having a different material composition from the first adhesive material. The method further includes attaching a ring to the upper surface of the substrate using the adhesive material applied on the upper surface of the substrate, where the adhesive material is between the ring and the substrate after the ring is attached.

公开(公告)号：US11302600B2

公开(公告)日：2022-04-12

申请号：US16718211

申请日：2019-12-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wensen Hung ,  Ping-Kang Huang ,  Sao-Ling Chiu ,  Tsung-Shu Lin ,  Tsung-Yu Chen ,  Chien-Yuan Huang ,  Chen-Hsiang Lao

IPC: H01L23/367 ,  H01L21/48 ,  H01L25/065 ,  H01L25/00 ,  H01L23/42

Abstract: A semiconductor device includes a circuit substrate, a semiconductor package, and a metallic cover. The semiconductor package is disposed on the circuit substrate. The metallic cover is disposed over the semiconductor package and over the circuit substrate. The metallic cover comprises a lid and outer flanges. The lid overlies the semiconductor package. The outer flanges are disposed at edges of the lid, are connected with the lid, extend from the lid towards the circuit substrate, and face side surfaces of the semiconductor package. The lid has a first region that is located over the semiconductor package and is thicker than a second region that is located outside a footprint of the semiconductor package.

公开(公告)号：US20250118608A1

公开(公告)日：2025-04-10

申请号：US18482954

申请日：2023-10-09

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wensen Hung ,  Yen-Fu Su ,  Tsung-Yu Chen

IPC: H01L23/18 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor package and the method of forming the same are provided. The semiconductor package may include a substrate, an integrated circuit package component having a semiconductor die bonded to the substrate, and a ring structure on the substrate, wherein the ring structure may encircle the integrated circuit package component in a top-down view. The ring structure may comprise a first attached segment, a second attached segment attached to the substrate by an adhesive, and a first suspended segment between the first attached segment and the second attached segment. The first suspended segment may be suspended over the substrate. The first attached segment and the second attached segment may be spaced apart from the package component by a first distance and a second distance, respectively. The first suspended segment may be spaced apart from the package component by a third distance different from the first distance and the second distance.

公开(公告)号：US20230369162A1

公开(公告)日：2023-11-16

申请号：US18361332

申请日：2023-07-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wensen Hung ,  Tsung-Yu Chen ,  Tsung-Shu Lin ,  Chen-Hsiang Lao ,  Wen-Hsin Wei ,  Hsien-Pin Hu

IPC: H01L23/367 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L21/67 ,  H01L23/40

CPC classification number: H01L23/3675 ,  H01L21/4882 ,  H01L21/4878 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/563 ,  H01L23/3185 ,  H01L23/49827 ,  H01L23/562 ,  H01L24/16 ,  H01L25/0655 ,  H01L21/67092 ,  H01L23/40 ,  H01L2224/16225

Abstract: An apparatus for manufacturing packaged semiconductor devices includes a lower plate having package platforms and clamp guide pins to align an upper plate with the lower plate, and a boat tray having windows configured to receive package devices, and a plurality of upper plates configured to be aligned to respective windows and respective package platforms. Clamping force can be applied by fasteners configured to generate a downward force upon the upper plate. Package devices on the platforms are thus subjected to a clamping force. Load cells measure the clamping force so adjustments can be made.

公开(公告)号：US20230144244A1

公开(公告)日：2023-05-11

申请号：US18153532

申请日：2023-01-12

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih-Chang Ku ,  Hung-Chi Li ,  Tsung-Shu Lin ,  Tsung-Yu Chen ,  Wensen Hung

IPC: H01L23/427 ,  H01L21/48 ,  H01L25/00 ,  H01L25/065

CPC classification number: H01L23/427 ,  H01L21/4882 ,  H01L25/50 ,  H01L25/0655

Abstract: A semiconductor device includes a vapor chamber lid for high power applications such as chip-on-wafer-on-substrate (CoWoS) applications using high performance processors (e.g., graphics processing unit (GPU)) and methods of manufacturing the same. The vapor chamber lid provides a thermal solution which enhances the thermal performance of a package with multiple chips. The vapor chamber lid improves hot spot dissipation in high performance chips, for example, at the three-dimensional (3D-IC) packaging level.

公开(公告)号：US20210384154A1

公开(公告)日：2021-12-09

申请号：US17409007

申请日：2021-08-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Kuan-Yu Huang ,  Li-Chung Kuo ,  Sung-Hui Huang ,  Shang-Yun Hou ,  Tsung-Yu Chen ,  Chien-Yuan Huang

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/32

Abstract: A method of forming a semiconductor device includes applying an adhesive material in a first region of an upper surface of a substrate, where applying the adhesive material includes: applying a first adhesive material at first locations of the first region; and applying a second adhesive material at second locations of the first region, the second adhesive material having a different material composition from the first adhesive material. The method further includes attaching a ring to the upper surface of the substrate using the adhesive material applied on the upper surface of the substrate, where the adhesive material is between the ring and the substrate after the ring is attached.

公开(公告)号：US20210343619A1

公开(公告)日：2021-11-04

申请号：US17373250

申请日：2021-07-12

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wensen Hung ,  Tsung-Yu Chen ,  Tsung-Shu Lin ,  Chen-Hsiang Lao ,  Wen-Hsin Wei ,  Hsien-Pin Hu

IPC: H01L23/367 ,  H01L21/48 ,  H01L25/065 ,  H01L21/56 ,  H01L21/67 ,  H01L23/00 ,  H01L23/40 ,  H01L23/31 ,  H01L23/498

Abstract: A packaged semiconductor device and a method and apparatus for forming the same are disclosed. In an embodiment, a method includes bonding a device die to a first surface of a substrate; depositing an adhesive on the first surface of the substrate; depositing a thermal interface material on a surface of the device die opposite the substrate; placing a lid over the device die and the substrate, the lid contacting the adhesive and the thermal interface material; applying a clamping force to the lid and the substrate; and while applying the clamping force, curing the adhesive and the thermal interface material.

公开(公告)号：US20210233833A1

公开(公告)日：2021-07-29

申请号：US17228018

申请日：2021-04-12

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih-Chang Ku ,  Hung-Chi Li ,  Tsung-Shu Lin ,  Tsung-Yu Chen ,  Wensen Hung

IPC: H01L23/427 ,  H01L21/48 ,  H01L25/00 ,  H01L25/065

Abstract: A semiconductor device includes a vapor chamber lid for high power applications such as chip-on-wafer-on-substrate (CoWoS) applications using high performance processors (e.g., graphics processing unit (GPU)) and methods of manufacturing the same. The vapor chamber lid provides a thermal solution which enhances the thermal performance of a package with multiple chips. The vapor chamber lid improves hot spot dissipation in high performance chips, for example, at the three-dimensional (3D-IC) packaging level.