公开(公告)号：US20240363312A1

公开(公告)日：2024-10-31

申请号：US18768190

申请日：2024-07-10

Applicant: Taiwan Semiconductor Manufacturing Company, LTD.

Inventor： Cheng Kuang Tso ,  Chou-Feng Lee ,  Chih-Hsien Hsu ,  Chung-Hsiu Cheng ,  Jr-Sheng Chen

IPC: H01J37/32 ,  H01L21/3065

CPC classification number: H01J37/32449 ,  H01J37/32522 ,  H01L21/3065 ,  H01J2237/334

Abstract: Methods and systems for uniformly cooling a dome within a plasma treatment system are disclosed. The methods and systems utilize a diffuser including a perforated plate and a cone. The perforated plate includes a center portion and multiple arrays of holes with each array being located circumferentially at a different distance from the center. The cone extends away from the center. The diffuser spreads cooling gas more uniformly across the surface of the dome.

公开(公告)号：US12062523B2

公开(公告)日：2024-08-13

申请号：US17670670

申请日：2022-02-14

Applicant: Taiwan Semiconductor Manufacturing Company

Inventor： Cheng Kuang Tso ,  Chou-Feng Lee ,  Chih-Hsien Hsu ,  Chung-Hsiu Cheng ,  Jr-Sheng Chen

IPC: H01J37/32 ,  H01L21/3065

CPC classification number: H01J37/32449 ,  H01J37/32522 ,  H01L21/3065 ,  H01J2237/334

Abstract: Methods and systems for uniformly cooling a dome within a plasma treatment system are disclosed. The methods and systems utilize a diffuser including a perforated plate and a cone. The perforated plate includes a center portion and multiple arrays of holes with each array being located circumferentially at a different distance from the center. The cone extends away from the center. The diffuser spreads cooling gas more uniformly across the surface of the dome.

公开(公告)号：US20240071803A1

公开(公告)日：2024-02-29

申请号：US17899821

申请日：2022-08-31

Applicant: Taiwan Semiconductor Manufacturing Company

Inventor： Fu-Yi Liu ,  Chou-Feng Lee ,  Chih-Hsien Hsu

IPC: H01L21/687 ,  H01J37/32 ,  H01L21/311 ,  H01L21/3213

CPC classification number: H01L21/68721 ,  H01J37/32642 ,  H01J37/32724 ,  H01L21/31116 ,  H01L21/31144 ,  H01L21/32136 ,  H01L21/32139 ,  H01L21/6875 ,  H01L21/68757 ,  H01J2237/3341 ,  H01J2237/3345

Abstract: Methods and systems for dry etching are disclosed. The system includes a wafer clamp ring having a central opening through which a substrate may be treated and a plurality of smaller, outer support holes for receiving pins from plunger assemblies. The outer support holes are tapered and change in diameter. The tapered shape reduces horizontal shifting of the wafer clamp ring which can occur as the wafer clamp ring is moved up-and-down during operational use. The reduced shifting increases wafer yield along the edges of the wafer.

公开(公告)号：US20230260758A1

公开(公告)日：2023-08-17

申请号：US17670670

申请日：2022-02-14

Applicant: Taiwan Semiconductor Manufacturing Company

Inventor： Cheng Kuang Tso ,  Chou-Feng Lee ,  Chih-Hsien Hsu ,  Chung-Hsiu Cheng ,  Jr-Sheng Chen

IPC: H01J37/32 ,  H01L21/3065

CPC classification number: H01J37/32449 ,  H01L21/3065 ,  H01J37/32522 ,  H01J2237/334

Abstract: Methods and systems for uniformly cooling a dome within a plasma treatment system are disclosed. The methods and systems utilize a diffuser including a perforated plate and a cone. The perforated plate includes a center portion and multiple arrays of holes with each array being located circumferentially at a different distance from the center. The cone extends away from the center. The diffuser spreads cooling gas more uniformly across the surface of the dome.