Transistor cells for longer channel transistors

    公开(公告)号:US12132081B2

    公开(公告)日:2024-10-29

    申请号:US17545825

    申请日:2021-12-08

    摘要: A device including at least one transistor cell including metal-oxide semiconductor field-effect transistors each having drain/source terminals and a channel length. The at least one transistor cell includes a first number of transistors of the metal-oxide semiconductor field-effect transistors connected in series, with one of the drain/source terminals of one of the first number of transistors connected to one of the drain/source terminals of another one of the first number of transistors and gates of the first number of transistors connected together. The at least one transistor cell configured to be used to provide a transistor having a longer channel length than the channel length of each of the metal-oxide semiconductor field-effect transistors.

    Voltage amplifier based on cascaded charge pump boosting

    公开(公告)号:US12088264B2

    公开(公告)日:2024-09-10

    申请号:US18446031

    申请日:2023-08-08

    IPC分类号: H03F3/45 G11C7/12 H03M1/38

    摘要: A method of amplifying an input voltage based on cascaded charge pump includes generating, at a set of capacitors, an input voltage corresponding to input data. The method further includes storing, by a first capacitor, first electrical charges corresponding to the input voltage to obtain a second voltage. The method further includes amplifying, a voltage amplifier, the second voltage according to the first electrical charges stored by the first capacitor to obtain a third voltage. The method further includes storing, by a second capacitor, second electrical charges according to the third voltage. The method further includes amplifying, by the voltage amplifier, the third voltage according to the second electrical charges stored by the second capacitor to obtain a fourth voltage.

    Device and method for reading data in memory

    公开(公告)号:US11430491B2

    公开(公告)日:2022-08-30

    申请号:US17185145

    申请日:2021-02-25

    摘要: In a compute-in-memory (“CIM”) system, current signals, indicative of the result of a multiply-and-accumulate operation, from a CIM memory circuit are computed by comparing them with reference currents, which are generated by a current digital-to-analog converter (“DAC”) circuit. The memory circuit can include non-volatile memory (“NVM”) elements, which can be multi-level or two-level NVM elements. The characteristic sizes of the memory elements can be binary weighted to correspond to the respective place values in a multi-bit weight and/or a multi-bit input signal. Alternatively, NVM elements of equal size can be used to drive transistors of binary weighted sizes. The current comparison operation can be carried out at higher speeds than voltage computation. In some embodiments, simple clock-gated switches are used to produce even currents in the current summing branches. The clock-gated switches also serve to limit the time the cell currents are on, thereby reducing static power consumption.

    DAC/ADC ARCHITECTURE FOR AI IN MEMORY
    4.
    发明申请

    公开(公告)号:US20200381027A1

    公开(公告)日:2020-12-03

    申请号:US16881380

    申请日:2020-05-22

    IPC分类号: G11C7/16 G11C13/00 G11C7/06

    摘要: A computing device in some examples includes multiple digital-to-analog converters (DACs) having outputs connected to respective operational amplifiers, with outputs connected to the gates of respective transistors, each forming a serial combination with a respective memory element. The serial combinations are connected between a voltage reference point and a conductive line. An analog-to-digital converter is connected to the conductive line at the input. The DACs generate analog signals having ON-periods of lengths corresponding to the respective numbers at the DACs' inputs. The transistors generate currents indicative of the level of output signals of the respective DACs and memory states of the respective memory elements for the ON-periods. The combined currents charges or discharges the conductive line, which has a parasitic capacitance, to a voltage, which is indicative of the sum of the numbers weighted by the memory states. The voltage is converted to a digital representation of the weighted sum.

    Bandgap reference circuit
    5.
    发明授权

    公开(公告)号:US11614764B2

    公开(公告)日:2023-03-28

    申请号:US17396981

    申请日:2021-08-09

    IPC分类号: G05F3/26 G05F3/30

    摘要: A bandgap reference (BGR) circuit is provided. The BGR circuit includes a first node, a second node, and a third node. A first resistive element is connected between the second node and the third node. The BGR circuit is operative to provide a reference voltage as an output. The BGR circuit further includes a current shunt path connected between the first node and the third node, the current shunt path being operable to regulate a voltage drop across the first resistive element.

    Semiconductor Device and Method of Monitoring a Temperature Thereof

    公开(公告)号:US20240364315A1

    公开(公告)日:2024-10-31

    申请号:US18770826

    申请日:2024-07-12

    IPC分类号: H03K3/011 H03F3/45

    CPC分类号: H03K3/011 H03F3/45475

    摘要: A semiconductor device includes a temperature-independent current generator that generates a reference current substantially independent of temperature and a mirror current that is a substantial duplicate of the reference current, a pulse signal generator that samples the mirror current so as to generate a pulse signal, and a counter that obtains a number of pulse signals generated by the pulse signal generator, that permits the pulse signal generator to generate a pulse signal when it is determined thereby that the number of pulse signals obtained thereby is less than a predetermined threshold value, and that inhibits the pulse signal generator from generating a pulse signal when it is determined thereby that the number of pulse signals obtained thereby is equal to the predetermined threshold value. A method for monitoring a temperature of the semiconductor device is also disclosed.

    Semiconductor Device and Method of Monitoring a Temperature Thereof

    公开(公告)号:US20230049398A1

    公开(公告)日:2023-02-16

    申请号:US17718456

    申请日:2022-04-12

    IPC分类号: H03K3/011 H03F3/45

    摘要: A semiconductor device includes a temperature-independent current generator that generates a reference current substantially independent of temperature and a mirror current that is a substantial duplicate of the reference current, a pulse signal generator that samples the mirror current so as to generate a pulse signal, and a counter that obtains a number of pulse signals generated by the pulse signal generator, that permits the pulse signal generator to generate a pulse signal when it is determined thereby that the number of pulse signals obtained thereby is less than a predetermined threshold value, and that inhibits the pulse signal generator from generating a pulse signal when it is determined thereby that the number of pulse signals obtained thereby is equal to the predetermined threshold value. A method for monitoring a temperature of the semiconductor device is also disclosed.

    Bandgap reference circuit
    8.
    发明授权

    公开(公告)号:US11086348B2

    公开(公告)日:2021-08-10

    申请号:US16682683

    申请日:2019-11-13

    IPC分类号: G05F3/26 G05F3/30

    摘要: A bandgap reference (BGR) circuit is provided. The BGR circuit includes a first node, a second node, and a third node. A first resistive element is connected between the second node and the third node. The BGR circuit is operative to provide a reference voltage as an output. The BGR circuit further includes a current shunt path connected between the first node and the third node, the current shunt path being operable to regulate a voltage drop across the first resistive element.

    Bandgap reference circuit
    9.
    发明授权

    公开(公告)号:US10520972B2

    公开(公告)日:2019-12-31

    申请号:US16195176

    申请日:2018-11-19

    IPC分类号: H02M3/26 G05F3/26

    摘要: A bandgap reference (BGR) circuit is provided. The BGR circuit includes a first node, a second node, and a third node. A first resistive element is connected between the second node and the third node. The BGR circuit is operative to provide a reference voltage as an output. The BGR circuit further includes a current shunt path connected between the first node and the third node, the current shunt path being operable to regulate a voltage drop across the first resistive element.

    DEVICE AND METHOD FOR READING DATA IN MEMORY

    公开(公告)号:US20210343320A1

    公开(公告)日:2021-11-04

    申请号:US17185145

    申请日:2021-02-25

    摘要: In a compute-in-memory (“CIM”) system, current signals, indicative of the result of a multiply-and-accumulate operation, from a CIM memory circuit are computed by comparing them with reference currents, which are generated by a current digital-to-analog converter (“DAC”) circuit. The memory circuit can include non-volatile memory (“NVM”) elements, which can be multi-level or two-level NVM elements. The characteristic sizes of the memory elements can be binary weighted to correspond to the respective place values in a multi-bit weight and/or a multi-bit input signal. Alternatively, NVM elements of equal size can be used to drive transistors of binary weighted sizes. The current comparison operation can be carried out at higher speeds than voltage computation. In some embodiments, simple clock-gated switches are used to produce even currents in the current summing branches. The clock-gated switches also serve to limit the time the cell currents are on, thereby reducing static power consumption.