-
公开(公告)号：US11827970B2
公开(公告)日：2023-11-28
申请号：US17662107
申请日：2022-05-05
Inventor： Yi-Lin Wang , Chin-Szu Lee , Hua-Sheng Chiu , Yi-Chao Chang , Zih-Shou Mue
CPC classification number: C23C14/34 , B08B7/0035 , B08B17/04 , C23C14/50 , H01J37/32724 , H01J37/32853 , H01J37/32082 , H01J2237/332
Abstract: Some implementations described herein provide a shutter disc for use during a conditioning process within a processing chamber of a deposition tool. The shutter disc described herein includes a material having a wave-shaped section to reduce heat transfer to the shutter disc and to provide relief from thermal stresses. Furthermore, the shutter disc includes a deposition of a thin-film material on a backside of the shutter disc, where a diameter of the shutter disc causes a spacing between an inner edge of the thin-film material and an outer edge of a substrate support component. The spacing prevents an accumulation of material between the thin film material and the substrate support component, reduces tilting of the shutter disc due to a placement error, and reduces heat transfer to the shutter disc.
-
公开(公告)号：US20200075299A1
公开(公告)日：2020-03-05
申请号：US16528781
申请日：2019-08-01
Inventor： Jung-Tang Wu , Szu-Hua Wu , Chin-Szu Lee , Yi-Lin Wang
IPC: H01J37/34 , H01L43/12 , H01L21/285 , C23C14/34
Abstract: A method includes placing a wafer on a wafer holder, depositing a film on a front surface of the wafer, and blowing a gas through ports in a redistributor onto a back surface of the wafer at a same time the deposition is performed. The gas is selected from a group consisting of nitrogen (N2), He, Ne, and combinations thereof.
-
Patent Agency Ranking
公开(公告)号：US20200149886A1
公开(公告)日：2020-05-14
申请号：US16740897
申请日：2020-01-13
Inventor： Yi-Lin Wang , Jung-Tang Wu , Chin-Szu Lee , Hua-Sheng Chiu
IPC: G01C9/06 , H01L21/67 , G08B21/18 , G01H1/00 , H01L21/677
Abstract: A leveling sensor, a load port including a leveling sensor, and a method of leveling a load port using a load port are disclosed. In an embodiment, a sensor includes an accelerometer configured to detect leveling and vibration of a load port and produce a plurality of data; a plurality of indicator lights configured to display a level measurement and a level direction based on the leveling of the load port; a processor configured to process the data produced by the accelerometer; and a wired connection configured to connect the processor to an external device.
-
公开(公告)号：US10533852B1
公开(公告)日：2020-01-14
申请号：US16275994
申请日：2019-02-14
Inventor： Yi-Lin Wang , Jung-Tang Wu , Chin-Szu Lee , Hua-Sheng Chiu
IPC: G01C9/06 , H01L21/67 , H01L21/677 , G01H1/00 , G08B21/18
Abstract: A leveling sensor, a load port including a leveling sensor, and a method of leveling a load port using a load port are disclosed. In an embodiment, a sensor includes an accelerometer configured to detect leveling and vibration of a load port and produce a plurality of data; a plurality of indicator lights configured to display a level measurement and a level direction based on the leveling of the load port; a processor configured to process the data produced by the accelerometer; and a wired connection configured to connect the processor to an external device.
-
公开(公告)号：US12112930B2
公开(公告)日：2024-10-08
申请号：US16528781
申请日：2019-08-01
Inventor： Jung-Tang Wu , Szu-Hua Wu , Chin-Szu Lee , Yi-Lin Wang
CPC classification number: H01J37/3476 , C23C14/165 , C23C14/34 , C23C14/3457 , H01J37/3244 , H01J37/3426 , H01L21/2855 , H10N50/01 , H01J2237/327
Abstract: A method includes placing a wafer on a wafer holder, depositing a film on a front surface of the wafer, and blowing a gas through ports in a redistributor onto a back surface of the wafer at a same time the deposition is performed. The gas is selected from a group consisting of nitrogen (N2), He, Ne, and combinations thereof.
-
公开(公告)号：US12215414B2
公开(公告)日：2025-02-04
申请号：US18447543
申请日：2023-08-10
Inventor： Yi-Lin Wang , Chin-Szu Lee , Hua-Sheng Chiu , Yi-Chao Chang , Zih-Shou Mue
Abstract: Some implementations described herein provide a shutter disc for use during a conditioning process within a processing chamber of a deposition tool. The shutter disc described herein includes a material having a wave-shaped section to reduce heat transfer to the shutter disc and to provide relief from thermal stresses. Furthermore, the shutter disc includes a deposition of a thin-film material on a backside of the shutter disc, where a diameter of the shutter disc causes a spacing between an inner edge of the thin-film material and an outer edge of a substrate support component. The spacing prevents an accumulation of material between the thin film material and the substrate support component, reduces tilting of the shutter disc due to a placement error, and reduces heat transfer to the shutter disc.
-
公开(公告)号：US11022437B2
公开(公告)日：2021-06-01
申请号：US16740897
申请日：2020-01-13
Inventor： Yi-Lin Wang , Jung-Tang Wu , Chin-Szu Lee , Hua-Sheng Chiu
IPC: G01C9/06 , H01L21/67 , H01L21/677 , G08B21/18 , G01H1/00
Abstract: A leveling sensor, a load port including a leveling sensor, and a method of leveling a load port using a load port are disclosed. In an embodiment, a sensor includes an accelerometer configured to detect leveling and vibration of a load port and produce a plurality of data; a plurality of indicator lights configured to display a level measurement and a level direction based on the leveling of the load port; a processor configured to process the data produced by the accelerometer; and a wired connection configured to connect the processor to an external device.
-
-
-
-
-
-
Search Results
7
records
(took 0.095 seconds)
