公开(公告)号：US20140110153A1

公开(公告)日：2014-04-24

申请号：US13995088

申请日：2013-01-11

申请人： Takafumi Kashiwagi ,  Eri Kamada ,  Yoshiki Okushima ,  Hideki Niimi ,  Ayako Iwasawa ,  Tadashi Nakamura

发明人： Takafumi Kashiwagi ,  Eri Kamada ,  Yoshiki Okushima ,  Hideki Niimi ,  Ayako Iwasawa ,  Tadashi Nakamura

IPC分类号： H05K1/09 ,  H05K3/00 ,  H05K1/11

CPC分类号： H05K1/092 ,  B22F1/0074 ,  B23K35/262 ,  C22C1/0425 ,  C22C9/00 ,  C22C9/02 ,  C22C12/00 ,  C22C30/02 ,  C22C30/04 ,  H05K1/095 ,  H05K1/115 ,  H05K3/0094 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0272 ,  H05K2203/0425 ,  Y10T29/49155

摘要： A wiring board includes an insulating resin layer, wirings, and a via-hole conductor. The wirings are disposed through the insulating resin layer therebetween and formed of copper foils. The via-hole conductor penetrates through the insulating resin layer and electrically connects the wirings together. The via-hole conductor includes a resin portion and a metal portion containing copper, tin, and bismuth. The metal portion includes a first metal region including a link of copper particles, a second metal region including, as a main component, at least one of tin, a tin-copper alloy, and a tin-copper intermetallic compound, and a third metal region including bismuth as a main component. The copper particles partially include a plane-to-plane contact with a roughened surface of the copper foil, and the second metal region is partially formed on a surface of the link and on the roughened surface of the copper foil.

摘要翻译： 布线板包括绝缘树脂层，布线和通孔导体。 布线通过其间的绝缘树脂层布置并由铜箔形成。 通孔导体穿过绝缘树脂层并将布线电连接在一起。 通孔导体包括树脂部分和含有铜，锡和铋的金属部分。 金属部分包括包括铜颗粒的连接的第一金属区域，包括锡，锡 - 铜合金和锡 - 铜金属间化合物中的至少一种作为主要成分的第二金属区域，以及第三金属区域 区域包括铋作为主要成分。 铜颗粒部分地包括与铜箔的粗糙表面的平面接触，并且第二金属区域部分地形成在连接件的表面和铜箔的粗糙表面上。