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    ADHESIVE COMPOSITION
    1.
    发明申请
    ADHESIVE COMPOSITION 审中-公开
    粘合剂组合物

    公开(公告)号：US20120073741A1

    公开(公告)日：2012-03-29

    申请号：US13375163

    申请日：2010-05-20

    申请人： Takahiro Asai ,  Hirofumi Imai ,  Koki Tamura ,  Takahiro Yoshioka ,  Nobuyuki Matsuoka ,  Mariko Watanabe ,  Takahiko Tsukuda

    发明人： Takahiro Asai ,  Hirofumi Imai ,  Koki Tamura ,  Takahiro Yoshioka ,  Nobuyuki Matsuoka ,  Mariko Watanabe ,  Takahiko Tsukuda

    IPC分类号： B32B38/10 ,  C09J11/08 ,  C09J145/00 ,  C09J157/00 ,  C09J193/04

    CPC分类号： C09J145/00 ,  C08L91/00 ,  C08L91/06 ,  C08L93/04

    摘要： An adhesive composition for forming an adhesive layer for temporarily fixing a substrate, such as a wafer, to a support when processing the substrate, the adhesive composition including a resin (A) produced by polymerizing a monomer component containing a cycloolefin-based monomer, at least one terpene-based resin, rosin-based resin, or petroleum resin (resin B), and an organic solvent capable of dissolving the resins (A) and (B). The resin (A) has a glass transition point of 60° C. or higher, the resin (B) has a softening point of 80 to 160° C. and a molecular weight of 300 to 3000, and the blending ratio of the resin (A) to the resin (B) is (A):(B)=80:20 to 55:45 (mass ratio).

    摘要翻译： 一种粘合剂组合物，用于在加工基材时，将诸如晶片的基材临时固定到载体上的粘合剂层，所述粘合剂组合物包括通过将含有环烯烃类单体的单体组分聚合而制备的树脂（A） 至少一种萜烯系树脂，松香系树脂，石油树脂（树脂B）和能够溶解树脂（A）和（B）的有机溶剂。 树脂（A）的玻璃化转变点为60℃以上，树脂（B）的软化点为80〜160℃，分子量为300〜3000，树脂 （A）与树脂（B）的摩尔比为（A）：（B）= 80:20〜55:45（质量比）。

    Stripping method and stripping solution
    3.
    发明授权
    Stripping method and stripping solution 有权
    剥离方法和剥离溶液

    公开(公告)号：US08333869B2

    公开(公告)日：2012-12-18

    申请号：US13077481

    申请日：2011-03-31

    申请人： Koki Tamura ,  Takahiro Asai ,  Atsushi Kubo ,  Hirofumi Imai ,  Takahiro Yoshioka

    发明人： Koki Tamura ,  Takahiro Asai ,  Atsushi Kubo ,  Hirofumi Imai ,  Takahiro Yoshioka

    IPC分类号： B32B38/10

    CPC分类号： H01L21/02057 ,  C09D9/005 ,  C11D7/5027 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/68381 ,  Y10T156/1111 ,  Y10T156/1116 ,  Y10T156/19

    摘要： A method for stripping a wafer from a supporting plate to which the wafer is adhered via an adhesive agent, wherein the supporting plate has a through hole penetrating the supporting plate in a thickness direction thereof, the method including dissolving the adhesive agent with a stripping solution by contacting the stripping solution with the adhesive agent via the through hole. The adhesive agent has a hydrocarbon resin as a viscous component, and the stripping solution is a hydrocarbon-based solvent having a viscosity of 1.3 mPa·s or less and a dissolving rate of 30 nm/sec or greater to dissolve the adhesive agent.

    摘要翻译： 一种通过粘合剂从晶片附着的支撑板剥离晶片的方法，其中支撑板具有在其厚度方向上穿透支撑板的通孔，该方法包括用粘合剂溶解剥离溶液 通过通孔使剥离溶液与粘合剂接触。 粘合剂具有作为粘性成分的烃树脂，剥离液是粘度为1.3mPa·s以下，溶解速度为30nm / sec以上的烃类溶剂，以溶解粘合剂。

    Adhesive composition
    4.
    发明授权
    Adhesive composition 有权
    粘合剂组合物

    公开(公告)号：US08980997B2

    公开(公告)日：2015-03-17

    申请号：US13157568

    申请日：2011-06-10

    申请人： Koki Tamura ,  Takahiro Asai ,  Atsushi Kubo ,  Hirofumi Imai ,  Takahiro Yoshioka

    发明人： Koki Tamura ,  Takahiro Asai ,  Atsushi Kubo ,  Hirofumi Imai ,  Takahiro Yoshioka

    IPC分类号： C08G61/08 ,  C08L55/00 ,  C09J123/08

    CPC分类号： C09J123/0823

    摘要： Disclosed is an adhesive composition in which a solid component is dissolved in a solvent, the solid component being dissolved in the solvent to have a solid component content of not less than 20% by weight with respect to a total amount of the solid component and the solvent, the solid component containing resin obtained by polymerizing a monomer composition that contains a cycloolefin monomer, the solvent having no carbon-carbon double bond, and an alcohol content contained in the solvent being not more than 0.45% by weight with respect to an entire amount of the solvent.

    摘要翻译： 公开了一种粘合剂组合物，其中固体成分溶解在溶剂中，固体成分溶解在溶剂中，固体成分含量相对于固体成分的总量为20重量％以上， 溶剂中，通过使包含环烯烃单体的单体组合物，不含碳 - 碳双键的溶剂和溶剂中所含的醇含量聚合而获得的含固体成分的树脂相对于整体为不超过0.45重量％ 溶剂量。

    Sticking method and sticking apparatus
    5.
    发明授权
    Sticking method and sticking apparatus 失效
    粘贴方法和粘贴装置

    公开(公告)号：US08298365B2

    公开(公告)日：2012-10-30

    申请号：US12796872

    申请日：2010-06-09

    申请人： Hirofumi Imai ,  Koki Tamura ,  Takahiro Asai ,  Takahiro Yoshioka ,  Yoshihiro Inao

    发明人： Hirofumi Imai ,  Koki Tamura ,  Takahiro Asai ,  Takahiro Yoshioka ,  Yoshihiro Inao

    IPC分类号： B32B38/10 ,  B32B37/12

    CPC分类号： C09J5/00 ,  B32B37/12 ,  B32B2457/14 ,  H01L21/67132 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  Y10T156/1111 ,  Y10T156/16

    摘要： A sticking method for sticking a support plate onto a substrate in such a way that the support plate can be removed in quickly and easily is provided. The sticking method according to the present invention includes the step of sticking a support plate 3 onto a wafer 2 via a first adhesive layer 4 provided on the wafer 2, a separate film 5 provided on the first adhesive layer 4, and a second adhesive layer 6, provided on the separation film layer 5, which either is higher in rate of dissolution in a solution than the first adhesive layer 4 or dissolves in a solvent different from the solvent in which the first adhesive layer 4 dissolves.

    摘要翻译： 提供了一种用于将支撑板粘贴到基板上以使得能够快速且容易地移除支撑板的方式的粘贴方法。 根据本发明的粘贴方法包括通过设置在晶片2上的第一粘合层4，设置在第一粘合剂层4上的分离膜5和第二粘合剂层将支撑板3粘贴到晶片2上的步骤 6，设置在分离膜层5上，或者溶解在比第一粘合剂层4溶解的溶解速度高的溶剂中，或溶解在与第一粘合层4溶解的溶剂不同的溶剂中。

    STICKING METHOD AND STICKING APPARATUS
    8.
    发明申请
    STICKING METHOD AND STICKING APPARATUS 失效
    手提方法和手提装置

    公开(公告)号：US20100314043A1

    公开(公告)日：2010-12-16

    申请号：US12796872

    申请日：2010-06-09

    申请人： Hirofumi IMAI ,  Koki Tamura ,  Takahiro Asai ,  Takahiro Yoshioka ,  Yoshihiro Inao

    发明人： Hirofumi IMAI ,  Koki Tamura ,  Takahiro Asai ,  Takahiro Yoshioka ,  Yoshihiro Inao

    IPC分类号： B32B37/12

    CPC分类号： C09J5/00 ,  B32B37/12 ,  B32B2457/14 ,  H01L21/67132 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  Y10T156/1111 ,  Y10T156/16

    摘要： A sticking method for sticking a support plate onto a substrate in such a way that the support plate can be removed in quickly and easily is provided. The sticking method according to the present invention includes the step of sticking a support plate 3 onto a wafer 2 via a first adhesive layer 4 provided on the wafer 2, a separate film 5 provided on the first adhesive layer 4, and a second adhesive layer 6, provided on the separation film layer 5, which either is higher in rate of dissolution in a solution than the first adhesive layer 4 or dissolves in a solvent different from the solvent in which the first adhesive layer 4 dissolves.

    摘要翻译： 提供了一种用于将支撑板粘贴到基板上以使得能够快速且容易地移除支撑板的方式的粘贴方法。 根据本发明的粘贴方法包括通过设置在晶片2上的第一粘合层4，设置在第一粘合剂层4上的分离膜5和第二粘合剂层将支撑板3粘贴到晶片2上的步骤 6，设置在分离膜层5上，或者溶解在比第一粘合剂层4溶解的溶解速度高的溶剂中，或溶解在与第一粘合层4溶解的溶剂不同的溶剂中。