摘要:
The invention counterbalances the defects of optical glass and optical plastic so as to realize a high precision aspherical processing. The optical lens 1 includes a matrix 2 of optical glass and a coating of optical resin material applied to the surface of the matrix 2. A reflective wavefront of a lens plane 4 of the optical lens 1 is measured by means of a interferometer 5. The wavefront from the interferometer 5 is monitored by a computer system 7 to provide monitoring information. The lens plane 4 is irradiated or scanned with a short wavelength, ultraviolet laser beam L in accordance with the monitoring information, whereby the lens plane 4 is processed with the ultraviolet laser beam in non-contact manner into a shape to provide a most appropriate reflective wavefront.
摘要:
An IC package and LSI package having a lead frame of a copper alloy that contains 0.1 to 1% by weight of chromium, 0.01 to 0.5% by weight of zirconium and that has partial discolored regions caused by unbalanced precipitation of the zirconium distributed thereon at a rate of 2 grains/100 cm.sup.2 or less is disclosed. The lead frame is, for example, obtained from an alloy that contains 0,005% by weight of sulfur or less. The lead frame has high reliability, can be produced in high yield and has high electrical conductivity.
摘要:
A lead frame including a matrix for the lead frame formed of a copper based alloy and an oxide layer formed on the lead frame. A copper based alloy including dispersive particles of which part distributively appears on the surface is used as a matrix for the lead frame. Alternatively, a copper based alloy containing P at a content not more than 30 ppm may be used. In a case where the matrix for the lead frame is formed of a copper based alloy containing dispersive particles, since an oxide layer containing an oxide derived from the dispersive particles is formed on the matrix, a property of adhesiveness of the oxide layer is improved. Also in a case where the matrix for the lead frame is formed of a copper based alloy containing P at a specified content, an oxide layer having excellent adhesiveness can be formed. The oxide layer improves a property of adhesiveness of the sealing plastic as well as reliability on a semiconductor package.
摘要:
The present invention provides a getter material configured by a pressed powder mixture comprising Ba—Al alloy powder and Ni powder, wherein when the pressed powder mixture is heated in a vacuum atmosphere or an inert gas atmosphere, a temperature at which an exothermic reaction starts is ranging from 750° C. to 900° C. According to this getter material, since the temperature at which the pressed powder mixture starts the exothermic reaction is set within a range from 750° C. to 900° C., there can be provided a getter material and an evaporation type getter device capable of suitably controlling an evaporation amount of getter components under a stable condition, and is excellent in responsiveness because a time ranging from a starting time of heating the getter material to a starting time of evaporation of the getter components can be shortened. In addition, the metal container to be filled with the getter material is free from deformation and melting, and a heat-evaporation process time of the getter material can be shortened, so that there can be provided the evaporation type getter device excellent in responsiveness because a time required for the electron tube to attain to a predetermined vacuum degree can be also shortened.
摘要:
The present invention provides a getter material configured by a pressed powder mixture comprising Ba—Al alloy powder and Ni powder, wherein when the pressed powder mixture is heated in a vacuum atmosphere or an inert gas atmosphere, a temperature at which an exothermic reaction starts is ranging from 750° C. to 900° C. According to this getter material, since the temperature at which the pressed powder mixture starts the exothermic reaction is set within a range from 750° C. to 900° C., there can be provided a getter material and an evaporation type getter device capable of suitably controlling an evaporation amount of getter components under a stable condition, and is excellent in responsiveness because a time ranging from a starting time of heating the getter material to a starting time of evaporation of the getter components can be shortened. In addition, the metal container to be filled with the getter material is free from deformation and melting, and a heat-evaporation process time of the getter material can be shortened, so that there can be provided the evaporation type getter device excellent in responsiveness because a time required for the electron tube to attain to a predetermined vacuum degree can be also shortened.
摘要:
A lead frame comprising a copper alloy containing 0.1 to 1 % by weight of chromium, 0.01 to 0.5% by weight of zirconium and having partial discolored regions caused by unbalanced precipitation of the zirconium distributed thereon at a rate of 2 grains/100 cm.sup.2 or less. The lead frame is, for example, obtained by an alloy containing 0.005% by weight of sulphur or less. The lead frame has an high reliability, high yield of production and high electrical conductivity.
摘要:
According to an embodiment, two or more sets of knead forging are performed where one set is cold forging processes in directions parallel to and perpendicular to a thickness direction of a columnar titanium material. The titanium material is heated to a temperature of 700° C. or more to induce recrystallization, and thereafter, two or more sets of knead forging are performed where one set is the cold forging processes in the directions parallel to and perpendicular to the thickness direction. Further, the titanium material is cold rolled, and is heat-treated to a temperature of 300° C. or more.
摘要:
The present invention provides a getter material configured by a pressed powder mixture comprising Ba—Al alloy powder and Ni powder, wherein when the pressed powder mixture is heated in a vacuum atmosphere or an inert gas atmosphere, a temperature at which an exothermic reaction starts is ranging from 750° C. to 900° C. According to this getter material, since the temperature at which the pressed powder mixture starts the exothermic reaction is set within a range from 750° C. to 900° C., there can be provided a getter material and an evaporation type getter device capable of suitably controlling an evaporation amount of getter components under a stable condition, and is excellent in responsiveness because a time ranging from a starting time of heating the getter material to a starting time of evaporation of the getter components can be shortened. In addition, the metal container to be filled with the getter material is free from deformation and melting, and a heat-evaporation process time of the getter material can be shortened, so that there can be provided the evaporation type getter device excellent in responsiveness because a time required for the electron tube to attain to a predetermined vacuum degree can be also shortened.
摘要:
The present invention provides non-magnetic stainless steel which is used as materials for small parts in precision machines and electronic equipment. The non-magnetic stainless steel consists of an iron-based alloy containing 9 to 22% by weight of nickel, 12 to 26% by weight of chromiun, the balance of iron and inevitable impurities. The martensitic area ratio of the iron-based alloy structure is not more than 20%. The stainless steel exhibits excellent workability and is suitable as a raw material for TV electron gun parts and small gears which are formed by strong working such as blanking or the like.
摘要:
In one embodiment, a method for manufacturing a tantalum sputtering target includes a first knead forging step, a first heating step, a second knead forging step, a cold rolling step, and a second heating step. In the first knead forging step, a tantalum material is subjected to two sets or more of knead forging, each of the sets being cold forging in directions parallel to and perpendicular to a thickness direction. In the second knead forging step, one set or more of knead forging is performed after the first heating step, each of the steps being cold forging in the directions parallel to and perpendicular to the thickness direction.