公开(公告)号：US07693360B2

公开(公告)日：2010-04-06

申请号：US10511630

申请日：2003-04-18

申请人： Takanori Shimizu ,  Takara Sugimoto ,  Jun-ichi Sasaki ,  Kazuhiko Kurata

发明人： Takanori Shimizu ,  Takara Sugimoto ,  Jun-ichi Sasaki ,  Kazuhiko Kurata

IPC分类号： G02F6/12 ,  G02B6/10

CPC分类号： H01S5/02272 ,  H01L24/73 ,  H01L25/167 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01S5/02248 ,  H01S5/02288 ,  H01L2924/00 ,  H01L2224/05599

摘要： On the back surface of a transparent plate having a light extracting part for outputting lights to the outside, an electrode for wiring, and an electrode for an electromagnetic shield, an optical device is flip-chip mounted right under the light extracting part, an a driver IC is flip-chip mounted at a desired position with metal bumps. When currents driving the optical device flow from the driver IC according to an electric logical signal from the outside, an optical signal is emitted from the optical device, and is output to the outside through the light extracting part. The light extracting part may be provided with a light coupling material or an optical axis converter.

摘要翻译： 在具有用于将光输出到外部的光提取部分的透明板的背面，用于布线的电极和用于电磁屏蔽的电极中，光学装置被倒装安装在光提取部分的正下方， 驱动器IC被倒装安装在具有金属凸块的期望位置。 当驱动光学装置的电流根据来自外部的电逻辑信号从驱动器IC流出时，光信号从光学装置发射，并通过光提取部分输出到外部。 光提取部分可以设置有光耦合材料或光轴转换器。

公开(公告)号：US20050180679A1

公开(公告)日：2005-08-18

申请号：US10511630

申请日：2003-04-18

申请人： Takanori Shimizu ,  Takara Sugimoto ,  Jun-ichi Sasaki ,  Kazuhiko Kurata

发明人： Takanori Shimizu ,  Takara Sugimoto ,  Jun-ichi Sasaki ,  Kazuhiko Kurata

IPC分类号： H01L25/16 ,  H01L31/02 ,  H01L33/56 ,  H01L33/62 ,  H01S5/02 ,  G02B6/12

CPC分类号： H01S5/02272 ,  H01L24/73 ,  H01L25/167 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01S5/02248 ,  H01S5/02288 ,  H01L2924/00 ,  H01L2224/05599

摘要： On the back surface of a transparent plate having a light extracting part 14 for outputting lights to the outside, an electrode 16 for wiring, and an electrode 17 for an electromagnetic shield, an optical device 11 is flip-chip mounted right under the light extracting part 14, an a driver IC 12 is flip-chip mounted at a desired position with metal bumps 15. When currents driving the optical device 11 flow from the driver IC 12 according to an electric logical signal from the outside, an optical signal is emitted from the optical device 11, and is output to the outside through the light extracting part 14. The light extracting part 14 may be provided with a light coupling material or an optical axis converter.

摘要翻译： 在具有用于向外部输出光的光提取部分14的透明板的背面，用于布线的电极16和用于电磁屏蔽的电极17中，光学装置11被倒装安装在光提取下 在第14部分中，驱动器IC12以金属凸块15倒装安装在期望的位置上。 当驱动光学装置11的电流根据来自外部的电逻辑信号从驱动器IC 12流出时，从光学装置11发出光信号，并通过光提取部14输出到外部。 光提取部14可以设置有光耦合材料或光轴转换器。

公开(公告)号：US06696755B2

公开(公告)日：2004-02-24

申请号：US10389121

申请日：2003-03-14

申请人： Nobuharu Kami ,  Kazuhiko Kurata ,  Satoshi Doumae ,  Takara Sugimoto

发明人： Nobuharu Kami ,  Kazuhiko Kurata ,  Satoshi Doumae ,  Takara Sugimoto

IPC分类号： H01L2334

CPC分类号： G02B6/4201 ,  G02B6/4214 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/10253 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device comprises: an insulating flexible film capable of changing its profile; first and second conductive layers provided on both surfaces of the flexible film and constituting wiring patterns; an LSI mounted on the first conductive layer; a conductor provided in a hole formed in the flexible film and making connection between the wiring pattern formed in the first conductive layer and the wiring pattern formed in the second wiring pattern; a stiffener; and a heat spreader. A part of the wiring pattern constituted by each of the first conductive layer and the second wiring pattern is a conductive wiring, whose characteristic impedance is previously calculated, for a high-speed signal and a connection portion for making connection to a mother board is provided on an end of the conductive wiring for a high-speed signal. Thus the semiconductor device is able to have a high heat removal ability without sacrificing its electrical performance and enables time efficiency in package design associated with package assembly and reduced assembly cost.

摘要翻译： 半导体器件包括：能够改变其形状的绝缘柔性膜; 设置在柔性膜的两个表面上并构成布线图案的第一和第二导电层; 安装在第一导电层上的LSI; 设置在形成在所述柔性膜中的孔中并且形成在所述第一导电层中形成的布线图案与形成在所述第二布线图案中的布线图案之间的连接的导体; 加强筋 和散热器。 由第一导电层和第二布线图案中的每一个构成的布线图形的一部分是针对高速信号预先计算其特性阻抗的导电布线和用于连接到母板的连接部分 在用于高速信号的导电布线的一端。 因此，半导体器件能够具有高的除热能力，而不牺牲其电性能，并且能够实现与封装组装相关的封装设计中的时间效率并降低组装成本。

公开(公告)号：US07565043B2

公开(公告)日：2009-07-21

申请号：US11651026

申请日：2007-01-09

申请人： Takara Sugimoto

发明人： Takara Sugimoto

IPC分类号： G02B6/12 ,  G02B6/26

CPC分类号： G02B6/4246 ,  G02B6/29368 ,  G02B6/4202 ,  G02B6/4204 ,  G02B6/423

摘要： An optical module outputting transmitted optical signals from a light-emitting element to an optical fiber and guiding received optical signals arriving from the same optical fiber to a light-receiving element prevents transmitted optical signals originating from the light-emitting element of a local station from coupling to the light-receiving element, devolving into noise and impeding communication. Light-emitting element and light-receiving element are arranged in a positional relationship, whereby the optical axis of light-emitting element and the normal to light-receiving surface of light-receiving element are located in a spatially divergent relationship. Furthermore, it comprises optical path conversion elements which, along with guiding optical signals propagating along receiving optical waveguide to light-receiving surface of light-receiving element, ensures that the image of the light-emitting spot of light-emitting element projected onto a plane including light-receiving surface of light-receiving element does not overlap with light-receiving surface of light-receiving element.

摘要翻译： 将从发光元件发送的光信号输出到光纤并将从同一光纤到达的光信号引导到光接收元件的光模块防止从本地站的发光元件发出的发射的光信号 耦合到光接收元件，掉入噪声并阻碍通信。 发光元件和光接收元件以位置关系布置，由此发光元件的光轴和光接收元件的光接收表面的光轴位于空间上的发散关系。 此外，它包括光路转换元件，其与引导光信号一起沿着接收光波导传播到光接收元件的光接收表面，确保发射元件的发光点的图像投影到平面上 包括光接收元件的光接收表面不与光接收元件的光接收表面重叠。

公开(公告)号：US20070189660A1

公开(公告)日：2007-08-16

申请号：US11651026

申请日：2007-01-09

申请人： Takara Sugimoto

发明人： Takara Sugimoto

IPC分类号： G02B6/12

CPC分类号： G02B6/4246 ,  G02B6/29368 ,  G02B6/4202 ,  G02B6/4204 ,  G02B6/423

摘要： An optical module outputting transmitted optical signals from a light-emitting element to an optical fiber and guiding received optical signals arriving from the same optical fiber to a light-receiving element prevents transmitted optical signals originating from the light-emitting element of a local station from coupling to the light-receiving element, devolving into noise and impeding communication. Light-emitting element 210 and light-receiving element 202 are arranged in a positional relationship, whereby the optical axis of light-emitting element 201 and the normal to light-receiving surface 402 of light-receiving element 202 are located in a spatially divergent relationship. Furthermore, it comprises optical path conversion means which, along with guiding optical signals propagating along receiving optical waveguide 302 to light-receiving surface 402 of light-receiving element 202, ensures that the image of the light-emitting spot of light-emitting element 201 projected onto a plane comprising light-receiving surface 402 of light-receiving element 202 does not overlap with light-receiving surface 402 of light-receiving element 202.

摘要翻译： 将从发光元件发送的光信号输出到光纤并将从同一光纤到达的光信号引导到光接收元件的光模块防止从本地站的发光元件发出的发射的光信号 耦合到光接收元件，掉入噪声并阻碍通信。 发光元件210和光接收元件202以位置关系布置，由此光接收元件202的发光元件201的光轴和光接收表面402的光轴位于空间上的发散关系 。 此外，它包括光路转换装置，其连同沿着接收光波导302传播到光接收元件202的光接收表面402的引导光信号确保发光元件201的发光点的图像 投影在包含光接收元件202的受光面402的平面上不与光接收元件202的受光面402重叠。