摘要:
A film bulk acoustic wave resonator of the invention includes a substrate; a resonant structure provided on the substrate constituted by a lower electrode, a piezoelectric film and an upper electrode; and an acoustic multilayer of a plurality of reflective films provided between the substrate and the resonant structure. At least one of the reflective films of the acoustic multilayer has a specified crystal plane orientation, and an X-ray rocking curve full width at half maximum that is preferably not greater than 10 degrees, and more preferably is not greater than 3 degrees. This makes it possible to obtain better resonance characteristics than in the case of the prior art, by increasing the efficiency with which bulk waves propagating towards the substrate are reflected.
摘要:
A piezoelectric resonator according to an embodiment of the present invention has a first transducer connected to a first signal terminal, and a second transducer connected to a second signal terminal. The first transducer and the second transducer are stacked in a predetermined direction. At least one of the first transducer and the second transducer has a first piezoelectric film sandwiched between a pair of electrode films on both sides, and a second piezoelectric film comprised of a film type different from that of the first piezoelectric film and sandwiched between a pair of electrode films on both sides.
摘要:
A piezoelectric resonator according to an embodiment of the present invention is a piezoelectric resonator for obtaining a signal of a predetermined resonance frequency from a bulk acoustic wave propagating inside a piezoelectric film. This piezoelectric resonator has a plurality of transducers stacked in a predetermined direction, and a propagation area of the bulk acoustic wave varies in a propagation direction of the bulk acoustic wave.
摘要:
The electronic device includes a substrate, a lower conductive film provided on the substrate, a functional film provided on the lower conductive film, and a crystallinity barrier film provided between the lower conductive film and the functional film. The present invention prevents the crystallinity of the functional film being affected by the crystallinity or the material selection of the lower conductive film, so it becomes possible to use a low-cost metal such as aluminum (Al) for the lower conductive film, and to use a low-cost method for forming the film, thereby making it possible to improve the crystallinity of the functional film without using a costly film-formation method such as epitaxial growth. For the crystallinity barrier film, there can be used a material having an amorphous structure.
摘要:
A piezoelectric resonator according to an embodiment of the present invention is a piezoelectric resonator for obtaining a signal of a predetermined resonance frequency from a bulk acoustic wave propagating inside a piezoelectric film. This piezoelectric resonator has a plurality of transducers stacked in a predetermined direction, and a propagation area of the bulk acoustic wave varies in a propagation direction of the bulk acoustic wave.
摘要:
A film bulk acoustic wave resonator of the invention includes a substrate; a resonant structure provided on the substrate constituted by a lower electrode, a piezoelectric film and an upper electrode; and an acoustic multilayer of a plurality of reflective films provided between the substrate and the resonant structure. At least one of the reflective films of the acoustic multilayer has a specified crystal plane orientation, and an X-ray rocking curve full width at half maximum that is preferably not greater than 10 degrees, and more preferably is not greater than 3 degrees. This makes it possible to obtain better resonance characteristics than in the case of the prior art, by increasing the efficiency with which bulk waves propagating towards the substrate are reflected.
摘要:
A piezoelectric resonator according to an embodiment of the present invention has a first transducer connected to a first signal terminal, and a second transducer connected to a second signal terminal. The first transducer and the second transducer are stacked in a predetermined direction. At least one of the first transducer and the second transducer has a first piezoelectric film sandwiched between a pair of electrode films on both sides, and a second piezoelectric film comprised of a film type different from that of the first piezoelectric film and sandwiched between a pair of electrode films on both sides.
摘要:
The electronic device includes a substrate, a lower conductive film provided on the substrate, a functional film provided on the lower conductive film, and a crystallinity barrier film provided between the lower conductive film and the functional film. The present invention prevents the crystallinity of the functional film being affected by the crystallinity or the material selection of the lower conductive film, so it becomes possible to use a low-cost metal such as aluminum (Al) for the lower conductive film, and to use a low-cost method for forming the film, thereby making it possible to improve the crystallinity of the functional film without using a costly film-formation method such as epitaxial growth. For the crystallinity barrier film, there can be used a material having an amorphous structure.
摘要:
An electronic device includes a substrate, a lower conductive film formed on the substrate and a functional film formed on the lower conductive film. In the present invention, an adhesion of the lower conductive film on the side of the substrate is greater than or equal to 0.1 N/cm. The electronic device according to this invention exhibits high mechanical strength that makes it very reliable. This is because the invention prevents the physical exfoliation of the lower conductive film that is apt to occur during or after fabrication of the electronic device when the adhesion of the lower conductive film is lower than 0.1 N/cm.
摘要:
A component for fabricating the electronic device comprises a substrate and a conductive film provided on the substrate, in which the adhesion of the conductive film to the substrate is not greater than 0.1 N/cm. The adhesion of the conductive film to the substrate is weak enough to enable the conductive film to be readily peeled from the substrate. This makes it possible to form a component on a substrate other than the substrate used during film formation, thereby greatly increasing the degree of product configuration freedom. If the adhesion of a lower conductive film on the substrate side is made to be not greater than 0.04 N/cm, it becomes very easy to peel the conductive film from the substrate.