SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR SUBSTRATE BONDING METHOD
    5.
    发明申请
    SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR SUBSTRATE BONDING METHOD 审中-公开
    半导体制造设备和半导体基板接合方法

    公开(公告)号:US20120190138A1

    公开(公告)日:2012-07-26

    申请号:US13354734

    申请日:2012-01-20

    IPC分类号: H01L21/66 B32B37/30 B32B41/00

    摘要: According to one embodiment, semiconductor manufacturing apparatus includes a first member that holds a first semiconductor substrate; a second member that holds a second semiconductor substrate in a state where a bonding surface of the second semiconductor substrate faces a bonding surface of the first semiconductor substrate; a distance detecting unit that detects a distance between the bonding surface of the first semiconductor substrate and the bonding surface of the second semiconductor substrate; an adjusting unit that adjusts the distance between the bonding surface of the first semiconductor substrate and the bonding surface of the second semiconductor substrate to a predetermined value by moving at least one of the first and second members based on a detection result of the distance detecting unit; and a third member that forms the bonding start point between the first semiconductor substrate and the second semiconductor substrate.

    摘要翻译: 根据一个实施例,半导体制造装置包括保持第一半导体衬底的第一构件; 第二构件,其在第二半导体衬底的接合表面面对第一半导体衬底的接合表面的状态下保持第二半导体衬底; 距离检测单元,其检测第一半导体衬底的接合表面和第二半导体衬底的接合表面之间的距离; 调整单元,其基于所述距离检测单元的检测结果,通过移动所述第一和第二构件中的至少一个来调整所述第一半导体衬底的接合表面与所述第二半导体衬底的接合表面之间的距离为预定值 ; 以及在第一半导体衬底和第二半导体衬底之间形成接合起始点的第三构件。

    Semiconductor manufacturing apparatus and semiconductor manufacturing method
    7.
    发明授权
    Semiconductor manufacturing apparatus and semiconductor manufacturing method 有权
    半导体制造装置及半导体制造方法

    公开(公告)号:US08822307B2

    公开(公告)日:2014-09-02

    申请号:US13422966

    申请日:2012-03-16

    摘要: According to one embodiment, a semiconductor manufacturing apparatus is provided. The semiconductor manufacturing apparatus includes a stage, a substrate supporter, first and second pushers, and a controller. The stage is configured to support outer periphery portions of the first semiconductor substrate from below. The substrate supporter is configured to hold the back of the second semiconductor substrate. The first and second pushers are configured to bring the first and second semiconductor substrates in contact. The controller is configured to form the bonding initiation point between the first and second semiconductor substrates.

    摘要翻译: 根据一个实施例,提供一种半导体制造装置。 半导体制造装置包括台,基板支撑件,第一和第二推动器以及控制器。 该台被配置为从下方支撑第一半导体衬底的外围部分。 衬底支撑件构造成保持第二半导体衬底的背面。 第一和第二推动器构造成使第一和第二半导体衬底接触。 控制器被配置为在第一和第二半导体衬底之间形成接合起始点。

    SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD
    8.
    发明申请
    SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD 有权
    半导体制造设备和半导体制造方法

    公开(公告)号:US20120329241A1

    公开(公告)日:2012-12-27

    申请号:US13422966

    申请日:2012-03-16

    摘要: According to one embodiment, a semiconductor manufacturing apparatus is provided. The semiconductor manufacturing apparatus includes a stage, a substrate supporter, first and second pushers, and a controller. The stage is configured to support outer periphery portions of the first semiconductor substrate from below. The substrate supporter is configured to hold the back of the second semiconductor substrate. The first and second pushers are configured to bring the first and second semiconductor substrates in contact. The controller is configured to form the bonding initiation point between the first and second semiconductor substrates.

    摘要翻译: 根据一个实施例,提供一种半导体制造装置。 半导体制造装置包括台,基板支撑件,第一和第二推动器以及控制器。 该台被配置为从下方支撑第一半导体衬底的外围部分。 衬底支撑件构造成保持第二半导体衬底的背面。 第一和第二推动器构造成使第一和第二半导体衬底接触。 控制器被配置为在第一和第二半导体衬底之间形成接合起始点。

    SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD
    10.
    发明申请
    SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD 有权
    半导体制造设备和半导体制造方法

    公开(公告)号:US20110217795A1

    公开(公告)日:2011-09-08

    申请号:US13035182

    申请日:2011-02-25

    IPC分类号: H01L21/66 B23P19/00

    摘要: According to one embodiment, a first substrate and a second substrate are pressed from an opposite surface of a joint surface of the second substrate such that a joint surface of the first substrate and the joint surface of the second substrate are in contact with each other. The second substrate is restrained by a member to provide a gap between the joint surfaces. It is determined, based on a temporal change of a joint interface calculated based on an image imaged from the opposite surface side of the joint surface, whether joining is normally performed.

    摘要翻译: 根据一个实施例,第一基板和第二基板从第二基板的接合表面的相对表面被按压,使得第一基板的接合表面和第二基板的接合表面彼此接触。 第二基板被构件约束以在接合表面之间提供间隙。 基于基于从接合面的相对面侧成像的图像计算的接合界面的时间变化,确定是否正常进行接合。