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1.发明授权Method for flip-chip mounting utilizing a delay curing-type adhesive with two-part hardening resin 有权使用具有两部分硬化树脂的延迟固化型粘合剂进行倒装芯片安装的方法公开(公告)号：US07416921B2
公开(公告)日：2008-08-26
申请号：US11066483
申请日：2005-02-28
IPC分类号： H01L21/00
CPC分类号： H01L21/563 , H01L24/29 , H01L24/75 , H01L24/81 , H01L2224/16225 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75753 , H01L2224/81205 , H01L2224/81232 , H01L2224/81801 , H01L2224/83099 , H01L2224/83102 , H01L2224/83192 , H01L2224/83874 , H01L2224/92125 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01327 , H01L2924/07802 , H01L2924/19043 , Y10T156/10 , H01L2924/00 , H01L2224/0401
摘要： A method of flip-chip mounting a semiconductor chip can carry out bonding at normal temperature and improves the positional accuracy of bonding. The method of flip-chip bonding a semiconductor chip 52 includes a step of providing a hardening trigger that is not heat to insulating adhesive 51 either before the semiconductor chip 52 is mounted on the substrate 50 or during bonding; and a step of bonding the bumps of the semiconductor chip to the pads of the substrate 50 by pressure welding or metal combining while hardening of the insulating adhesive 51 is progressing due to provision of the hardening trigger.
摘要翻译： 半导体芯片的倒装芯片的安装方法可以在常温下进行接合，提高接合的位置精度。 半导体芯片52的倒装芯片接合的方法包括在将半导体芯片52安装在基板50上之前或在接合期间提供不加热以绝缘粘合剂51的硬化触发的步骤; 以及通过压力焊接或金属组合将半导体芯片的凸点接合到基板50的焊盘的步骤，同时绝缘粘合剂51的硬化由于设置硬化触发而正在进行。
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2.发明申请Method of flip-chip mounting a semiconductor chip and mounting apparatus using the same 有权半导体芯片的倒装芯片的安装方法及使用其的安装装置公开(公告)号：US20060099809A1
公开(公告)日：2006-05-11
申请号：US11066483
申请日：2005-02-28
IPC分类号： H01L21/44
CPC分类号： H01L21/563 , H01L24/29 , H01L24/75 , H01L24/81 , H01L2224/16225 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75753 , H01L2224/81205 , H01L2224/81232 , H01L2224/81801 , H01L2224/83099 , H01L2224/83102 , H01L2224/83192 , H01L2224/83874 , H01L2224/92125 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01327 , H01L2924/07802 , H01L2924/19043 , Y10T156/10 , H01L2924/00 , H01L2224/0401
摘要： A method of flip-chip mounting a semiconductor chip can carry out bonding at normal temperature and improves the positional accuracy of bonding. The method of flip-chip bonding a semiconductor chip 52 includes a step of providing a hardening trigger that is not heat to insulating adhesive 51 either before the semiconductor chip 52 is mounted on the substrate 50 or during bonding; and a step of bonding the bumps of the semiconductor chip to the pads of the substrate 50 by pressure welding or metal combining while hardening of the insulating adhesive 51 is progressing due to provision of the hardening trigger.
摘要翻译： 半导体芯片的倒装芯片的安装方法可以在常温下进行接合，提高接合的位置精度。 半导体芯片52的倒装芯片接合的方法包括在将半导体芯片52安装在基板50上之前或在接合期间提供不加热以绝缘粘合剂51的硬化触发的步骤; 以及通过压力焊接或金属组合将半导体芯片的凸点接合到基板50的焊盘的步骤，同时绝缘粘合剂51的硬化由于设置硬化触发而正在进行。
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公开(公告)号：US07712650B2
公开(公告)日：2010-05-11
申请号：US11356176
申请日：2006-02-17
IPC分类号： B23K1/06
CPC分类号： H01L23/562 , H01L2224/81205 , H01L2224/81801
摘要： When a semiconductor chip is mounted using ultrasonic vibration, a method of mounting makes it possible to bond the semiconductor chip and bonding patterns with sufficient bonding strength without making the construction of a circuit board complex. The method of mounting a semiconductor chip causes ultrasonic vibration to act on the semiconductor chip to mount the semiconductor chip on a circuit board by flip-chip bonding. As the circuit board, a circuit board is used where protrusion patterns are provided at positions on bonding patterns to which the semiconductor chip is bonded corresponding to antinodes of vibration for a case where the bonding patterns resonate due to ultrasonic vibration applied by the semiconductor chip.
摘要翻译： 当使用超声波振动安装半导体芯片时，安装方法使得可以将半导体芯片和接合图案以足够的接合强度粘合，而不会使电路板的结构复杂化。 安装半导体芯片的方法引起超声波振动作用在半导体芯片上，以通过倒装芯片接合将半导体芯片安装在电路板上。 作为电路基板，使用电路基板，在由半导体芯片施加的超声波振动引起的接合图案共振的情况下，使用突起图案设置在与键合图案相对应的振动波形的接合图案上的位置上。
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公开(公告)号：US20070080190A1
公开(公告)日：2007-04-12
申请号：US11356176
申请日：2006-02-17
IPC分类号： A47J36/02
CPC分类号： H01L23/562 , H01L2224/81205 , H01L2224/81801
摘要： When a semiconductor chip is mounted using ultrasonic vibration, a method of mounting makes it possible to bond the semiconductor chip and bonding patterns with sufficient bonding strength without making the construction of a circuit board complex. The method of mounting a semiconductor chip causes ultrasonic vibration to act on the semiconductor chip to mount the semiconductor chip on a circuit board by flip-chip bonding. As the circuit board, a circuit board is used where protrusion patterns are provided at positions on bonding patterns to which the semiconductor chip is bonded corresponding to antinodes of vibration for a case where the bonding patterns resonate due to ultrasonic vibration applied by the semiconductor chip.
摘要翻译： 当使用超声波振动安装半导体芯片时，安装方法使得可以将半导体芯片和接合图案以足够的接合强度粘合，而不会使电路板的结构复杂化。 安装半导体芯片的方法引起超声波振动作用在半导体芯片上，以通过倒装芯片接合将半导体芯片安装在电路板上。 作为电路基板，使用电路基板，在由半导体芯片施加的超声波振动引起的接合图案共振的情况下，使用突起图案设置在与键合图案相对应的振动波形的接合图案上的位置上。
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公开(公告)号：US20090146653A1
公开(公告)日：2009-06-11
申请号：US12292651
申请日：2008-11-24
申请人： Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi , Shuichi Takeuchi , Takayoshi Matsumura , Hirokazu Yamanishi , Shinji Hiraoka , Yoshiaki Yanagida
发明人： Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi , Shuichi Takeuchi , Takayoshi Matsumura , Hirokazu Yamanishi , Shinji Hiraoka , Yoshiaki Yanagida
IPC分类号： G01R33/12
CPC分类号： G11B5/455 , G11B5/4555 , G11B5/6005 , H01R13/2421 , H01R2201/20
摘要： A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part 30 that tiltably supports the slider is provided on the set plate. There is also provided a pressing mechanism that elastically presses the slider via the movable support part toward a surface of the medium to dispose the slider floating over the surface of the medium. The pressing mechanism includes an elastic body 56 composed of a plate spring that contacts the movable support part and elastically presses the movable support part.
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公开(公告)号：US07514788B2
公开(公告)日：2009-04-07
申请号：US11979165
申请日：2007-10-31
申请人： Kenji Kobae , Hidehiko Kira , Norio Kainuma , Takayoshi Matsumura
发明人： Kenji Kobae , Hidehiko Kira , Norio Kainuma , Takayoshi Matsumura
IPC分类号： H01L21/302
CPC分类号： H01L24/81 , H01L24/11 , H01L24/13 , H01L24/17 , H01L24/75 , H01L2224/0401 , H01L2224/0603 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/131 , H01L2224/13144 , H01L2224/1403 , H01L2224/16 , H01L2224/75 , H01L2224/759 , H01L2224/81136 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2924/014 , H01L2924/00015 , H01L2224/13099 , H01L2924/00
摘要： The structure of mounting an electronic component on a circuit board is capable of securely flip-chip-bonding the electronic component having bumps, whose separations are very short, to the circuit board without displacement. The structure of mounting an electronic component on a circuit board is characterized in that bumps of the electronic component are respectively flip-chip-bonded to electrodes of the circuit board by applying ultrasonic vibrations to the electronic component, and that a center of each of the bumps is previously relatively displaced, with respect to a center of each of the electrodes in a width direction, in a direction parallel to a direction of the ultrasonic vibrations.
摘要翻译： 将电子部件安装在电路板上的结构能够将具有非常短的分离的凸块的电子部件可靠地倒置接合到电路板而没有位移。 将电子部件安装在电路板上的结构的特征在于，通过对电子部件施加超声波振动，电子部件的凸起分别与电路基板的电极倒装接合， 先前相对于每个电极的宽度方向上的中心在与超声波振动的方向平行的方向上相对移位。
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公开(公告)号：US07471081B2
公开(公告)日：2008-12-30
申请号：US11326598
申请日：2006-01-06
申请人： Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi , Shuichi Takeuchi , Takayoshi Matsumura , Hirokazu Yamanishi , Shinji Hiraoka , Yoshiaki Yanagida
发明人： Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi , Shuichi Takeuchi , Takayoshi Matsumura , Hirokazu Yamanishi , Shinji Hiraoka , Yoshiaki Yanagida
IPC分类号： G01R33/12
CPC分类号： G11B5/455 , G11B5/4555 , G11B5/6005 , H01R13/2421 , H01R2201/20
摘要： A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part 30 that tiltably supports the slider is provided on the set plate. There is also provided a pressing mechanism that elastically presses the slider via the movable support part toward a surface of the medium to dispose the slider floating over the surface of the medium. The pressing mechanism includes an elastic body 56 composed of a plate spring that contacts the movable support part and elastically presses the movable support part.
摘要翻译： 滑块测试器包括使测试介质旋转的驱动单元，可拆卸地支撑滑块作为单个主体的固定板，以及与由固定板支撑的滑块电连接的调查装置，并且调查滑块的特性。 在该固定板上设置有可滑动地支承滑块的可动支承部30。 还提供了一种按压机构，其通过可移动支撑部件朝向介质的表面弹性地按压滑块以将滑块设置在介质表面上。 按压机构包括弹性体56，其由与所述可动支撑部接触并弹性地按压所述可动支撑部的板簧构成。
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公开(公告)号：US20060172575A1
公开(公告)日：2006-08-03
申请号：US11326598
申请日：2006-01-06
申请人： Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi , Shuichi Takeuchi , Takayoshi Matsumura , Hirokazu Yamanishi , Shinji Hiraoka , Yoshiaki Yanagida
发明人： Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi , Shuichi Takeuchi , Takayoshi Matsumura , Hirokazu Yamanishi , Shinji Hiraoka , Yoshiaki Yanagida
IPC分类号： H01R13/15
CPC分类号： G11B5/455 , G11B5/4555 , G11B5/6005 , H01R13/2421 , H01R2201/20
摘要： A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part 30 that tiltably supports the slider is provided on the set plate. There is also provided a pressing mechanism that elastically presses the slider via the movable support part toward a surface of the medium to dispose the slider floating over the surface of the medium. The pressing mechanism includes an elastic body 56 composed of a plate spring that contacts the movable support part and elastically presses the movable support part.
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9.发明申请公开(公告)号：US20060094157A1
公开(公告)日：2006-05-04
申请号：US11041292
申请日：2005-01-25
申请人： Kenji Kobae , Hidehiko Kira , Norio Kainuma , Takayoshi Matsumura
发明人： Kenji Kobae , Hidehiko Kira , Norio Kainuma , Takayoshi Matsumura
IPC分类号： H01L21/50
CPC分类号： H01L24/81 , H01L24/11 , H01L24/13 , H01L24/17 , H01L24/75 , H01L2224/0401 , H01L2224/0603 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/131 , H01L2224/13144 , H01L2224/1403 , H01L2224/16 , H01L2224/75 , H01L2224/759 , H01L2224/81136 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2924/014 , H01L2924/00015 , H01L2224/13099 , H01L2924/00
摘要： The structure of mounting an electronic component on a circuit board is capable of securely flip-chip-bonding the electronic component having bumps, whose separations are very short, to the circuit board without displacement. The structure of mounting an electronic component on a circuit board is characterized in that bumps of the electronic component are respectively flip-chip-bonded to electrodes of the circuit board by applying ultrasonic vibrations to the electronic component, and that a center of each of the bumps is previously relatively displaced, with respect to a center of each of the electrodes in a width direction, in a direction parallel to a direction of the ultrasonic vibrations.
摘要翻译： 将电子部件安装在电路板上的结构能够将具有非常短的分离的凸块的电子部件可靠地倒置接合到电路板而没有位移。 将电子部件安装在电路板上的结构的特征在于，通过对电子部件施加超声波振动，电子部件的凸起分别与电路基板的电极倒装接合， 先前相对于每个电极的宽度方向上的中心在与超声波振动的方向平行的方向上相对移位。
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公开(公告)号：US20090146652A1
公开(公告)日：2009-06-11
申请号：US12292650
申请日：2008-11-24
申请人： Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi , Shuichi Takeuchi , Takayoshi Matsumura , Hirokazu Yamanishi , Shinji Hiraoka , Yoshiaki Yanagida
发明人： Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi , Shuichi Takeuchi , Takayoshi Matsumura , Hirokazu Yamanishi , Shinji Hiraoka , Yoshiaki Yanagida
IPC分类号： G01R33/12
CPC分类号： G11B5/455 , G11B5/4555 , G11B5/6005 , H01R13/2421 , H01R2201/20
摘要： A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part 30 that tiltably supports the slider is provided on the set plate. There is also provided a pressing mechanism that elastically presses the slider via the movable support part toward a surface of the medium to dispose the slider floating over the surface of the medium. The pressing mechanism includes an elastic body 56 composed of a plate spring that contacts the movable support part and elastically presses the movable support part.
摘要翻译： 滑块测试器包括使测试介质旋转的驱动单元，可拆卸地支撑滑块作为单个主体的固定板，以及与由固定板支撑的滑块电连接的调查装置，并且调查滑块的特性。 在该固定板上设置有可滑动地支承滑块的可动支承部30。 还提供了一种按压机构，其通过可移动支撑部件朝向介质的表面弹性地按压滑块以将滑块设置在介质表面上。 按压机构包括弹性体56，其由与所述可动支撑部接触并弹性地按压所述可动支撑部的板簧构成。
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