-
1.发明授权Method for flip-chip mounting utilizing a delay curing-type adhesive with two-part hardening resin 有权使用具有两部分硬化树脂的延迟固化型粘合剂进行倒装芯片安装的方法公开(公告)号：US07416921B2
公开(公告)日：2008-08-26
申请号：US11066483
申请日：2005-02-28
IPC分类号： H01L21/00
CPC分类号： H01L21/563 , H01L24/29 , H01L24/75 , H01L24/81 , H01L2224/16225 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75753 , H01L2224/81205 , H01L2224/81232 , H01L2224/81801 , H01L2224/83099 , H01L2224/83102 , H01L2224/83192 , H01L2224/83874 , H01L2224/92125 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01327 , H01L2924/07802 , H01L2924/19043 , Y10T156/10 , H01L2924/00 , H01L2224/0401
摘要： A method of flip-chip mounting a semiconductor chip can carry out bonding at normal temperature and improves the positional accuracy of bonding. The method of flip-chip bonding a semiconductor chip 52 includes a step of providing a hardening trigger that is not heat to insulating adhesive 51 either before the semiconductor chip 52 is mounted on the substrate 50 or during bonding; and a step of bonding the bumps of the semiconductor chip to the pads of the substrate 50 by pressure welding or metal combining while hardening of the insulating adhesive 51 is progressing due to provision of the hardening trigger.
摘要翻译： 半导体芯片的倒装芯片的安装方法可以在常温下进行接合，提高接合的位置精度。 半导体芯片52的倒装芯片接合的方法包括在将半导体芯片52安装在基板50上之前或在接合期间提供不加热以绝缘粘合剂51的硬化触发的步骤; 以及通过压力焊接或金属组合将半导体芯片的凸点接合到基板50的焊盘的步骤，同时绝缘粘合剂51的硬化由于设置硬化触发而正在进行。
-
2.发明申请Method of flip-chip mounting a semiconductor chip and mounting apparatus using the same 有权半导体芯片的倒装芯片的安装方法及使用其的安装装置公开(公告)号：US20060099809A1
公开(公告)日：2006-05-11
申请号：US11066483
申请日：2005-02-28
IPC分类号： H01L21/44
CPC分类号： H01L21/563 , H01L24/29 , H01L24/75 , H01L24/81 , H01L2224/16225 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75753 , H01L2224/81205 , H01L2224/81232 , H01L2224/81801 , H01L2224/83099 , H01L2224/83102 , H01L2224/83192 , H01L2224/83874 , H01L2224/92125 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01327 , H01L2924/07802 , H01L2924/19043 , Y10T156/10 , H01L2924/00 , H01L2224/0401
摘要： A method of flip-chip mounting a semiconductor chip can carry out bonding at normal temperature and improves the positional accuracy of bonding. The method of flip-chip bonding a semiconductor chip 52 includes a step of providing a hardening trigger that is not heat to insulating adhesive 51 either before the semiconductor chip 52 is mounted on the substrate 50 or during bonding; and a step of bonding the bumps of the semiconductor chip to the pads of the substrate 50 by pressure welding or metal combining while hardening of the insulating adhesive 51 is progressing due to provision of the hardening trigger.
摘要翻译： 半导体芯片的倒装芯片的安装方法可以在常温下进行接合，提高接合的位置精度。 半导体芯片52的倒装芯片接合的方法包括在将半导体芯片52安装在基板50上之前或在接合期间提供不加热以绝缘粘合剂51的硬化触发的步骤; 以及通过压力焊接或金属组合将半导体芯片的凸点接合到基板50的焊盘的步骤，同时绝缘粘合剂51的硬化由于设置硬化触发而正在进行。
-
公开(公告)号：US07566586B2
公开(公告)日：2009-07-28
申请号：US11634119
申请日：2006-12-06
申请人： Norio Kainuma , Hidehiko Kira , Kenji Kobae , Kimio Nakamura , Kuniko Ishikawa , Yukio Ozaki
发明人： Norio Kainuma , Hidehiko Kira , Kenji Kobae , Kimio Nakamura , Kuniko Ishikawa , Yukio Ozaki
IPC分类号： H01L21/00
CPC分类号： H01L21/563 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81205 , H01L2224/81801 , H01L2224/83192 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/00 , H01L2924/3512
摘要： A method of manufacturing a semiconductor device flip-chip bonds electrode terminals of a substrate and a semiconductor chip together by solid-phase diffusion and underfills a gap between the substrate and the semiconductor chip with a thermosetting resin without the bonds between the terminals breaking due to heat in an underfill hardening step. The method includes a bonding step of flip-chip bonding the electrode terminals of the substrate and the semiconductor chip by solid-phase diffusion, an underfill filling step of filling the gap between the substrate and the semiconductor chip with the underfill material, and the underfill hardening step where the underfill material is heated to the hardening temperature to harden the underfill material. During the underfill hardening step, a member with a lower coefficient of thermal expansion out of the substrate and the semiconductor chip is heated to a higher temperature than the other member.
摘要翻译： 半导体器件倒装芯片的制造方法通过固相扩散将基板和半导体芯片的电极端子连接在一起，并且用热固性树脂对基板和半导体芯片之间的间隙进行底部填充，而不会由于端子断裂而导致端子之间的结合 在底部填充硬化步骤中加热。 该方法包括通过固相扩散将基板和半导体芯片的电极端子倒装连接的接合步骤，用底部填充材料填充基板和半导体芯片之间的间隙的底部填充步骤，以及底部填充 硬化步骤，其中将底部填充材料加热至硬化温度以使底部填充材料硬化。 在底部填充硬化工序中，将从基板和半导体芯片的热膨胀系数较低的部件加热到比其他部件高的温度。
-
公开(公告)号：US20070264752A1
公开(公告)日：2007-11-15
申请号：US11634119
申请日：2006-12-06
申请人： Norio Kainuma , Hidehiko Kira , Kenji Kobae , Kimio Nakamura , Kuniko Ishikawa , Yukio Ozaki
发明人： Norio Kainuma , Hidehiko Kira , Kenji Kobae , Kimio Nakamura , Kuniko Ishikawa , Yukio Ozaki
IPC分类号： H01L21/00
CPC分类号： H01L21/563 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81205 , H01L2224/81801 , H01L2224/83192 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/00 , H01L2924/3512
摘要： A method of manufacturing a semiconductor device flip-chip bonds electrode terminals of a substrate and a semiconductor chip together by solid-phase diffusion and underfills a gap between the substrate and the semiconductor chip with a thermosetting resin without the bonds between the terminals breaking due to heat in an underfill hardening step. The method includes a bonding step of flip-chip bonding the electrode terminals of the substrate and the semiconductor chip by solid-phase diffusion, an underfill filling step of filling the gap between the substrate and the semiconductor chip with the underfill material, and the underfill hardening step where the underfill material is heated to the hardening temperature to harden the underfill material. During the underfill hardening step, a member with a lower coefficient of thermal expansion out of the substrate and the semiconductor chip is heated to a higher temperature than the other member.
摘要翻译： 半导体器件倒装芯片的制造方法通过固相扩散将基板和半导体芯片的电极端子连接在一起，并且用热固性树脂对基板和半导体芯片之间的间隙进行底部填充，而不会由于端子断裂而导致端子之间的结合 在底部填充硬化步骤中加热。 该方法包括通过固相扩散将基板和半导体芯片的电极端子倒装连接的接合步骤，用底部填充材料填充基板和半导体芯片之间的间隙的底部填充步骤，以及底部填充 硬化步骤，其中将底部填充材料加热至硬化温度以使底部填充材料硬化。 在底部填充硬化工序中，将从基板和半导体芯片的热膨胀系数较低的部件加热到比其他部件高的温度。
-
公开(公告)号：US07712650B2
公开(公告)日：2010-05-11
申请号：US11356176
申请日：2006-02-17
IPC分类号： B23K1/06
CPC分类号： H01L23/562 , H01L2224/81205 , H01L2224/81801
摘要： When a semiconductor chip is mounted using ultrasonic vibration, a method of mounting makes it possible to bond the semiconductor chip and bonding patterns with sufficient bonding strength without making the construction of a circuit board complex. The method of mounting a semiconductor chip causes ultrasonic vibration to act on the semiconductor chip to mount the semiconductor chip on a circuit board by flip-chip bonding. As the circuit board, a circuit board is used where protrusion patterns are provided at positions on bonding patterns to which the semiconductor chip is bonded corresponding to antinodes of vibration for a case where the bonding patterns resonate due to ultrasonic vibration applied by the semiconductor chip.
摘要翻译： 当使用超声波振动安装半导体芯片时，安装方法使得可以将半导体芯片和接合图案以足够的接合强度粘合，而不会使电路板的结构复杂化。 安装半导体芯片的方法引起超声波振动作用在半导体芯片上，以通过倒装芯片接合将半导体芯片安装在电路板上。 作为电路基板，使用电路基板，在由半导体芯片施加的超声波振动引起的接合图案共振的情况下，使用突起图案设置在与键合图案相对应的振动波形的接合图案上的位置上。
-
公开(公告)号：US20070080190A1
公开(公告)日：2007-04-12
申请号：US11356176
申请日：2006-02-17
IPC分类号： A47J36/02
CPC分类号： H01L23/562 , H01L2224/81205 , H01L2224/81801
摘要： When a semiconductor chip is mounted using ultrasonic vibration, a method of mounting makes it possible to bond the semiconductor chip and bonding patterns with sufficient bonding strength without making the construction of a circuit board complex. The method of mounting a semiconductor chip causes ultrasonic vibration to act on the semiconductor chip to mount the semiconductor chip on a circuit board by flip-chip bonding. As the circuit board, a circuit board is used where protrusion patterns are provided at positions on bonding patterns to which the semiconductor chip is bonded corresponding to antinodes of vibration for a case where the bonding patterns resonate due to ultrasonic vibration applied by the semiconductor chip.
摘要翻译： 当使用超声波振动安装半导体芯片时，安装方法使得可以将半导体芯片和接合图案以足够的接合强度粘合，而不会使电路板的结构复杂化。 安装半导体芯片的方法引起超声波振动作用在半导体芯片上，以通过倒装芯片接合将半导体芯片安装在电路板上。 作为电路基板，使用电路基板，在由半导体芯片施加的超声波振动引起的接合图案共振的情况下，使用突起图案设置在与键合图案相对应的振动波形的接合图案上的位置上。
-
公开(公告)号：US20090320270A1
公开(公告)日：2009-12-31
申请号：US12525019
申请日：2007-03-15
CPC分类号： G11B5/4833 , Y10T29/49908 , Y10T29/53961
摘要： There are provided a method of assembling a carriage assembly that can uniformly crimp edge portions of spacer holes of spacer portions and keep the spacer portions flat, thereby maintaining the angles of suspensions with high accuracy, and an assembling apparatus that uses such method.The method includes an attaching step of positioning spacer holes 12b of suspensions 12 on through-holes 10a formed in front end portions of a plurality of carriage arms 10 that have been disposed in parallel and attaching the suspensions to the respective carriage arms; and a crimping step of pressing a ball 20 with a diameter that is equal to or larger than an inner diameter of the spacer holes 12b using a pressing member 40 so as to pass the ball successively through the spacer holes 12b and thereby crimp spacer hole 12b edge portions of the spacer portions 12a and attach the suspensions 12 to the carriage arms 10, wherein during the crimping step, the ball 20 is placed in a vicinity of the center axis a at least when the ball 20 is located between the carriage arms 10.
摘要翻译： 提供了一种组装支架组件的方法，其可以均匀地压接间隔件部分的间隔孔的边缘部分并且使间隔部分保持平坦，从而以高精度保持悬架的角度，以及使用这种方法的组装装置。 该方法包括将悬架12的间隔孔12b定位在形成在已经平行布置的多个托架臂10的前端部的通孔10a上并将悬架附接到相应的托架臂上的安装步骤; 以及使用按压部件40按压直径等于或大于间隔孔12b的内径的球20的压接步骤，以使球连续通过间隔孔12b，从而压接间隔孔12b 间隔部分12a的边缘部分并将悬架12附接到托架臂10，其中在压接步骤期间，至少当球20位于托架臂10之间时，将球20放置在中心轴线a附近 。
-
公开(公告)号：US20100095515A1
公开(公告)日：2010-04-22
申请号：US12524864
申请日：2007-03-15
IPC分类号： B23P19/00
CPC分类号： G11B5/4833 , Y10T29/4902 , Y10T29/53
摘要： A method of assembling a carriage assembly that is operable, during a crimping step that passes a ball, which has a diameter that is equal to or larger than an inner diameter of spacer holes of suspensions, successively through the spacer holes using a bar-shaped pressing member that is subjected to ultrasonic vibration to thereby crimp spacer hole inner circumferential portions of the spacer portions and attach the suspensions to the front end portions of the carriage arms, to prevent the pressing member that presses the ball from colliding with an inner circumferential surface and the like of the spacer holes of the spacer portions and is therefore able to substantially eliminate tilting from the standard angle of the suspensions due to deformation of the spacer portions, and an assembling apparatus that uses such method are provided.After the ball 20 has passed through one of the spacer holes 12b, the inner diameter of the through-hole 36a of the gap maintaining plates 36 positioned to the rear of such spacer hole 12b in the direction in which the ball 20 passes is reduced to a smaller diameter than the inner diameter of the spacer holes 12b.
摘要翻译： 一种组装滑架组件的方法，其可以在通过球的压接步骤期间操作，所述压接步骤通过间隔孔连续穿过所述间隔孔，所述滚珠的直径等于或大于悬架的间隔孔的内径， 进行超声波振动的压紧构件，从而压接间隔部的间隔孔内周部，并将悬架安装在托架臂的前端部，防止按压滚珠的按压部件与内周面 并且因此能够基本上消除由于间隔部分的变形而导致的悬架的标准角度的倾斜，并且提供了使用这种方法的组装装置。 在球20已经穿过间隔孔12b之一之后，沿着球20通过的方向位于该间隔孔12b的后方的间隙保持板36的通孔36a的内径减小到 比间隔孔12b的内径小的直径。
-
公开(公告)号：US20100327435A1
公开(公告)日：2010-12-30
申请号：US12822656
申请日：2010-06-24
IPC分类号： H01L23/488 , H01L21/60
CPC分类号： H01L23/49811 , H01L23/49816 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/812 , H01L2224/81801 , H01L2224/83192 , H01L2924/00013 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15151 , H01L2924/15153 , H01L2924/19041 , H01L2924/19043 , H01L2224/13099 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electronic component includes a package substrate, a plurality of conductive pads, an insulating material and a semiconductor device. The plurality of conductive pads is disposed on the package substrate. The insulating material is disposed between the plurality of conductive pads. The insulating material includes a top surface located on an identical plane to an upper surface of the plurality of conductive pads. The semiconductor device includes a conductive bump aligned on a corresponding conductive pad of the plurality of conductive pads.
摘要翻译： 电子部件包括封装基板，多个导电焊盘，绝缘材料和半导体器件。 多个导电焊盘设置在封装衬底上。 绝缘材料设置在多个导电焊盘之间。 绝缘材料包括位于与多个导电焊盘的上表面相同的平面上的顶表面。 半导体器件包括对准在多个导电焊盘的相应导电焊盘上的导电凸块。
-
公开(公告)号：US07367108B2
公开(公告)日：2008-05-06
申请号：US11391362
申请日：2006-03-29
申请人： Takashi Kubota , Kenji Kobae , Kimio Nakamura
发明人： Takashi Kubota , Kenji Kobae , Kimio Nakamura
IPC分类号： B23K20/10
CPC分类号： B23K20/10 , B23K2101/32 , H05K3/26 , H05K3/328 , Y10T29/49027 , Y10T29/4903
摘要： A method of bonding flying leads produces reliable bonds between the flying leads and substrate pads and can efficiently bond a plurality of flying leads and a plurality of substrate pads using a bonding tool. Flying leads are respectively aligned with a plurality of substrate pads disposed in parallel and a bonding tool applies ultrasonic vibration to the flying leads to bond the respective substrate pads and the flying leads. Bonding is carried out using a bonding tool in which (at least one contact member) a plurality of contact members that contact(s) the flying leads and apply (applies) the ultrasonic vibration thereto are (is) rotatably supported. The bonding tool is moved in a direction so as to cross the flying leads disposed in parallel with the plurality of contact members (at least one contact member) rolling while in contact with the flying leads, and the ultrasonic vibration is applied from the plurality of contact members (at least one contact member) to the flying leads to ultrasonically bond the respective flying leads to the substrate pads.
摘要翻译： 结合飞行引线的方法在飞行引线和衬底焊盘之间产生可靠的结合，并且可以使用焊接工具有效地结合多个飞行引线和多个衬底焊盘。 飞行引线分别与平行设置的多个基板焊盘对准，并且焊接工具对飞行引线施加超声波振动以将相应的基板焊盘和飞行引线接合。 使用接合工具进行接合，其中（至少一个接触构件）多个接触飞行引线并且施加（施加）超声波振动的接触构件被可旋转地支撑。 接合工具沿与多个接触构件（至少一个接触构件）平行布置的飞行导线与飞行导线接触的方向移动，并且从多个接触构件 对飞行的接触构件（至少一个接触构件）导致将相应的飞行引线超声波地结合到衬底焊盘。
-
-
-
-
-
-
-
-
-
搜索结果
47 条记录 (耗时 0.02 秒)
