Connection/inspection device for semiconductor elements
    1.
    发明授权
    Connection/inspection device for semiconductor elements 失效
    半导体元件连接/检查装置

    公开(公告)号:US06815962B2

    公开(公告)日:2004-11-09

    申请号:US10216836

    申请日:2002-08-13

    IPC分类号: G01R3104

    CPC分类号: G01R1/07307

    摘要: There is provided an electric connection-inspection device which does not impair a freedom of selection of using materials from a viewpoint of restriction in terms of product's function with the aptitude of electric features of electric resistance and physical properties of internal stress, and restriction in terms of manufacture as to the appropriation or not of employment of a plating method, and which has a fine construction provided with the excellent durability that an electrode element is hard to adhere and coagulate. An electric connection-inspection device for coming into electrically contact with an object to be inspected to input and output a signal, comprising a plurality of contact terminals, a coating of a second layer having the Young's modulus higher than that of a wiring base-material layer and whose specific resistance is not more than 1×10−4 &OHgr;cm being formed on the surface of the wiring base-material layer positioned at the extreme end of the contact terminal, and a coating of a third layer having a low coagulating property being formed on the surface of the second layer.

    Electrode and its fabrication method for semiconductor devices, and sputtering target for forming electrode film for semiconductor devices
    2.
    再颁专利
    Electrode and its fabrication method for semiconductor devices, and sputtering target for forming electrode film for semiconductor devices 有权
    电极及其半导体器件的制造方法以及用于形成用于半导体器件的电极膜的溅射靶

    公开(公告)号:USRE44239E1

    公开(公告)日:2013-05-28

    申请号:US11430299

    申请日:2006-05-09

    IPC分类号: C23C14/34

    摘要: Disclosed is an electrode for semiconductor devices capable of suppressing the generation of hillocks and reducing the resistivity, which is suitable for an active matrixed liquid crystal display and the like in which a thin film transistor is used; its fabrication method; and a sputtering target for forming the electrode film for semiconductor devices. The electrode for semiconductor devices is made of an Al alloy containing the one or more alloying elements selected from Fe, Co, Ni, Ru, Rh and Ir, in a total amount from 0.1 to 10 At %, or one or more alloying elements selected from rare earth elements, in a total amount from 0.05 to 15 at %. The method of fabricating an electrode for semiconductor devices, includes the steps of: depositing an Al alloy film, in which the elements mentioned above are dissolved in an Al matrix, on a substrate; and precipitating part of all of the elements dissolved in the Al matrix as intermetallic compounds by annealing the Al alloy film at an annealing temperature ranging from 150 to 400° C.; whereby an electrode for semiconductor devices which is made of an Al alloy film with an electrical resistivity lower than 20 μΩcm is obtained. The target is made of an Al alloy containing the above elements.

    摘要翻译: 公开了一种能够抑制小丘的产生和降低电阻率的半导体器件用电极,其适用于使用薄膜晶体管的有源矩阵液晶显示器等; 其制作方法; 以及用于形成半导体器件用电极膜的溅射靶。 用于半导体器件的电极由含有一种或多种选自Fe,Co,Ni,Ru,Rh和Ir的合金元素的Al合金制成,总量为0.1至10原子%,或选择一种或多种合金元素 来自稀土元素,总量为0.05〜15原子%。 制造半导体器件的电极的方法包括以下步骤:在基底上沉积上述元素溶解在Al基体中的Al合金膜; 并且通过在150-400℃的退火温度下退火Al合金膜,将溶解在Al基体中的所有元素的一部分沉淀为金属间化合物; 由此获得由电阻率小于20μOmegacm的Al合金膜制成的半导体器件用电极。 目标由含有上述元素的Al合金制成。

    Aluminum alloy electrode for semiconductor devices
    3.
    发明授权
    Aluminum alloy electrode for semiconductor devices 失效
    半导体器件铝合金电极

    公开(公告)号:US5514909A

    公开(公告)日:1996-05-07

    申请号:US281028

    申请日:1994-07-27

    摘要: Disclosed is an electrode for semiconductor devices capable of suppressing the generation of hillocks and reducing the resistivity, which is suitable for an active matrixed liquid crystal display and the like in which a thin film transistor is used; its fabrication method; and a sputtering target for forming the electrode film for semiconductor devices. The electrode for semiconductor devices is made of an Al alloy containing the one or more alloying elements selected from Fe, Co, Ni, Ru, Rh and Ir, in a total amount from 0.1 to 10 At %, or one or more alloying elements selected from rare earth elements, in a total amount from 0.05 to 15 at %. The method of fabricating an electrode for semiconductor devices, includes the steps of: depositing an Al alloy film, in which the elements mentioned above are dissolved in an Al matrix, on a substrate; and precipitating part of all of the elements dissolved in the Al matrix as intermetallic compounds by annealing the Al alloy film at an annealing temperature ranging from 150.degree. to 400.degree. C.; whereby an electrode for semiconductor devices which is made of an Al alloy film with an electrical resistivity lower than 20 .mu..OMEGA.cm is obtained. The target is made of an Al alloy containing the above elements.

    摘要翻译: 公开了一种能够抑制小丘的产生和降低电阻率的半导体器件用电极,其适用于使用薄膜晶体管的有源矩阵液晶显示器等; 其制作方法; 以及用于形成半导体器件用电极膜的溅射靶。 用于半导体器件的电极由含有一种或多种选自Fe,Co,Ni,Ru,Rh和Ir的合金元素的Al合金制成,总量为0.1至10原子%,或选择一种或多种合金元素 来自稀土元素,总量为0.05〜15原子%。 制造半导体器件的电极的方法包括以下步骤:在基底上沉积上述元素溶解在Al基体中的Al合金膜; 并将溶解在Al基体中的所有元素的一部分析出为金属间化合物,退火温度为150〜400℃退火Al合金膜。 由此获得由电阻率小于20微米欧米伽厘米的Al合金膜制成的半导体器件用电极。 目标由含有上述元素的Al合金制成。

    Multilayer film formed body
    5.
    发明授权
    Multilayer film formed body 有权
    多层膜成型体

    公开(公告)号:US06716540B2

    公开(公告)日:2004-04-06

    申请号:US10087736

    申请日:2002-03-05

    IPC分类号: B32B1504

    摘要: A multilayer film formed body comprises an outermost layer comprising a diamondlike carbon film, a substrate comprising an iron material, and an intermediate layer comprising a first layer on the substrate side, and a second layer on the outermost layer side. The first layer comprises at least either metal of Cr and Al, and a second layer comprises an amorphous layer including carbon and at least either metal of Cr and Al. The second layer has a gradient structure where the metal decreases as the position becomes closer to the outermost layer. The hardness of the second layer increases stepwise or continuously as the position becomes closer to the outermost layer. The hardness of the second layer close to the first layer is close to the hardness of the first layer. The hardness of the second layer close to the outermost layer is close to the hardness of the outermost layer.

    摘要翻译: 多层膜成形体包括包含菱形碳膜的最外层,包含铁材料的基材,以及包含在基板侧上的第一层的中间层和最外层侧的第二层。 第一层包括Cr和Al的至少一种金属,第二层包括包含碳和Cr和Al的至少一种金属的非晶层。 第二层具有梯度结构,其中金属随着位置变得更接近最外层而减小。 随着位置变得更靠近最外层,第二层的硬度逐步或连续地增加。 靠近第一层的第二层的硬度接近于第一层的硬度。 靠近最外层的第二层的硬度接近最外层的硬度。

    Method of manufacturing active matrix type liquid crystal display
    6.
    发明授权
    Method of manufacturing active matrix type liquid crystal display 失效
    有源矩阵型液晶显示器的制造方法

    公开(公告)号:US06333267B1

    公开(公告)日:2001-12-25

    申请号:US08400861

    申请日:1995-03-08

    IPC分类号: H01L21285

    摘要: An active matrix type liquid crystal display, in which the reliability is enhanced by preventing the short-circuit and insulation breakdown of a gate insulating portion and the delay time of a gate bus line is shortened by reducing the resistivity of an interconnect film. The liquid crystal display of this type is manufactured by the steps of forming an interconnect/electrode film on a substrate by physical deposition; patterning the interconnect/electrode film; and anodic-oxidizing part or all of the interconnect/electrode film. In this method, the interconnect/electrode film is formed of an Al alloy containing at least one kind selected from a group consisting Fe, Co and rare earth elements in an amount of 0.1 to 10 at %; and the thickness of the anodic oxidation film is specified to be in the range of 200 Å or more.

    摘要翻译: 通过降低互连膜的电阻率,缩短了通过防止栅绝缘部分的短路和绝缘击穿以及栅极总线延迟时间来提高可靠性的有源矩阵型液晶显示器。 这种液晶显示器通过以下步骤制造:通过物理沉积在衬底上形成互连/电极膜; 图案化互连/电极膜; 和阳极氧化部分或全部的互连/电极膜。 在该方法中,互连电极膜由含有0.1〜10原子%的Fe,Co和稀土元素中的至少一种的Al合金形成, 阳极氧化膜的厚度规定在200以上的范围内。

    Electrode and its fabrication method for semiconductor devices, and
sputtering target for forming electrode film for semiconductor devices
    7.
    发明授权
    Electrode and its fabrication method for semiconductor devices, and sputtering target for forming electrode film for semiconductor devices 失效
    电极及其半导体器件的制造方法以及用于形成用于半导体器件的电极膜的溅射靶

    公开(公告)号:US6033542A

    公开(公告)日:2000-03-07

    申请号:US574693

    申请日:1995-12-19

    摘要: Disclosed is an electrode for semiconductor devices capable of suppressing the generation of hillocks and reducing the resistivity, which is suitable for an active matrixed liquid crystal display and the like in which a thin film transistor is used; its fabrication method; and a sputtering target for forming the electrode film for semiconductor devices. The electrode for semiconductor devices is made of an Al alloy containing the one or more alloying elements selected from Fe, Co, Ni, Ru, Rh and Ir, in a total amount from 0.1 to 10 At %, or one or more alloying elements selected from rare earth elements, in a total amount from 0.05 to 15 at %. The method of fabricating an electrode for semiconductor devices, includes the steps of: depositing an Al alloy film, in which the elements mentioned above are dissolved in an Al matrix, on a substrate; and precipitating part of all of the elements dissolved in the Al matrix as intermetallic compounds by annealing the Al alloy film at an annealing temperature ranging from 150 to 400.degree. C.; whereby an electrode for semiconductor devices which is made of an Al alloy film with an electrical resistivity lower than 20 .mu..OMEGA.cm is obtained. The target is made of an Al alloy containing the above elements.

    摘要翻译: 公开了一种能够抑制小丘的产生和降低电阻率的半导体器件用电极,其适用于使用薄膜晶体管的有源矩阵液晶显示器等; 其制作方法; 以及用于形成半导体器件用电极膜的溅射靶。 用于半导体器件的电极由含有一种或多种选自Fe,Co,Ni,Ru,Rh和Ir的合金元素的Al合金制成,总量为0.1至10原子%,或选择一种或多种合金元素 来自稀土元素,总量为0.05〜15原子%。 制造半导体器件的电极的方法包括以下步骤:在基底上沉积上述元素溶解在Al基体中的Al合金膜; 并通过在150-400℃的退火温度下退火Al合金膜,将溶解在Al基体中的所有元素的一部分沉淀为金属间化合物。 由此获得由电阻率小于20微米欧米伽厘米的Al合金膜制成的半导体器件用电极。 目标由含有上述元素的Al合金制成。

    LEAD-FREE SOLDER FLUX AND LEAD-FREE SOLDER PASTE
    8.
    发明申请
    LEAD-FREE SOLDER FLUX AND LEAD-FREE SOLDER PASTE 有权
    无铅焊枪和无铅焊膏

    公开(公告)号:US20130276937A1

    公开(公告)日:2013-10-24

    申请号:US13989917

    申请日:2011-12-16

    IPC分类号: B23K35/02 B23K35/362

    摘要: A principal object of the present invention is to provide a flux which can be used to produce a lead-free solder paste which is excellent in viscosity stability and exhibits excellent wettability at the time of soldering even in atmospheric air. The flux is a lead-free solder flux having a bromine atom concentration of 400 to 20000 ppm based on 0.1 g of the flux and comprising 0.01 to 0.7% by weight of an amine compound (a) represented by the general formula (1): H2N—(CH2)n—X—(CH2)n—NH2 (wherein n represents an integer of 1 to 6 and X represents —NH—CH2CH2—NH— or a piperazine residue).

    摘要翻译: 本发明的主要目的是提供可用于生产粘度稳定性优异且在大气中甚至在焊接时具有优异润湿性的无铅焊膏的焊剂。 焊剂是基于0.1g焊剂的溴原子浓度为400〜20000ppm的无铅焊剂,含有0.01〜0.7重量%的通式(1)表示的胺化合物(a): H2N-(CH2)nX-(CH2)n-NH2(其中n表示1〜6的整数,X表示-NH-CH2CH2-NH-或哌嗪残基)。

    Onion-like carbon film and its production

    公开(公告)号:US06599492B2

    公开(公告)日:2003-07-29

    申请号:US09818594

    申请日:2001-03-28

    IPC分类号: C01B3102

    摘要: An onion-like carbon thin film is provided which contains carbon as a main component, has a film thickness of at least 20 nm or more, and has clusters of an onion-like structure. Specifically, there is provided the onion-like carbon thin film satisfying the foregoing requirements, and in which (1) at least 20 or more clusters each having a diameter of 4 nm or more, and having an onion-like structure are contained per 0.001 &mgr;m2; or (2) the proportion of clusters each having an onion-like structure in a matrix is at least 50% by volume or more. The onion-like carbon thin film of the present invention is very useful in terms of availability in various industrial fields as a hard protective film or a solid lubricating film of the surface in various machine parts, electronic parts, and the like, or as a field electron emission material, or the like, an electronic part of a field emission display, or the like.