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    MULTILAYER FILM REFLECTOR
    2.
    发明申请
    MULTILAYER FILM REFLECTOR 审中-公开
    多层膜反射器

    公开(公告)号：US20090252977A1

    公开(公告)日：2009-10-08

    申请号：US12416544

    申请日：2009-04-01

    申请人： Seiken Matsumoto ,  Kenji Ando ,  Hidehiro Kanazawa ,  Koji Teranishi ,  Takayuki Miura ,  Kyoko Nagata

    发明人： Seiken Matsumoto ,  Kenji Ando ,  Hidehiro Kanazawa ,  Koji Teranishi ,  Takayuki Miura ,  Kyoko Nagata

    IPC分类号： B32B15/04

    CPC分类号： B82Y10/00 ,  G02B5/0891 ,  G21K1/062 ,  G21K2201/067

    摘要： A stress distribution resulting from variation in in-plane film quality of a stress relaxation layer and a reflective layer is eliminated. A reflective layer is stacked on a substrate via a stress relaxation layer. The stress relaxation layer has a stress relaxation portion having a uniform film thickness distribution to cancel the internal stress of the reflective layer, and a stress distribution eliminating portion with a film thickness distribution approximated to a second order even function. The stress is substantially proportional to the film thickness. Thus, formation of a given film thickness distribution allows the stress distribution to be controlled. However, changing the film thickness distribution based on a design value may degrade the optical characteristics. Thus, the film thickness distribution of the stress distribution eliminating portion, which serves to eliminate the stress distribution, is approximated to the second order even function. This enables aberration associated with the film thickness distribution to be reduced by adjusting an optical system.

    摘要翻译： 消除了由应力松弛层和反射层的面内膜质量的变化引起的应力分布。 反射层通过应力松弛层堆叠在基板上。 应力缓和层具有均匀的薄膜厚度分布的应力松弛部，以抵消反射层的内部应力，以及具有近似于二次偶次函数的膜厚分布的应力分布消除部。 应力基本上与膜厚成正比。 因此，形成给定的膜厚度分布允许控制应力分布。 然而，基于设计值改变膜厚度分布可能降低光学特性。 因此，用于消除应力分布的应力分布消除部分的膜厚度分布近似于二阶偶函数。 通过调整光学系统，能够降低与膜厚分布有关的像差。

    FILM-FORMING APPARATUS AND FILM-FORMING METHOD
    3.
    发明申请
    FILM-FORMING APPARATUS AND FILM-FORMING METHOD 有权
    薄膜成型装置和成膜方法

    公开(公告)号：US20120199471A1

    公开(公告)日：2012-08-09

    申请号：US13359802

    申请日：2012-01-27

    申请人： Seiken Matsumoto ,  Seiji Kuwabara

    发明人： Seiken Matsumoto ,  Seiji Kuwabara

    IPC分类号： C23C14/34

    CPC分类号： C23C14/3407 ,  C23C14/3428 ,  C23C14/3464 ,  C23C14/352 ,  H01J37/3417 ,  H01J37/3429 ,  H01J37/3447

    摘要： Provided are a film-forming apparatus and a film-forming method capable of preventing complication of an apparatus mechanism in formation of a thin film of multiple materials by sputtering to simplify the apparatus mechanism and preventing an increase in an apparatus cost. The film-forming apparatus includes a vacuum chamber, a substrate holder for holding a substrate, cathode mechanisms for supporting targets respectively so that the targets can be opposed to the substrate in the vacuum chamber, and shutters movable forward and backward individually between the targets made of different materials and the substrate to block or pass film-forming particles generated from the targets. At least one of the shutters is formed of a target material different from those for the targets so that the at least one of the shutters is configured as a shutter that also functions as a target.

    摘要翻译： 提供一种成膜装置和成膜方法，能够通过溅射来防止形成多种材料的薄膜的装置机构的复杂化，从而简化装置机构并防止装置成本的增加。 成膜装置包括真空室，用于保持基板的基板保持器，用于分别支撑目标的阴极机构，使得靶可以与真空室中的基板相对，以及在所制成的目标之间单独地向前和向后移动的百叶窗 的不同材料和基材以阻挡或通过由靶产生的成膜颗粒。 百叶窗中的至少一个由与目标材料不同的目标材料形成，使得至少一个快门被配置为也用作目标的快门。

    Film-Forming apparatus and Film-Forming method
    4.
    发明授权
    Film-Forming apparatus and Film-Forming method 有权
    成膜装置和成膜方法

    公开(公告)号：US09127353B2

    公开(公告)日：2015-09-08

    申请号：US13359802

    申请日：2012-01-27

    申请人： Seiken Matsumoto ,  Seiji Kuwabara

    发明人： Seiken Matsumoto ,  Seiji Kuwabara

    IPC分类号： C23C14/34 ,  C23C14/35 ,  H01J37/34

    CPC分类号： C23C14/3407 ,  C23C14/3428 ,  C23C14/3464 ,  C23C14/352 ,  H01J37/3417 ,  H01J37/3429 ,  H01J37/3447

    摘要： Provided are a film-forming apparatus and a film-forming method capable of preventing complication of an apparatus mechanism in formation of a thin film of multiple materials by sputtering to simplify the apparatus mechanism and preventing an increase in an apparatus cost. The film-forming apparatus includes a vacuum chamber, a substrate holder for holding a substrate, cathode mechanisms for supporting targets respectively so that the targets can be opposed to the substrate in the vacuum chamber, and shutters movable forward and backward individually between the targets made of different materials and the substrate to block or pass film-forming particles generated from the targets. At least one of the shutters is formed of a target material different from those for the targets so that the at least one of the shutters is configured as a shutter that also functions as a target.

    摘要翻译： 提供一种成膜装置和成膜方法，能够通过溅射来防止形成多种材料的薄膜的装置机构的复杂化，从而简化装置机构并防止装置成本的增加。 成膜装置包括真空室，用于保持基板的基板保持器，用于分别支撑目标的阴极机构，使得靶可以与真空室中的基板相对，以及在所制成的目标之间单独地向前和向后移动的百叶窗 的不同材料和基材以阻挡或通过由靶产生的成膜颗粒。 百叶窗中的至少一个由与目标材料不同的目标材料形成，使得至少一个快门被配置为也用作目标的快门。