摘要:
An optical device that includes a low refractive index film is produced at a low cost. To attain this object, in a process of producing an optical device that includes a multilayer film in which low refractive index films and high refractive index films are alternately laminated, a porous film is formed on a substrate by a sputtering deposition system which uses a target unit. The porous film is immersed in a liquid to lower the refractive index of the film. By forming in simple steps a low refractive index film that is lower in refractive index than conventionally used films, a high quality optical device can be obtained at a low cost.
摘要:
An antireflection film includes alternately deposited high-refractive-index layers and low-refractive-index layers. The refractive indexes and extinction coefficients of the layers are such that the antireflection film exhibits sufficient antireflection characteristics even if the geometrical thickness thereof is small. An optical element having the antireflection film on a substrate exhibits high transmittance and has excellent optical characteristics.
摘要:
An antireflection film includes alternately deposited high-refractive-index layers and low-refractive-index layers. The refractive indexes and extinction coefficients of the layers are such that the antireflection film exhibits sufficient antireflection characteristics even if the geometrical thickness thereof is small. An optical element having the antireflection film on a substrate exhibits high transmittance and has excellent optical characteristics.
摘要:
In a plasma CVD system comprises a reactor the inside of which can be evacuated, a substrate holding means provided in the reactor, a material gas feed means for feeding into the reactor a material gas for plasma CVD, a high-frequency power supply means for supplying to a plasma-producing high-frequency electrode a high-frequency power having an oscillation frequency in the range of from 30 MHz to 600 MHz, generated by a high-frequency power source, and an exhaust means for exhausting a gas remaining in the reactor after the reaction; the high-frequency power generated in the high-frequency power source being supplied to the plasma-producing high-frequency electrode to cause a plasma to take place across a substrate held by the substrate holding means and the plasma-producing high-frequency electrode to form a deposited film on the substrate; the phase of reflected power is adjusted on the plasma-producing high-frequency electrode at its part on the opposite side of the feeding point. High-quality deposited films having a very uniform film thickness and a homogeneous film quality can be formed at a high rate and stably on large-area substrates having any shapes, to obtain semiconductor devices in a good efficiency.
摘要:
A high frequency introducing means is provided which comprises a high frequency electrode having a shape of a bar or plate for generating plasma by high frequency power, and an adjustment mechanism for adjusting an absolute value of reactance between an end of the electrode opposite to a high frequency power introducing point of the electrode and a grounded portion. A plasma treatment apparatus and a plasma treatment method are also provided employing the above high frequency introducing means. A deposition film of high quality is formed stably and efficiently in an extremely uniform thickness and an extremely uniform quality at a high speed on a base member of a large area by adjusting the absolute value of the reactance.
摘要:
A plasma processing apparatus has a substrate holder, arranged in a reaction vessel which can be reduced in pressure, for placing a substrate to be processed thereon, means for feeding a process gas into the reaction vessel, and a cathode electrode for supplying a high-frequency wave power from a high-frequency wave power source to an interior of the reaction vessel through a matching circuit, and is characterized in that at least a part of the reaction vessel is constituted by a dielectric member, and the cathode electrode is arranged outside the reaction vessel, so that a plasma distribution in the reaction vessel is made uniform, and a uniform plasma process for a substrate to be processed is made possible. The plasma process includes CVD, sputtering, etching or ashing.
摘要:
An optical element for X-ray includes a substrate, a first multilayer film having a reflection property with respect to light in a soft X-ray wavelength range, and a second multilayer film, disposed between the substrate and the first multilayer film, for reducing film stress of the first multilayer film. The second multilayer film has a periodic structure having a unit period film thickness which is 90% or more and less than 110% of a two or more integral multiple of 7 nm.
摘要:
A deposition apparatus generates plasma by applying voltage to a target, deposits target's particles that are vaporized by the plasma onto a surface of an object, and forms a thin film onto the surface of the object, and also includes a plasma direction unit that directs the plasma generated by the application of the voltage.
摘要:
Provided is a method of producing an optical element forming mold, the method including forming a ta-C film 12 on a mold matrix 10 for an optical element forming mold by an FCVA process, in which the mold matrix 10 is kept at a floating potential, a voltage is applied to a mold matrix-holding member 2 for holding the mold matrix via insulating members (3a,3b), and a magnet 4 internally provided in the mold matrix forms a magnetic field for applying a magnetic force in a normal direction of a transfer surface of the mold matrix so as to follow a magnetic force applied by a filter coil 22, thereby homogenizing the film quality.
摘要:
A stress distribution resulting from variation in in-plane film quality of a stress relaxation layer and a reflective layer is eliminated. A reflective layer is stacked on a substrate via a stress relaxation layer. The stress relaxation layer has a stress relaxation portion having a uniform film thickness distribution to cancel the internal stress of the reflective layer, and a stress distribution eliminating portion with a film thickness distribution approximated to a second order even function. The stress is substantially proportional to the film thickness. Thus, formation of a given film thickness distribution allows the stress distribution to be controlled. However, changing the film thickness distribution based on a design value may degrade the optical characteristics. Thus, the film thickness distribution of the stress distribution eliminating portion, which serves to eliminate the stress distribution, is approximated to the second order even function. This enables aberration associated with the film thickness distribution to be reduced by adjusting an optical system.