摘要:
An aberration of a projection exposing apparatus system is measured from the difference between widths of both-end lines even in a fine pattern having a pattern line width of less than 0.2 .mu.m. A resist film on a substrate is exposed to light, using a mask having a line-and-space (LS) pattern. This exposure is repeated plural times at plural exposures, so as to obtain, at the respective exposures, the differences between the widths of the both-end lines of the line-and-space pattern. The difference between the widths of the both-end lines at a standard (optimal) exposure is estimated from the relationship between the differences between the widths of the both-end lines and the exposures, so as to obtain an aberration at the standard exposure.
摘要:
The exposure device includes a polarizing plate and an illumination diaphragm. The polarizing plate is located in an optical path between a light source and a photomask, serving as a polarizing unit that polarizes an illuminating light from the light source in the first and the second direction orthogonal to the optical axis. The illumination diaphragm is a so-called quadruple illumination diaphragm, which includes four openings. The first opening and the second opening are located on a straight line running parallel to a third direction perpendicular to the optical axis and passing the center point of the illumination diaphragm, across the center point from each other. Likewise, the third opening and the fourth opening are located on a straight line running parallel to a fourth direction perpendicular to the optical axis and passing the center point, across the center point from each other.
摘要:
This invention provides an acoustic vibrational material containing various fibers as the reinforcement material and having the epoxy resin as the matrix resin, wherein the epoxy resin is modified by a polybutadiene base elastomer containing not less than 90 mole percent of 1,2-linked units. The epoxy resin modified with the above polybutadiene elastomer exhibits a maximum value of loss coefficient at the temperature region near the room temperature. This region is much higher than that of the conventional epoxy resin modified with polybutadiene elastomer mainly including 1,4-linked unit. Decrease in elastic modulus of the epoxy resin with increase of temperature is lesser in the epoxy resin of the present invention, whereas larger in the conventional one. Thus compatibility between large internal loss and high elastic modulus is achieved.
摘要:
A method for producing cutting tools incorporated in the present invention is carried out as follows: a shank portion and a drill portion are formed separately such that the inner diameter of a hole made in the shank portion is slightly smaller than the outer diameter of the drill portion. The rear of the drill portion is forcibly inserted into the hole of the shank portion at normal temperature which is room temperature. The diameter of the inner wall of the hole is thereby enlarged, resulting in a tight fitting. After the insertion of the drill portion in the shank portion, the drill portion may be ground to form a drill edge. Before the insertion of the drill portion in the shank portion, the shank portion may be quenched under vacuum or the like, or the surface of the shank portion may be hardened by nitriding.
摘要:
An exposure photomask which transfers a desired pattern onto a semiconductor substrate S, which has a step, has a region formed by a light-blocking film and a region formed by a translucent film. The ideal optical path difference between exposure light that passes through the translucent film and exposure light that passes through a completely transparent part and the ideal mask pattern size are determined based on the step in the semiconductor substrate, and on the desired pattern size, the pattern being formed in accordance with the ideal optical path difference and ideal mask pattern size. The thickness of the translucent film is established so that the optical path difference between exposure light that passes through the translucent film and the exposure light that passes through a completely transparent part is approximately equal to the step in the semiconductor substrate.
摘要:
A photomask is to be used for exposure of a semiconductor wafer with the dipole illumination light, and includes a main opening, a first assist opening, a second assist opening, a third assist opening and a fourth assist opening. Each of the assist openings is located so that the central point thereof is deviated from both of a first straight line parallel to a first direction and passing the central point of the main opening, and a second straight line parallel to a second direction and passing the central point of the main opening. Here, the first direction is the direction among in-plane directions of the photomask that is parallel to an alignment direction of an effective light source distribution of the dipole illumination light. Also, the second direction is the direction among in-plane directions of the photomask that is perpendicular to the alignment direction.
摘要:
The exposure device includes a polarizing plate and an illumination diaphragm. The polarizing plate is located in an optical path between a light source and a photomask, serving as a polarizing unit that polarizes an illuminating light from the light source in the first and the second direction orthogonal to the optical axis. The illumination diaphragm is a so-called quadruple illumination diaphragm, which includes four openings. The first opening and the second opening are located on a straight line running parallel to a third direction perpendicular to the optical axis and passing the center point of the illumination diaphragm, across the center point from each other. Likewise, the third opening and the fourth opening are located on a straight line running parallel to a fourth direction perpendicular to the optical axis and passing the center point, across the center point from each other.
摘要:
There is provided a method of measuring spherical aberration in a projection system in which a mask pattern is projected in a reduced scale with a light having a wavelength of &lgr;, including the steps of (a) projecting a first mask pattern onto a photosensitive object in a reduced scale, the first mask pattern being defined by light-permeable portions and light-impermeable portions each sandwiched between the light-permeable portions, each of the light-permeable portions having a width equal to the wavelength &lgr;, (b) projecting a second mask pattern onto the photosensitive object in a reduced scale, the second mask pattern being defined by light-permeable portions and light-impermeable portions each sandwiched between the light-permeable portions. each of the light-permeable portions having a width equal to &lgr;/2, (c) exposing the photosensitive object to the light having a wavelength of &lgr;, and developing the photosensitive object, (d) measuring a first location of the photosensitive object at which a width of the light-impermeable portions of the first mask pattern is focused in a minimum, and a second location of the photosensitive object at which a width of the light-impermeable portions of the second mask pattern is focused in a minimum, and (e) measuring spherical aberration, based on the first and second locations. The method makes it possible to accurately measure spherical aberration in a projection system through the use of Levenson type mask patterns having different sizes.
摘要:
A method of aligning a mask pattern and a wafer pattern by referring to alignment marks on chips is provided wherein all of the chips to be used for alignment are classified into a plurality of groups so that the shot array alignment is carried out by referring to the alignment marks which are provided at different positions in individual chips. The alignment marks and chip positions for the alignment marks are different for each of the groups.
摘要:
There is provided a pattern division method to form crowded patterns accurately on a substrate includes acquiring a mask pattern, dividing a predetermine area into a plurality of areas to prepare a division pattern in which the plurality of the areas are classified into first and second groups, generating a reduced mask pattern by reducing each of two or more patterns laid out in the object mask pattern substantially toward the center of the particular pattern, overlapping the division pattern with the reduced mask pattern and extracting the reduced patterns overlapped with the area classified as the first group of the division pattern to generate a first reduced mask pattern, and restoring the reduced patterns laid out in the first reduced mask pattern to the original size before generation of the reduced mask pattern.