摘要:
According to one embodiment, there is provided a camera module formed with substantially the same scale as a chip of an image sensor, includes a lens held by a lens holder, an image sensor placed in a position in which an image is formed by the lens, and a wiring board disposed between the lens and the image sensor and electrically connected to the image sensor. An opening that permits light entering the image sensor to pass therethrough is formed in the wiring board. Further, a passive component is contained in the wiring board.
摘要:
According to one embodiment, an apparatus which records a signal in a recording medium in which information is written by using a first laser having a first wavelength and from which information is read by using a second laser having a second wavelength longer than that of the first laser, a signal is recorded in the recording medium by using the first laser, and a control section reproduces the signal recorded with the first laser and measures a first amount that is used to calculate a target value for optimization of recording conditions, reproduces a signal recorded with the second laser and measures a second amount for optimization of a reproduction signal, compares the first amount with the second amount, and determines the first amount under the recording conditions where the second amount becomes optimum as a target value for optimization of the recording conditions.
摘要:
One embodiment of the invention, a BCA signal is reproduced properly from a BCA while inhibiting influences properly from a groove contained in a reproduction signal, when a signal is reproduced from an additional writing type optical disk provided with the groove by cutting the DC component of an envelop detected from the BCA signal by an AC coupling section and then comparing with a predetermined threshold with a comparator.
摘要:
There is disclosed a method for fabricating a camera module includes the steps of: disposing a camera module body inside of a die; filling the die with a resin blocking a light; curing the resin; and removing the camera module body and the resin from the die. Here, disposing the camera module body inside of the die is disposing the camera module body having a lens holder secured on a sensor board inside of the die in such a manner that the side surface of the camera module body is not brought into contact with the side surface of the die. Filling the die with the resin is covering the upper end of the die with a lid so as to closely enclose the inside of the die, followed by filling the die with the resin. Taking the camera module body and the resin from the die is taking, from the die, the camera module body and the resin formed around the camera module body in close contact.
摘要:
An optical head includes: a first optical element having an optical characteristic of reflecting a light of a first wavelength and transmitting lights of second and third wavelengths, on the first optical element the light of the first wavelength from a first light source being incident; and a second optical element having an optical characteristic of transmitting the light of the first wavelength, reflecting the light of the second or the third wavelength in a first polarization state and transmitting the light of the second or the third wavelength in a second polarization state, a first surface on which the light reflected by the first optical element is incident, a second surface on which the lights of the second and the third wavelengths from second and third light sources are incident, and a third surface emitting the first, the second and the third lights incident from the first and the second surfaces.
摘要:
According to one embodiment, there is provided a camera module formed with substantially the same scale as a chip of an image sensor, includes a lens held by a lens holder, an image sensor placed in a position in which an image is formed by the lens, and a wiring board disposed between the lens and the image sensor and electrically connected to the image sensor. An opening that permits light entering the image sensor to pass therethrough is formed in the wiring board. Further, a passive component is contained in the wiring board.
摘要:
According to one embodiment, an optical head device provides a signal processing circuit which sets a control amount to move an objective lens so that a distance between the objective lens and a given recording layer of the an optical disc coincides with a focal position, an optical path length correction mechanism which corrects an influence of an aberration component producing an error in the focal distance, a thickness difference detection circuit which finds an amount of correction to be made by the optical path length, and an aberration correction circuit which generates a correction signal to correct the influence of the aberration component producing the error in the focal distance detected by the thickness difference detection circuit, and supplies the correction signal to the optical path length correction mechanism.
摘要:
According to one embodiment, a holographic diffraction element is divided into a plurality of regions which diffract reflected light from an optical recording medium to a plurality of photodetectors. Diffracted light for detecting a focus error signal and a compensation signal for a tracking error signal is obtained from one or more common regions of the plurality of regions.