摘要:
A thermal fixing device for an image forming apparatus is disclosed which comprises a heater for heating a piece of developer sheet to thermally fix and accelerate coloring of the image on the developer sheet, a sheet delivery path along which the developer sheet is delivered, a cover casing for substantially covering the heater, and a suction/discharge unit for sucking/discharging a gas generated from the developer sheet by the heater. The suction/discharge unit is connected to the cover casing.
摘要:
A thermal fixing unit provided with gas purification means for use in an image recording medium. The gas purification means traps gaseous component released from a developer sheet upon heating thereof. The purification means includes a duct body disposed to surround a main frame of the thermal fixing unit, a support body having one end connected to the duct body, a fluid passage being defined between the main frame and the duct body, and the fluid passage being connected between the one end of the support body and sheet inlet and sheet outlet of the thermal fixing unit, the gas venting fan rotatably provided at the support body for sucking fluid in the main frame through the sheet inlet, the sheet outlet and the fluid passage, and a filter member disposed in the support body for trapping the gaseous component released from the developer sheet.
摘要:
In a sheet heating device for heat-fixing an image on a sheet comprising a sheet guide plate for guiding a sheet therethrough, a pair of sheet feed rollers provided at the upstream of the sheet guide plate for supplying the sheet to the sheet guide plate, a pair of sheet discharge rollers provided at the downstream of the sheet guide plate for discharging the sheet to an outside, and a cover case including a heater for heating air and heating the sheet with the heated air and a blower fan for circulating the heated air through the inner portion of the cover case and the sheet guide plate, plural capillary projections having a lower thermal conductivity than the sheet guide plate are provided at least on the front surface of the sheet guide plate to thereby prevent the sheet from directly contacting the sheet guide plate, or an arcuate member is provided in the cover case to homogeneously guide the heated air over the sheet guide plate to thereby homogeneously heat-fix an image on the sheet.
摘要:
A sheet heating device for heating a developer sheet to fix an output image formed thereon. The sheet heating device includes a guide plate and a cover member to define an internal space therebetween. Within the space, a heater and a fan is provided. The fan generate circulating hot air stream which is directed in a traveling direction of the developer sheet. The hot air has a transversal width substantially the same as a transverse length of the developer sheet.
摘要:
An image recording apparatus having an exposure unit, a pressure developing unit and a thermal fixing unit. The apparatus employs a separate type image recording mediums including a microcapsule sheet and a separate developer sheet. The thermal fixing unit applies heat to the developer sheet carrying an output image thereon. A heat application means of the thermal fixing unit is positioned spaced away from the imaging surface of the developer sheet for avoding direct contact therewith.
摘要:
A color copying machine has a sheet heating device for heating a color developer sheet while the sheet is being fed. The sheet heating device includes a sheet feed path along which the sheet is fed, a heater unit spaced from the sheet feed path, and a sheet protective member of an insulating material disposed between the sheet feed path and the heater unit. The sheet protective member has a plurality of holes defined therein for passing radiant heat from the heater unit toward the sheet feed path. The sheet protective member may comprise a mesh screen of intersecting filaments or a punched iron sheet.
摘要:
A sheet heating device having heat insulators for preventing at least one of sheet feeding roller and sheet discharge roller from being overheated. The sheet heating device includes a delivery unit for delivering a piece of sheet, a heating unit for heating the sheet on a delivery path of the sheet, a cover member for covering the heating unit and opening on a feed side and a discharge side of the sheet, respectively, and two pairs of rollers adapted to close respective openings of the cover member. The pair of rollers serve as heat insulators for avoiding overheating to the sheet feeding and discharging rollers. Shutter members are also available for heat insulation. The shutter members also serve to confine hot air within an interior of the heating device.
摘要:
A plurality of pattern electrodes which are disposed in correspondence with the printing dots are provided on one surface of a substrate biased in one direction. An anisotropic electroconductive element is supported to enable its release on the substrate which has a first turn-on surface contacting the pattern electrodes on its substrate, and a second turn-on surface contacting the electroconductive transfer sheet and exhibiting excellent conductivity between only its first and second turn-on surfaces. In the printing action, electric conduction is achieved on a transfer sheet depending on the printing pattern from the pattern electrodes through the anisotropic element, so that the resistance layer of the sheet may emit heat, thereby the ink contained within the ink layer of the sheet is melted for printing.
摘要:
An epoxy resin composition comprising (A) a naphthalene type epoxy resin in which 35-85 parts by weight of 1,1-bis(2-glycidyloxy-1-naphthyl)alkane and 1-35 parts by weight of 1,1-bis(2,7-diglycidyloxy-1-naphthyl)alkane are included per 100 parts by weight of the resin, (B) a phenolic resin curing agent, (C) a copolymer obtained through addition reaction of alkenyl groups on an alkenyl-containing epoxy compound and SiH groups on an organohydrogenpolysiloxane of 20 to 50 silicon atoms, and (D) an inorganic filler is best suited for semiconductor encapsulation because the cured composition has good thermal cycling, anti-warping, reflow resistance, and moisture-proof reliability.
摘要:
An epoxy resin composition comprising (A) a polyfunctional epoxy resin, (B) a phenolic resin, (C) an inorganic filler, and (D) curing catalyst-containing microcapsules having a mean particle size of 0.5-50 &mgr;m is suited for semiconductor package encapsulation since it minimizes the warpage of packages and has satisfactory catalyst latency, storage stability and cure.