公开(公告)号：US20120034570A1

公开(公告)日：2012-02-09

申请号：US13193220

申请日：2011-07-28

Applicant: Takeshi YASUI ,  Naoya MATSUURA

Inventor： Takeshi YASUI ,  Naoya MATSUURA

IPC: F26B11/02 ,  F27D5/00

CPC classification number: F27B17/0025 ,  F27D3/0084 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742

Abstract: A substrate processing apparatus reduces over-heating of a substrate transfer robot and suppresses deterioration of reliability or lifespan of the substrate transfer robot. The substrate processing apparatus includes a transfer chamber having a substrate transferred thereinto under a negative pressure; a process chamber connected to the transfer chamber and configured to heat the substrate; a transfer robot installed in the transfer chamber and configured to transfer the substrate into and out of the process chamber; and a cooling unit configured to cool an inner wall of the transfer chamber.

Abstract translation: 基板处理装置减少基板传送机器人的过热，并且抑制基板传送机器人的可靠性或寿命的劣化。 基板处理装置包括在负压下转印有基板的转印室; 连接到所述传送室并被配置为加热所述衬底的处理室; 传送机器人，其安装在所述传送室中并且被配置为将所述基板传入和移出所述处理室; 以及冷却单元，其构造成冷却所述传送室的内壁。

公开(公告)号：US20110311339A1

公开(公告)日：2011-12-22

申请号：US13163165

申请日：2011-06-17

Applicant: Takeshi YASUI ,  Yukitomo HIROCHI ,  Satoshi TAKANO ,  Ritsuo HORII ,  Makoto KAWABATA

Inventor： Takeshi YASUI ,  Yukitomo HIROCHI ,  Satoshi TAKANO ,  Ritsuo HORII ,  Makoto KAWABATA

IPC: H01L21/677

CPC classification number: H01L21/67196 ,  H01J37/32743 ,  H01J37/32788 ,  H01J37/32889 ,  H01J37/32899 ,  H01L21/67201

Abstract: Reduction in cooling rate of a substrate having a lower temperature is suppressed because the substrate having a lower temperature is not affected by radiant heat of a substrate having a higher temperature while cooling a plurality of substrates in a cooling chamber. The substrate processing apparatus includes a load lock chamber configured to accommodate stacked substrates; a first transfer mechanism having a first transfer arm provided with a first end effector, and configured to transfer the substrates into/from the load lock chamber at a first side of the load lock chamber; a second transfer mechanism having a second transfer arm provided with a second end effector, and configured to transfer the substrates into/from the load lock chamber at a second side of the load lock chamber; a barrier installed between the substrates to be spaced apart from the substrates supported by a substrate support provided in the load lock chamber; and a barrier auxiliary unit installed between the substrate support and the barrier, wherein the barrier auxiliary unit is installed at places other than standby spaces of the end effectors.

Abstract translation: 由于具有较低温度的基板在冷却室中冷却多个基板的同时不受具有较高温度的基板的辐射热的影响，因此抑制了具有较低温度的基板的冷却速率的降低。 基板处理装置包括：负载锁定室，被配置为容纳堆叠的基板; 第一传送机构，其具有设置有第一端部执行器的第一传送臂，并且被配置为在所述负载锁定室的第一侧将所述基板传送到所述负载锁定室中或从所述负载锁定室传送; 第二传送机构，具有设置有第二端部执行器的第二传送臂，并且被配置为在所述负载锁定室的第二侧将所述基板传送到所述负载锁定室中或从所述负载锁定室传送; 安装在基板之间的屏障，其与由设置在负载锁定室中的基板支撑件支撑的基板间隔开; 以及安装在基板支撑件和屏障之间的屏障辅助单元，其中屏障辅助单元安装在末端执行器的备用空间以外的位置。