公开(公告)号：US5583381A

公开(公告)日：1996-12-10

申请号：US535956

申请日：1995-09-28

Applicant: Yuji Hara ,  Satoru Ito ,  Tatsuro Toya

Inventor： Yuji Hara ,  Satoru Ito ,  Tatsuro Toya

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/58 ,  H01L29/34 ,  H01L23/48 ,  H01L27/02 ,  H01L29/40

CPC classification number: H01L23/3171 ,  H01L23/291 ,  H01L23/585 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181

Abstract: A resin molded type semiconductor device has a metallic guard ring that is formed to cover the peripheral edge of the surface of a tetragonal semiconductor substrate. In order to prevent a passivation film on the guard ring from being cracked by stresses due to a resin mold package concentrating in the four corners of the semiconductor substrate, slits or rows of small holes are formed in the corner portions of the guard ring.

Abstract translation: 树脂模制型半导体器件具有形成为覆盖四边形半导体衬底的表面的周缘的金属保护环。 为了防止保护环上的钝化膜由于聚集在半导体衬底的四个角中的树脂模具封装而受到应力的破坏，在保护环的角部形成有狭缝或一排小孔。

公开(公告)号：US5468998A

公开(公告)日：1995-11-21

申请号：US293559

申请日：1994-08-22

Applicant: Yuji Hara ,  Satoru Ito ,  Tatsuro Toya

Inventor： Yuji Hara ,  Satoru Ito ,  Tatsuro Toya

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/58 ,  H01L29/34 ,  H01L23/48 ,  H01L27/02 ,  H01L29/40

CPC classification number: H01L23/3171 ,  H01L23/291 ,  H01L23/585 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181

Abstract: A resin molded type semiconductor device has a metallic guard ring that is formed to cover the peripheral edge of the surface of a tetragonal semiconductor substrate. In order to prevent a passivation film on the guard ring from being cracked by stresses due to a resin mold package concentrating in the four corners of the semiconductor substrate, slits or rows of small holes are formed in the corner portions of the guard ring.

公开(公告)号：US5229642A

公开(公告)日：1993-07-20

申请号：US703765

申请日：1991-05-21

Applicant: Yuji Hara ,  Satoru Ito ,  Tatsuro Toya

Inventor： Yuji Hara ,  Satoru Ito ,  Tatsuro Toya

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/58

CPC classification number: H01L23/585 ,  H01L23/291 ,  H01L23/3171 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181

Abstract: A resin molded type semiconductor device has a metallic guard ring that is formed to cover the peripheral edge of the surface of a tetragonal semiconductor substrate. In order to prevent a passivation film on the guard ring from being cracked by stresses due to a resin mold package concentrating in the four corners of the semiconductor substrate, slits or rows of small holes are formed in the corner portions of the guard ring.

Abstract translation: 树脂模制型半导体器件具有形成为覆盖四边形半导体衬底的表面的周缘的金属保护环。 为了防止保护环上的钝化膜由于聚集在半导体衬底的四个角中的树脂模具封装而受到应力的破坏，在保护环的角部形成有狭缝或一排小孔。

公开(公告)号：US5539257A

公开(公告)日：1996-07-23

申请号：US456942

申请日：1995-06-01

Applicant: Yuji Hara ,  Satoru Ito ,  Tatsuro Toya

Inventor： Yuji Hara ,  Satoru Ito ,  Tatsuro Toya

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/58 ,  H01L27/02 ,  H01L23/48 ,  H01L29/34 ,  H01L29/44

CPC classification number: H01L23/3171 ,  H01L23/291 ,  H01L23/585 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181

Abstract: A resin molded type semiconductor device has a metallic guard ring that is formed to cover the peripheral edge of the surface of a tetragonal semiconductor substrate. In order to prevent a passivation film on the guard ring from being cracked by stresses due to a resin mold package concentrating in the four corners of the semiconductor substrate, slits or rows of small holes are formed in the corner portions of the guard ring.

公开(公告)号：US4625227A

公开(公告)日：1986-11-25

申请号：US744151

申请日：1985-06-13

Applicant: Yuji Hara ,  Satoru Ito ,  Tatsuro Toya

Inventor： Yuji Hara ,  Satoru Ito ,  Tatsuro Toya

IPC: H01L21/822 ,  H01L21/31 ,  H01L21/3205 ,  H01L23/29 ,  H01L23/31 ,  H01L23/52 ,  H01L23/58 ,  H01L27/04 ,  H01L29/40 ,  H01L23/48 ,  H01L27/02 ,  H01L29/34

CPC classification number: H01L23/585 ,  H01L23/291 ,  H01L23/3171 ,  H01L24/05 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181

Abstract: A resin molded type semiconductor device has a metallic guard ring that is formed to cover the peripheral edge of the surface of a tetragonal semiconductor substrate. In order to prevent a passivation film on the guard ring from being cracked by stresses due to a resin mold package concentrating in the four corners of the semiconductor substrate, slits or rows of small holes are formed in the corner portions of the guard ring.

Abstract translation: 树脂模制型半导体器件具有形成为覆盖四边形半导体衬底的表面的周缘的金属保护环。 为了防止保护环上的钝化膜由于聚集在半导体衬底的四个角中的树脂模具封装而受到应力的破坏，在保护环的角部形成有狭缝或一排小孔。

公开(公告)号：US5087915A

公开(公告)日：1992-02-11

申请号：US459531

申请日：1990-01-02

Applicant: Tatsuro Toya

Inventor： Tatsuro Toya

IPC: H03M1/12 ,  G06F3/05

CPC classification number: G06F3/05

Abstract: A single-chip microcomputer is comprised of an analog to digital converter, a first external terminal which receives an analog signal which is to be converted by the analog to digital converter, and a second external terminal for receiving a signal indicating an operating condition of the analog to digital converter.

Abstract translation: 单片微型计算机由模拟数字转换器构成，第一外部端子接收要由模数转换器转换的模拟信号，第二外部端子用于接收指示信号的操作状态的信号 模数转换器。

公开(公告)号：US5023699A

公开(公告)日：1991-06-11

申请号：US419007

申请日：1989-10-10

Applicant: Yuji Hara ,  Satoru Ito ,  Tatsuro Toya

Inventor： Yuji Hara ,  Satoru Ito ,  Tatsuro Toya

IPC: H01L21/822 ,  H01L21/31 ,  H01L21/3205 ,  H01L23/29 ,  H01L23/31 ,  H01L23/52 ,  H01L23/58 ,  H01L27/04 ,  H01L29/40

CPC classification number: H01L23/585 ,  H01L23/291 ,  H01L23/3171 ,  H01L24/05 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181

Abstract: A resin molded type semiconductor device has a metallic ring that is formed to cover the peripheral edge of the surface of a tetragonal semiconductor substrate. In order to prevent a passivation film on the ring from being cracked by stresses due to a resin mold package concentrating in the four corners of the semiconductor substrate, slits or rows of small holes are formed in the corner portions of the ring.

公开(公告)号：US5552639A

公开(公告)日：1996-09-03

申请号：US456384

申请日：1995-06-01

Applicant: Yuji Hara ,  Satoru Ito ,  Tatsuro Toya

Inventor： Yuji Hara ,  Satoru Ito ,  Tatsuro Toya

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/58 ,  H01L27/02 ,  H01L23/48 ,  H01L29/34 ,  H01L29/44

CPC classification number: H01L23/585 ,  H01L23/291 ,  H01L23/3171 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181

Abstract: A resin molded type semiconductor device has a metallic guard ring that is formed to cover the peripheral edge of the surface of a tetragonal semiconductor substrate. In order to prevent a passivation film on the guard ring from being cracked by stresses due to a resin mold package concentrating in the four corners of the semiconductor substrate, slits or rows of small holes are formed in the corner portions of the guard ring.

公开(公告)号：US5371411A

公开(公告)日：1994-12-06

申请号：US072405

申请日：1993-06-07

Applicant: Yuji Hara ,  Satoru Ito ,  Tatsuro Toya

Inventor： Yuji Hara ,  Satoru Ito ,  Tatsuro Toya

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/58 ,  H01L27/02 ,  H01L23/48 ,  H01L29/34 ,  H01L29/44

CPC classification number: H01L23/3171 ,  H01L23/291 ,  H01L23/585 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181

Abstract: A resin molded type semiconductor device has a metallic guard ring that is formed to cover the peripheral edge of the surface of a tetragonal semiconductor substrate. In order to prevent a passivation film on the guard ring from being cracked by stresses due to a resin mold package concentrating in the four corners of the semiconductor substrate, slits or rows of small holes are formed in the corner portions of the guard ring.

Abstract translation: 树脂模制型半导体器件具有形成为覆盖四边形半导体衬底的表面的周缘的金属保护环。 为了防止保护环上的钝化膜由于聚集在半导体衬底的四个角中的树脂模具封装而受到应力的破坏，在保护环的角部形成有狭缝或一排小孔。