公开(公告)号：US5379189A

公开(公告)日：1995-01-03

申请号：US143901

申请日：1993-11-02

Applicant: Terence C. Merriman

Inventor： Terence C. Merriman

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H05K7/02

CPC classification number: H05K3/3442 ,  H05K1/0231 ,  H05K1/111 ,  H05K1/114 ,  H05K2201/0792 ,  H05K2201/09663 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electrical circuit has a substrate and a surface mount capacitor having a connector pad at each end. The substrate has two separate contact pads that are both soldered to the same connector pad on the capacitor. Two further contact pads on the substrate are soldered to the other connector pad on the capacitor. The contact pads on the substrate are connected to tracks that extend to plated-through holes and are electrically connected to one another at a point remote from the capacitor.

Abstract translation: 电路具有基板和表面贴装电容器，每个端部具有连接器焊盘。 衬底具有两个单独的接触焊盘，两个焊盘焊接到电容器上的相同连接器焊盘。 衬底上的另外两个接触焊盘焊接到电容器上的另一个连接器焊盘。 衬底上的接触焊盘连接到延伸到电镀通孔的轨道，并且在远离电容器的点处彼此电连接。