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14 条记录 (耗时 0.041 秒)

    Alkoxycarbonylamino heteroaryl carboxylic acid derivatives as IP antagonists
    6.
    发明授权
    Alkoxycarbonylamino heteroaryl carboxylic acid derivatives as IP antagonists 失效
    作为IP拮抗剂的烷氧基羰基氨基杂芳基羧酸衍生物

    公开(公告)号：US06569860B2

    公开(公告)日：2003-05-27

    申请号：US10086615

    申请日：2002-03-01

    申请人： Francisco Javier Lopez-Tapia ,  Dov Nitzan ,  Counde O'Yang

    发明人： Francisco Javier Lopez-Tapia ,  Dov Nitzan ,  Counde O'Yang

    IPC分类号： C07D4010

    CPC分类号： C07D405/12

    摘要： This invention relates to compounds which are IP receptor antagonists and which are represented by Formula (I): wherein G2 is a heteroaryl group containing one or two nitrogen atoms substituted with a carboxylic acid group, said heteroaryl ring containing one or two nitrogen atoms, and G1 is as defined in the specification; or individual isomers, racemic or non-racemic mixtures of isomers, or pharmaceutically acceptable salts or solvates thereof. The invention further relates to pharmaceutical compositions containing such compounds, methods for their use as therapeutic agents, and methods of preparation thereof.

    摘要翻译： 本发明涉及作为IP受体拮抗剂并由式（I）表示的化合物：其中G 2是含有一个或两个被羧酸基团取代的氮原子的杂芳基，所述杂芳基环含有一个或两个氮原子，和 G1如规范中所定义; 或各异构体，异构体的外消旋或非外消旋混合物，或其药学上可接受的盐或溶剂合物。 本发明还涉及含有这些化合物的药物组合物，其用作治疗剂的方法及其制备方法。

    Method for Manufacturing a Surface Mount Device
    7.
    发明申请
    Method for Manufacturing a Surface Mount Device 有权
    表面贴装装置制造方法

    公开(公告)号：US20160104559A1

    公开(公告)日：2016-04-14

    申请号：US14513568

    申请日：2014-10-14

    申请人： Mario G. Sepulveda ,  Martin G. Pineda ,  Anthony Vranicar ,  Kedar V. Bhatawadekar ,  Minh V. Ngo ,  Dov Nitzan

    发明人： Mario G. Sepulveda ,  Martin G. Pineda ,  Anthony Vranicar ,  Kedar V. Bhatawadekar ,  Minh V. Ngo ,  Dov Nitzan

    IPC分类号： H01C17/00 ,  H01C1/034 ,  H01C7/02

    CPC分类号： H01C1/034 ,  H01C1/1406 ,  H01C7/001 ,  H01C17/02

    摘要： A method of manufacturing a surface mount device includes forming a plaque from a material, forming a plurality of conductive protrusions on a top surface and a bottom surface of the plaque, and applying a liquid encapsulant over at least a portion of the top surface and at least a portion of the bottom surface of the plaque. The liquid encapsulant is cured and when cured encapsulant has an oxygen permeability of less than about 0.4 cm3·mm/m2·atm·day. The assembly is cut to provide a plurality of components. After cutting, the top surface of each component includes at least one conductive protrusion, the bottom surface of each component includes at least one conductive protrusion, the top surface and the bottom surface of each component include the cured encapsulant, and a core of each component includes the material.

    摘要翻译： 一种制造表面贴装装置的方法包括从材料形成斑块，在板的顶表面和底表面上形成多个导电突起，以及在顶表面的至少一部分上以及 斑块底面的至少一部分。 液体密封剂固化，固化后的密封剂的氧气渗透率小于约0.4 cm3·mm / m2·atm·天。 组件被切割以提供多个部件。 在切割之后，每个部件的顶表面包括至少一个导电突起，每个部件的底表面包括至少一个导电突起，每个部件的顶表面和底表面包括固化的密封剂，以及每个部件的芯部 包括材料。