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1.发明授权公开(公告)号：US06432319B1
公开(公告)日：2002-08-13
申请号：US09694604
申请日：2000-10-23
申请人： Terry A. Ring , James A. Dirksen
发明人： Terry A. Ring , James A. Dirksen
IPC分类号： C09K500
CPC分类号： C09K5/047
摘要： An absorption heat pump achieves improved efficiency by lowering the low cycle temperature of the circulation fluid. This is accomplished by adding a crystallization-inhibiting compound to the circulation fluid which substantially depresses the temperature at which the absorbent salt in the fluid begins to crystallize.
摘要翻译： 吸收式热泵通过降低循环流体的低循环温度来提高效率。 这通过向循环流体中加入结晶抑制化合物来实现，其基本上降低了流体中的吸收盐开始结晶的温度。
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2.发明授权Absorption heat pumps having improved efficiency using a crystallization-inhibiting additive 有权使用结晶抑制添加剂的吸收式热泵具有提高的效率公开(公告)号：US06177025B1
公开(公告)日：2001-01-23
申请号：US09193520
申请日：1998-11-17
申请人： Terry A. Ring , James A. Dirksen
发明人： Terry A. Ring , James A. Dirksen
IPC分类号： C09K500
CPC分类号： C09K5/047
摘要： An absorption heat pump achieves improved efficiency by lowering the low cycle temperature of the circulation fluid. This is accomplished by adding a crystallization-inhibiting compound to the circulation fluid which substantially depresses the temperature at which the absorbent salt in the fluid begins to crystallize.
摘要翻译： 吸收式热泵通过降低循环流体的低循环温度来提高效率。 这通过向循环流体中加入结晶抑制化合物来实现，其基本上降低了流体中的吸收盐开始结晶的温度。
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公开(公告)号：US06872328B2
公开(公告)日：2005-03-29
申请号：US09737905
申请日：2000-12-15
IPC分类号： B24B57/02 , B24B37/00 , C09G1/02 , C09K3/14 , H01L21/304 , H01L21/321 , C09K13/00
CPC分类号： C09G1/02 , C09K3/1463 , H01L21/3212
摘要： A method of polishing or planarizing a substrate comprising abrading at least a portion of the surface of a substrate comprising a metal, metal oxide, metal composite, or mixture thereof, with a composition comprising a metal oxide abrasive and a liquid carrier, wherein the composition has a pH of about 7 or less and the metal oxide abrasive has a total surface hydroxyl group density no greater than about 3 hydroxyl groups per nm2.
摘要翻译： 一种抛光或平面化基材的方法，包括用包含金属氧化物研磨剂和液体载体的组合物研磨包含金属，金属氧化物，金属复合物或其混合物的基材表面的至少一部分，其中组合物 具有约7或更低的pH，并且金属氧化物研磨剂的总表面羟基密度不大于约3个羟基/ nm 2。
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公开(公告)号：US06527817B1
公开(公告)日：2003-03-04
申请号：US09625142
申请日：2000-07-25
IPC分类号： B24D302
CPC分类号： C09G1/02 , C09K3/1463 , G11B5/8404 , H01L21/3212
摘要： A composition and a method for planarizing or polishing a surface with the composition are provided. The composition comprises a liquid carrier, a chemical accelerator, and solids comprising about 5-90 wt. % of fumed metal oxide, and about 10-95 wt. % of abrasive particles, wherein about 90% or more of the abrasive particles (by number) have a particle size no greater than 100 nm. The composition of the present invention is useful in planarizing or polishing a surface with high polishing efficiency, uniformity, and removal rate, with minimal defectivity, such as field loss of underlying structures and topography.
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公开(公告)号：US06293848B1
公开(公告)日：2001-09-25
申请号：US09440401
申请日：1999-11-15
IPC分类号： B24B100
CPC分类号： C09K3/1463 , G11B5/8404 , H01L21/3212
摘要： A composition and a method for planarizing or polishing a surface with the composition are provided. The composition comprises a liquid carrier, a chemical accelerator, and solids comprising about 5-90 wt. % of fumed metal oxide, and about 10-95 wt. % of abrasive particles, wherein about 90% or more of the abrasive particles (by number) have a particle size no greater than 100 nm. The composition of the present invention is useful in planarizing or polishing a surface with high polishing efficiency, uniformity, and removal rate, with minimal defectivity, such as field loss of underlying structures and topography.
摘要翻译： 提供了一种用该组合物对表面进行平面化或抛光的组合物和方法。 组合物包含液体载体，化学促进剂和包含约5-90wt。 ％的热解金属氧化物，和约10-95wt。 ％的磨料颗粒，其中约90％或更多的磨料颗粒（数量）具有不大于100nm的粒度。 本发明的组合物可用于以高抛光效率，均匀性和去除速率平坦化或抛光表面，并且具有最小的缺陷性，例如下面的结构和形貌的场损失。
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公开(公告)号：US06716755B2
公开(公告)日：2004-04-06
申请号：US10340561
申请日：2003-01-10
IPC分类号： H01L21302
CPC分类号： C09G1/02 , C09K3/1463 , G11B5/8404 , H01L21/3212
摘要： A composition and a method for planarizing or polishing a surface with the composition are provided. The composition comprises a liquid carrier, a chemical accelerator, and solids comprising about 5-90 wt. % of fumed metal oxide, and about 10-95 wt. % of abrasive particles, wherein about 90% or more of the abrasive particles (by number) have a particle size no greater than 100 nm. The composition of the present invention is useful in planarizing or polishing a surface with high polishing efficiency, uniformity, and removal rate, with minimal defectivity, such as field loss of underlying structures and topography.
摘要翻译： 提供了一种用该组合物对表面进行平面化或抛光的组合物和方法。 组合物包含液体载体，化学促进剂和包含约5-90wt。 ％的热解金属氧化物，和约10-95wt。 ％的磨料颗粒，其中约90％或更多的磨料颗粒（数量）具有不大于100nm的粒度。 本发明的组合物可用于以高抛光效率，均匀性和去除速率平坦化或抛光表面，并且具有最小的缺陷性，例如下面的结构和形貌的场损失。
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公开(公告)号：US06350393B2
公开(公告)日：2002-02-26
申请号：US09428965
申请日：1999-11-04
IPC分类号： C09K1300
CPC分类号： C09K3/1463 , H01L21/31053
摘要： Chemical mechanical polishing compositions including an abrasive and cesium hydroxide and methods for polishing dielectric layers associated with integrated circuits using cesium hydroxide containing polishing compositions.
摘要翻译： 包括研磨剂和氢氧化铯的化学机械抛光组合物和使用含有抛光组合物的氢氧化铯与集成电路相关的介电层的抛光方法。
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公开(公告)号：US06319096B1
公开(公告)日：2001-11-20
申请号：US09440525
申请日：1999-11-15
申请人： Brian L. Mueller , James A. Dirksen
发明人： Brian L. Mueller , James A. Dirksen
IPC分类号： B24B100
CPC分类号： C09K3/1463 , H01L21/30625
摘要： A composition and a method for planarizing or polishing a surface with the composition are provided. The composition comprises about 5-90 wt. % of fumed metal oxide and about 10-95 wt. % of abrasive particles, wherein about 90% or more of the abrasive particles (by number) have a particle size no greater than 100 nm. The composition of the present invention is useful in planarizing or polishing a surface with high polishing efficiency, uniformity, and removal rate, with minimal defectivity, such as field loss of underlying structures and topography.
摘要翻译： 提供了一种用该组合物对表面进行平面化或抛光的组合物和方法。 组合物包含约5-90wt。 热解金属氧化物的％和约10-95wt。 ％的磨料颗粒，其中约90％或更多的磨料颗粒（数量）具有不大于100nm的粒度。 本发明的组合物可用于以高抛光效率，均匀性和去除速率平坦化或抛光表面，并且具有最小的缺陷性，例如下面的结构和形貌的场损失。
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