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公开(公告)号:US06550331B2
公开(公告)日:2003-04-22
申请号:US09947409
申请日:2001-09-07
申请人: Tetsuo Fujii , Masahito Imai
发明人: Tetsuo Fujii , Masahito Imai
IPC分类号: G01P15125
CPC分类号: B81B7/0006 , B81B2201/0235 , C07C303/32 , C07C303/44 , G01C19/56 , G01C19/5656 , G01C19/5719 , G01P15/0802 , G01P15/125 , G01P2015/0817 , G01P2015/0828 , Y10T29/49002 , Y10T29/49004 , C07C309/17
摘要: A semiconductor mechanical sensor having a new structure in which a S/N ratio is improved. In the central portion of a silicon substrate 1, a recess portion 2 is formed which includes a beam structure. A weight is formed at the tip of the beam, and in the bottom surface of the weight in the bottom surface of the recess portion 2 facing the same, an electrode 5 is formed. An alternating current electric power is applied between the weight portion 4 and the electrode 5 so that static electricity is created and the weight is excited by the static electricity. In an axial direction which is perpendicular to the direction of the excitation of the weight, an electrode 6 is disposed to face one surface of the weight and a wall surface of the substrate which faces the same. A change in a capacitance between the facing electrodes is electrically detected, and therefore, a change in a physical force acting in the same direction is detected.
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公开(公告)号:US07685877B2
公开(公告)日:2010-03-30
申请号:US12215884
申请日:2008-06-30
申请人: Tetsuo Fujii , Masahito Imai
发明人: Tetsuo Fujii , Masahito Imai
IPC分类号: G01P15/125
CPC分类号: B81B7/0006 , B81B2201/0235 , C07C303/32 , C07C303/44 , G01C19/56 , G01C19/5656 , G01C19/5719 , G01P15/0802 , G01P15/125 , G01P2015/0817 , G01P2015/0828 , Y10T29/49002 , Y10T29/49004 , C07C309/17
摘要: A semiconductor mechanical sensor having a new structure in which a S/N ratio is improved. In the central portion of a silicon substrate 1, a recess portion 2 is formed which includes a beam structure. A weight is formed at the tip of the beam, and in the bottom surface of the weight in the bottom surface of the recess portion 2 facing the same, an electrode 5 is formed. An alternating current electric power is applied between the weight portion 4 and the electrode 5 so that static electricity is created and the weight is excited by the static electricity. In an axial direction which is perpendicular to the direction of the excitation of the weight, an electrode 6 is disposed to face one surface of the weight and a wall surface of the substrate which faces the same. A change in a capacitance between the facing electrodes is electrically detected, and therefore, a change in a physical force acting in the same direction is detected.
摘要翻译: 具有S / N比提高的新结构的半导体机械传感器。 在硅衬底1的中心部分,形成包括梁结构的凹部2。 在梁的尖端处形成重物,并且在凹部2的底面中的重物的底面中,重物形成为电极5。 在重量部分4和电极5之间施加交流电力,从而产生静电,并且重量被静电激励。 在与重量的激励方向垂直的轴向方向上,电极6设置为面对重物的一个表面和面向其的基板的壁表面。 对面对电极之间的电容变化进行电检测,因此检测到以相同方向作用的物理力的变化。
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公开(公告)号:US07040165B2
公开(公告)日:2006-05-09
申请号:US11062935
申请日:2005-02-22
申请人: Tetsuo Fujii , Masahito Imai
发明人: Tetsuo Fujii , Masahito Imai
IPC分类号: G01P15/125
CPC分类号: B81B7/0006 , B81B2201/0235 , C07C303/32 , C07C303/44 , G01C19/56 , G01C19/5656 , G01C19/5719 , G01P15/0802 , G01P15/125 , G01P2015/0817 , G01P2015/0828 , Y10T29/49002 , Y10T29/49004 , C07C309/17
摘要: A semiconductor mechanical sensor having a new structure in which a S/N ratio is improved. In the central portion of a silicon substrate 1, a recess portion 2 is formed which includes a beam structure. A weight is formed at the tip of the beam, and in the bottom surface of the weight in the bottom surface of the recess portion 2 facing the same, an electrode 5 is formed. An alternating current electric power is applied between the weight portion 4 and the electrode 5 so that static electricity is created and the weight is excited by the static electricity. In an axial direction which is perpendicular to the direction of the excitation of the weight, an electrode 6 is disposed to face one surface of the weight and a wall surface of the substrate which faces the same. A change in a capacitance between the facing electrodes is electrically detected, and therefore, a change in a physical force acting in the same direction is detected.
摘要翻译: 具有S / N比提高的新结构的半导体机械传感器。 在硅衬底1的中心部分,形成包括梁结构的凹部2。 在梁的尖端处形成重物,并且在凹部2的底面中的重物的底面中,重物形成为电极5。 在重量部分4和电极5之间施加交流电力,从而产生静电,并且重量被静电激励。 在与重量的激励方向垂直的轴向方向上,电极6设置为面对重物的一个表面和面向其的基板的壁表面。 对面对电极之间的电容变化进行电检测,因此检测到以相同方向作用的物理力的变化。
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公开(公告)号:US5872024A
公开(公告)日:1999-02-16
申请号:US834129
申请日:1997-04-14
申请人: Tetsuo Fujii , Masahito Imai
发明人: Tetsuo Fujii , Masahito Imai
IPC分类号: B81B7/00 , C07C303/32 , C07C303/44 , C07C309/17 , G01C19/56 , G01C19/5656 , G01C19/5719 , H01L21/00 , H01L21/30 , H01L21/46
CPC分类号: B81B7/0006 , C07C303/32 , C07C303/44 , G01C19/56 , G01C19/5656 , G01C19/5719 , G01P15/0802 , G01P15/125 , B81B2201/0235 , G01P2015/0817 , G01P2015/0828 , Y10T29/49002 , Y10T29/49004
摘要: A semiconductor mechanical sensor having a new structure in which a S/N ratio is improved. In the central portion of a silicon substrate 1, a recess portion 2 is formed which includes a beam structure. A weight is formed at the tip of the beam, and in the bottom surface of the weight in the bottom surface of the recess portion 2 facing the same, an electrode 5 is formed. An alternating current electric power is applied between the weight portion 4 and the electrode 5 so that static electricity is created and the weight is excited by the static electricity. In an axial direction which is perpendicular to the direction of the excitation of the weight, an electrode 6 is disposed to face one surface of the weight and a wall surface of the substrate which faces the same. A charge in a capacitance between the facing electrodes is electrically detected, and therefore, a change in a physical force acting in the same direction is detected.
摘要翻译: 具有S / N比提高的新结构的半导体机械传感器。 在硅衬底1的中心部分,形成包括梁结构的凹部2。 在梁的尖端处形成重物,并且在凹部2的底面中的重物的底面中,重物形成为电极5。 在重量部分4和电极5之间施加交流电力,从而产生静电,并且重量被静电激励。 在与重量的激励方向垂直的轴向方向上,电极6设置为面对重物的一个表面和面向其的基板的壁表面。 对面对电极之间电容的电荷被电检测,因此检测到以相同方向作用的物理力的变化。
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公开(公告)号:US07866210B2
公开(公告)日:2011-01-11
申请号:US12381356
申请日:2009-03-11
申请人: Tetsuo Fujii , Masahito Imai
发明人: Tetsuo Fujii , Masahito Imai
IPC分类号: G01P15/125
CPC分类号: B81B7/0006 , B81B2201/0235 , C07C303/32 , C07C303/44 , G01C19/56 , G01C19/5656 , G01C19/5719 , G01P15/0802 , G01P15/125 , G01P2015/0817 , G01P2015/0828 , Y10T29/49002 , Y10T29/49004 , C07C309/17
摘要: A semiconductor mechanical sensor having a new structure in which a S/N ratio is improved. In the central portion of a silicon substrate 1, a recess portion 2 is formed which includes a beam structure. A weight is formed at the tip of the beam, and in the bottom surface of the weight in the bottom surface of the recess portion 2 facing the same, an electrode 5 is formed. An alternating current electric power is applied between the weight portion 4 and the electrode 5 so that static electricity is created and the weight is excited by the static electricity. In an axial direction which is perpendicular to the direction of the excitation of the weight, an electrode 6 is disposed to face one surface of the weight and a wall surface of the substrate which faces the same. A change in a capacitance between the facing electrodes is electrically detected, and therefore, a change in a physical force acting in the same direction is detected.
摘要翻译: 具有S / N比提高的新结构的半导体机械传感器。 在硅衬底1的中心部分,形成包括梁结构的凹部2。 在梁的尖端处形成重物,并且在凹部2的底面中的重物的底面中,重物形成为电极5。 在重量部分4和电极5之间施加交流电力,从而产生静电,并且重量被静电激励。 在与重量的激励方向垂直的轴向方向上,电极6设置为面对重物的一个表面和面向其的基板的壁表面。 对面对电极之间的电容变化进行电检测,因此检测到以相同方向作用的物理力的变化。
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公开(公告)号:US20090014820A1
公开(公告)日:2009-01-15
申请号:US12215884
申请日:2008-06-30
申请人: Tetsuo Fujii , Masahito Imai
发明人: Tetsuo Fujii , Masahito Imai
IPC分类号: H01L29/00
CPC分类号: B81B7/0006 , B81B2201/0235 , C07C303/32 , C07C303/44 , G01C19/56 , G01C19/5656 , G01C19/5719 , G01P15/0802 , G01P15/125 , G01P2015/0817 , G01P2015/0828 , Y10T29/49002 , Y10T29/49004 , C07C309/17
摘要: A semiconductor mechanical sensor having a new structure in which a S/N ratio is improved. In the central portion of a silicon substrate 1, a recess portion 2 is formed which includes a beam structure. A weight is formed at the tip of the beam, and in the bottom surface of the weight in the bottom surface of the recess portion 2 facing the same, an electrode 5 is formed. An alternating current electric power is applied between the weight portion 4 and the electrode 5 so that static electricity is created and the weight is excited by the static electricity. In an axial direction which is perpendicular to the direction of the excitation of the weight, an electrode 6 is disposed to face one surface of the weight and a wall surface of the substrate which faces the same. A change in a capacitance between the facing electrodes is electrically detected, and therefore, a change in a physical force acting in the same direction is detected.
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公开(公告)号:US06938486B2
公开(公告)日:2005-09-06
申请号:US10899729
申请日:2004-07-27
申请人: Tetsuo Fujii , Masahito Imai
发明人: Tetsuo Fujii , Masahito Imai
IPC分类号: B81B7/00 , C07C303/32 , C07C303/44 , C07C309/17 , G01C19/56 , G01C19/5656 , G01C19/5719 , G01P15/125
CPC分类号: B81B7/0006 , B81B2201/0235 , C07C303/32 , C07C303/44 , G01C19/56 , G01C19/5656 , G01C19/5719 , G01P15/0802 , G01P15/125 , G01P2015/0817 , G01P2015/0828 , Y10T29/49002 , Y10T29/49004 , C07C309/17
摘要: A semiconductor mechanical sensor having a new structure in which a S/N ratio is improved. In the central portion of a silicon substrate 1, a recess portion 2 is formed which includes a beam structure. A weight is formed at the tip of the beam, and in the bottom surface of the weight in the bottom surface of the recess portion 2 facing the same, an electrode 5 is formed. An alternating current electric power is applied between the weight portion 4 and the electrode 5 so that static electricity is created and the weight is excited by the static electricity. In an axial direction which is perpendicular to the direction of the excitation of the weight, an electrode 6 is disposed to face one surface of the weight and a wall surface of the substrate which faces the same. A change in a capacitance between the facing electrodes is electrically detected, and therefore, a change in a physical force acting in the same direction is detected.
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公开(公告)号:US07407827B2
公开(公告)日:2008-08-05
申请号:US11210006
申请日:2005-08-23
申请人: Tetsuo Fujii , Masahito Imai
发明人: Tetsuo Fujii , Masahito Imai
IPC分类号: H01L21/00
CPC分类号: B81B7/0006 , B81B2201/0235 , C07C303/32 , C07C303/44 , G01C19/56 , G01C19/5656 , G01C19/5719 , G01P15/0802 , G01P15/125 , G01P2015/0817 , G01P2015/0828 , Y10T29/49002 , Y10T29/49004 , C07C309/17
摘要: A semiconductor mechanical sensor having a new structure in which a S/N ratio is improved. In the central portion of a silicon substrate 1, a recess portion 2 is formed which includes a beam structure. A weight is formed at the tip of the beam, and in the bottom surface of the weight in the bottom surface of the recess portion 2 facing the same, an electrode 5 is formed. An alternating current electric power is applied between the weight portion 4 and the electrode 5 so that static electricity is created and the weight is excited by the static electricity. In an axial direction which is perpendicular to the direction of the excitation of the weight, an electrode 6 is disposed to face one surface of the weight and a wall surface of the substrate which faces the same. A change in a capacitance between the facing electrodes is electrically detected, and therefore, a change in a physical force acting in the same direction is detected.
摘要翻译: 具有S / N比提高的新结构的半导体机械传感器。 在硅衬底1的中心部分,形成包括梁结构的凹部2。 在梁的尖端处形成重物,并且在凹部2的底面中的重物的底面中,重物形成为电极5。 在重量部分4和电极5之间施加交流电力,从而产生静电,并且重量被静电激励。 在与重量的激励方向垂直的轴向方向上,电极6设置为面对重物的一个表面和面向其的基板的壁表面。 对面对电极之间的电容变化进行电检测,因此检测到以相同方向作用的物理力的变化。
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公开(公告)号:US06463803B2
公开(公告)日:2002-10-15
申请号:US09749693
申请日:2000-12-28
申请人: Tetsuo Fujii , Masahito Imai
发明人: Tetsuo Fujii , Masahito Imai
IPC分类号: G01P15125
CPC分类号: B81B7/0006 , B81B2201/0235 , C07C303/32 , C07C303/44 , G01C19/56 , G01C19/5656 , G01C19/5719 , G01P15/0802 , G01P15/125 , G01P2015/0817 , G01P2015/0828 , Y10T29/49002 , Y10T29/49004 , C07C309/17
摘要: A semiconductor mechanical sensor having a new structure in which a S/N ratio is improved. In the central portion of a silicon substrate 1, a recess portion 2 is formed which includes a beam structure. A weight is formed at the tip of the beam, and in the bottom surface of the weight in the bottom surface of the recess portion 2 facing the same, an electrode 5 is formed. An alternating current electric power is applied between the weight portion 4 and the electrode 5 so that static electricity is created and the weight is excited by the static electricity. In an axial direction which is perpendicular to the direction of the excitation of the weight, an electrode 6 is disposed to face one surface of the weight and a wall surface of the substrate which faces the same. A change in a capacitance between the facing electrodes is electrically detected, and therefore, a change in a physical force acting in the same direction is detected.
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公开(公告)号:US06227050B1
公开(公告)日:2001-05-08
申请号:US09181615
申请日:1998-10-28
申请人: Tetsuo Fujii , Masahito Imai
发明人: Tetsuo Fujii , Masahito Imai
IPC分类号: G01P15125
CPC分类号: B81B7/0006 , B81B2201/0235 , C07C303/32 , C07C303/44 , G01C19/56 , G01C19/5656 , G01C19/5719 , G01P15/0802 , G01P15/125 , G01P2015/0817 , G01P2015/0828 , Y10T29/49002 , Y10T29/49004 , C07C309/17
摘要: A semiconductor mechanical sensor having a new structure in which a S/N ratio is improved. In the central portion of a silicon substrate 1, a recess portion 2 is formed which includes a beam structure. A weight is formed at the tip of the beam, and in the bottom surface of the weight in the bottom surface of the recess portion 2 facing the same, an electrode 5 is formed. An alternating current electric power is applied between the weight portion 4 and the electrode 5 so that static electricity is created and the weight is excited by the static electricity. In an axial direction which is perpendicular to the direction of the excitation of the weight, an electrode 6 is disposed to face one surface of the weight and a wall surface of the substrate which faces the same. A change in a capacitance between the facing electrodes is electrically detected, and therefore, a change in a physical force acting in the same direction is detected.
摘要翻译: 具有S / N比提高的新结构的半导体机械传感器。 在硅衬底1的中心部分,形成包括梁结构的凹部2。 在梁的尖端处形成重物,并且在凹部2的底面中的重物的底面中,重物形成为电极5。 在重量部分4和电极5之间施加交流电力,从而产生静电,并且重量被静电激励。 在与重量的激励方向垂直的轴向方向上,电极6设置为面对重物的一个表面和面向其的基板的壁表面。 对面对电极之间的电容变化进行电检测,因此检测到以相同方向作用的物理力的变化。
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