Semiconductor mechanical sensor
    1.
    发明授权

    公开(公告)号:US06550331B2

    公开(公告)日:2003-04-22

    申请号:US09947409

    申请日:2001-09-07

    IPC分类号: G01P15125

    摘要: A semiconductor mechanical sensor having a new structure in which a S/N ratio is improved. In the central portion of a silicon substrate 1, a recess portion 2 is formed which includes a beam structure. A weight is formed at the tip of the beam, and in the bottom surface of the weight in the bottom surface of the recess portion 2 facing the same, an electrode 5 is formed. An alternating current electric power is applied between the weight portion 4 and the electrode 5 so that static electricity is created and the weight is excited by the static electricity. In an axial direction which is perpendicular to the direction of the excitation of the weight, an electrode 6 is disposed to face one surface of the weight and a wall surface of the substrate which faces the same. A change in a capacitance between the facing electrodes is electrically detected, and therefore, a change in a physical force acting in the same direction is detected.

    Semiconductor mechanical sensor
    2.
    发明授权
    Semiconductor mechanical sensor 失效
    半导体机械传感器

    公开(公告)号:US07685877B2

    公开(公告)日:2010-03-30

    申请号:US12215884

    申请日:2008-06-30

    IPC分类号: G01P15/125

    摘要: A semiconductor mechanical sensor having a new structure in which a S/N ratio is improved. In the central portion of a silicon substrate 1, a recess portion 2 is formed which includes a beam structure. A weight is formed at the tip of the beam, and in the bottom surface of the weight in the bottom surface of the recess portion 2 facing the same, an electrode 5 is formed. An alternating current electric power is applied between the weight portion 4 and the electrode 5 so that static electricity is created and the weight is excited by the static electricity. In an axial direction which is perpendicular to the direction of the excitation of the weight, an electrode 6 is disposed to face one surface of the weight and a wall surface of the substrate which faces the same. A change in a capacitance between the facing electrodes is electrically detected, and therefore, a change in a physical force acting in the same direction is detected.

    摘要翻译: 具有S / N比提高的新结构的半导体机械传感器。 在硅衬底1的中心部分,形成包括梁结构的凹部2。 在梁的尖端处形成重物,并且在凹部2的底面中的重物的底面中,重物形成为电极5。 在重量部分4和电极5之间施加交流电力,从而产生静电,并且重量被静电激励。 在与重量的激励方向垂直的轴向方向上,电极6设置为面对重物的一个表面和面向其的基板的壁表面。 对面对电极之间的电容变化进行电检测,因此检测到以相同方向作用的物理力的变化。

    Semiconductor mechanical sensor
    3.
    发明授权
    Semiconductor mechanical sensor 失效
    半导体机械传感器

    公开(公告)号:US07040165B2

    公开(公告)日:2006-05-09

    申请号:US11062935

    申请日:2005-02-22

    IPC分类号: G01P15/125

    摘要: A semiconductor mechanical sensor having a new structure in which a S/N ratio is improved. In the central portion of a silicon substrate 1, a recess portion 2 is formed which includes a beam structure. A weight is formed at the tip of the beam, and in the bottom surface of the weight in the bottom surface of the recess portion 2 facing the same, an electrode 5 is formed. An alternating current electric power is applied between the weight portion 4 and the electrode 5 so that static electricity is created and the weight is excited by the static electricity. In an axial direction which is perpendicular to the direction of the excitation of the weight, an electrode 6 is disposed to face one surface of the weight and a wall surface of the substrate which faces the same. A change in a capacitance between the facing electrodes is electrically detected, and therefore, a change in a physical force acting in the same direction is detected.

    摘要翻译: 具有S / N比提高的新结构的半导体机械传感器。 在硅衬底1的中心部分,形成包括梁结构的凹部2。 在梁的尖端处形成重物,并且在凹部2的底面中的重物的底面中,重物形成为电极5。 在重量部分4和电极5之间施加交流电力,从而产生静电,并且重量被静电激励。 在与重量的激励方向垂直的轴向方向上,电极6设置为面对重物的一个表面和面向其的基板的壁表面。 对面对电极之间的电容变化进行电检测,因此检测到以相同方向作用的物理力的变化。

    Method for manufacturing a mechanical force sensing semiconductor device
    4.
    发明授权
    Method for manufacturing a mechanical force sensing semiconductor device 失效
    机械力感测半导体器件的制造方法

    公开(公告)号:US5872024A

    公开(公告)日:1999-02-16

    申请号:US834129

    申请日:1997-04-14

    摘要: A semiconductor mechanical sensor having a new structure in which a S/N ratio is improved. In the central portion of a silicon substrate 1, a recess portion 2 is formed which includes a beam structure. A weight is formed at the tip of the beam, and in the bottom surface of the weight in the bottom surface of the recess portion 2 facing the same, an electrode 5 is formed. An alternating current electric power is applied between the weight portion 4 and the electrode 5 so that static electricity is created and the weight is excited by the static electricity. In an axial direction which is perpendicular to the direction of the excitation of the weight, an electrode 6 is disposed to face one surface of the weight and a wall surface of the substrate which faces the same. A charge in a capacitance between the facing electrodes is electrically detected, and therefore, a change in a physical force acting in the same direction is detected.

    摘要翻译: 具有S / N比提高的新结构的半导体机械传感器。 在硅衬底1的中心部分,形成包括梁结构的凹部2。 在梁的尖端处形成重物,并且在凹部2的底面中的重物的底面中,重物形成为电极5。 在重量部分4和电极5之间施加交流电力,从而产生静电,并且重量被静电激励。 在与重量的激励方向垂直的轴向方向上,电极6设置为面对重物的一个表面和面向其的基板的壁表面。 对面对电极之间电容的电荷被电检测,因此检测到以相同方向作用的物理力的变化。

    Semiconductor mechanical sensor
    5.
    发明授权
    Semiconductor mechanical sensor 失效
    半导体机械传感器

    公开(公告)号:US07866210B2

    公开(公告)日:2011-01-11

    申请号:US12381356

    申请日:2009-03-11

    IPC分类号: G01P15/125

    摘要: A semiconductor mechanical sensor having a new structure in which a S/N ratio is improved. In the central portion of a silicon substrate 1, a recess portion 2 is formed which includes a beam structure. A weight is formed at the tip of the beam, and in the bottom surface of the weight in the bottom surface of the recess portion 2 facing the same, an electrode 5 is formed. An alternating current electric power is applied between the weight portion 4 and the electrode 5 so that static electricity is created and the weight is excited by the static electricity. In an axial direction which is perpendicular to the direction of the excitation of the weight, an electrode 6 is disposed to face one surface of the weight and a wall surface of the substrate which faces the same. A change in a capacitance between the facing electrodes is electrically detected, and therefore, a change in a physical force acting in the same direction is detected.

    摘要翻译: 具有S / N比提高的新结构的半导体机械传感器。 在硅衬底1的中心部分,形成包括梁结构的凹部2。 在梁的尖端处形成重物,并且在凹部2的底面中的重物的底面中,重物形成为电极5。 在重量部分4和电极5之间施加交流电力,从而产生静电,并且重量被静电激励。 在与重量的激励方向垂直的轴向方向上,电极6设置为面对重物的一个表面和面向其的基板的壁表面。 对面对电极之间的电容变化进行电检测,因此检测到以相同方向作用的物理力的变化。

    Semiconductor mechanical sensor
    6.
    发明申请

    公开(公告)号:US20090014820A1

    公开(公告)日:2009-01-15

    申请号:US12215884

    申请日:2008-06-30

    IPC分类号: H01L29/00

    摘要: A semiconductor mechanical sensor having a new structure in which a S/N ratio is improved. In the central portion of a silicon substrate 1, a recess portion 2 is formed which includes a beam structure. A weight is formed at the tip of the beam, and in the bottom surface of the weight in the bottom surface of the recess portion 2 facing the same, an electrode 5 is formed. An alternating current electric power is applied between the weight portion 4 and the electrode 5 so that static electricity is created and the weight is excited by the static electricity. In an axial direction which is perpendicular to the direction of the excitation of the weight, an electrode 6 is disposed to face one surface of the weight and a wall surface of the substrate which faces the same. A change in a capacitance between the facing electrodes is electrically detected, and therefore, a change in a physical force acting in the same direction is detected.

    Semiconductor mechanical sensor
    8.
    发明授权
    Semiconductor mechanical sensor 失效
    半导体机械传感器

    公开(公告)号:US07407827B2

    公开(公告)日:2008-08-05

    申请号:US11210006

    申请日:2005-08-23

    IPC分类号: H01L21/00

    摘要: A semiconductor mechanical sensor having a new structure in which a S/N ratio is improved. In the central portion of a silicon substrate 1, a recess portion 2 is formed which includes a beam structure. A weight is formed at the tip of the beam, and in the bottom surface of the weight in the bottom surface of the recess portion 2 facing the same, an electrode 5 is formed. An alternating current electric power is applied between the weight portion 4 and the electrode 5 so that static electricity is created and the weight is excited by the static electricity. In an axial direction which is perpendicular to the direction of the excitation of the weight, an electrode 6 is disposed to face one surface of the weight and a wall surface of the substrate which faces the same. A change in a capacitance between the facing electrodes is electrically detected, and therefore, a change in a physical force acting in the same direction is detected.

    摘要翻译: 具有S / N比提高的新结构的半导体机械传感器。 在硅衬底1的中心部分,形成包括梁结构的凹部2。 在梁的尖端处形成重物,并且在凹部2的底面中的重物的底面中,重物形成为电极5。 在重量部分4和电极5之间施加交流电力,从而产生静电,并且重量被静电激励。 在与重量的激励方向垂直的轴向方向上,电极6设置为面对重物的一个表面和面向其的基板的壁表面。 对面对电极之间的电容变化进行电检测,因此检测到以相同方向作用的物理力的变化。

    Semiconductor mechanical sensor
    9.
    发明授权

    公开(公告)号:US06463803B2

    公开(公告)日:2002-10-15

    申请号:US09749693

    申请日:2000-12-28

    IPC分类号: G01P15125

    摘要: A semiconductor mechanical sensor having a new structure in which a S/N ratio is improved. In the central portion of a silicon substrate 1, a recess portion 2 is formed which includes a beam structure. A weight is formed at the tip of the beam, and in the bottom surface of the weight in the bottom surface of the recess portion 2 facing the same, an electrode 5 is formed. An alternating current electric power is applied between the weight portion 4 and the electrode 5 so that static electricity is created and the weight is excited by the static electricity. In an axial direction which is perpendicular to the direction of the excitation of the weight, an electrode 6 is disposed to face one surface of the weight and a wall surface of the substrate which faces the same. A change in a capacitance between the facing electrodes is electrically detected, and therefore, a change in a physical force acting in the same direction is detected.

    Semiconductor mechanical sensor and method of manufacture
    10.
    发明授权
    Semiconductor mechanical sensor and method of manufacture 有权
    半导体机械传感器及其制造方法

    公开(公告)号:US06227050B1

    公开(公告)日:2001-05-08

    申请号:US09181615

    申请日:1998-10-28

    IPC分类号: G01P15125

    摘要: A semiconductor mechanical sensor having a new structure in which a S/N ratio is improved. In the central portion of a silicon substrate 1, a recess portion 2 is formed which includes a beam structure. A weight is formed at the tip of the beam, and in the bottom surface of the weight in the bottom surface of the recess portion 2 facing the same, an electrode 5 is formed. An alternating current electric power is applied between the weight portion 4 and the electrode 5 so that static electricity is created and the weight is excited by the static electricity. In an axial direction which is perpendicular to the direction of the excitation of the weight, an electrode 6 is disposed to face one surface of the weight and a wall surface of the substrate which faces the same. A change in a capacitance between the facing electrodes is electrically detected, and therefore, a change in a physical force acting in the same direction is detected.

    摘要翻译: 具有S / N比提高的新结构的半导体机械传感器。 在硅衬底1的中心部分,形成包括梁结构的凹部2。 在梁的尖端处形成重物,并且在凹部2的底面中的重物的底面中,重物形成为电极5。 在重量部分4和电极5之间施加交流电力,从而产生静电,并且重量被静电激励。 在与重量的激励方向垂直的轴向方向上,电极6设置为面对重物的一个表面和面向其的基板的壁表面。 对面对电极之间的电容变化进行电检测,因此检测到以相同方向作用的物理力的变化。