摘要:
A semiconductor memory device according to the present invention includes: a test mode setting circuit capable of serially setting a plurality of test modes in accordance with an external signal; a voltage generating circuit; a column related control circuit; a row related control circuit; and a memory cell array. In a corresponding test mode, odd-numbered word lines/even-numbered word lines are brought into a selection/non-selection state. In the corresponding test mode, a voltage of the bit line is set higher (an internal power supply voltage) or lower (a ground voltage) than an equalization voltage in a normal operation mode. Thus, a checker pattern can efficiently be written.
摘要:
A semiconductor device according to the present invention includes a plurality of test mode circuits. Each test mode circuit includes a plurality of decode circuits decoding an input signal and a plurality of latch circuits. Each decode circuit generates a test mode signal. The test mode signals are held in the latch circuits. Each test mode circuit further includes decode circuits outputting a group reset signal for resetting a corresponding latch circuit. Thus, a plurality of test mode signals can be combined arbitrarily and serially.
摘要:
A semiconductor memory device includes a command decoder receiving an external signal and issuing a command, a clock buffer receiving an external clock, gates and a refresh counter. When a test signal is at L-level, an auto-refresh signal is issued in accordance with the output of the command decoder. When the test signal is at H-level, the auto-refresh signal is issued in accordance with the output (external clock) of the clock buffer. Thereby, the test can be performed with a good timing accuracy even by a low-speed tester.
摘要:
A semiconductor memory device includes a command decoder receiving an external signal and issuing a command, a clock buffer receiving an external clock, gates and a refresh counter. When a test signal is at L-level, an auto-refresh signal is issued in accordance with the output of the command decoder. When the test signal is at H-level, the auto-refresh signal is issued in accordance with the output (external clock) of the clock buffer. Thereby, the test can be performed with a good timing accuracy even by a low-speed tester.
摘要:
A semiconductor memory device includes a command decoder receiving an external signal and issuing a command, a clock buffer receiving an external clock, gates and a refresh counter. When a test signal is at L-level, an auto-refresh signal is issued in accordance with the output of the command decoder. When the test signal is at H-level, the auto-refresh signal is issued in accordance with the output (external clock) of the clock buffer. Thereby, the test can be performed with a good timing accuracy even by a low-speed tester.
摘要:
A test interface circuit, which has a simple pattern generator mounted on a semiconductor device having a mounted memory, consists of a command analysis section which analyses a command of three bits received from a tester, outputs an analysis result to a memory core and controls an operation of the memory core, and an address counter which counts addresses and outputs the addresses to the memory core in accordance with a counter control instruction of two bits received from the tester. It is, therefore, possible to make a circuit for testing the memory core small in scale and to decrease the number of pins for testing the memory core, so that it is possible to use an inexpensive tester and to reduce cost required to test the memory core.
摘要:
A semiconductor memory device includes: a determination section; an expected value control section; and an accumulation section. The determination section determines coincidence/non-coincidence between input data and an expected value. The expected value control section catches a read expected value in a read operation only. The accumulation section catches a determination result according to an accumulation-transmission signal. When the accumulation-transmission signal is in a transmission state, a determination result is caught, while when the accumulation-transmission signal enters an accumulation state, the next determination result is caught in a case of coincidence determination and once a non-coincidence determination result is caught, thereafter the non-coincidence determination result continues to be held.
摘要:
In a test circuit for testing an eDRAM provided with a write mask function, eight internal expected values are generated based on a prescribed read data signal among read data signals of one unit of write mask (i.e., eight). Determination is performed as to whether the eight read data signals and the eight internal expected values respectively match or not, and when they match, the eight memory cells are determined to be normal. Thus, a multi-bit test can be performed even when a test pattern is written using a write mask function.
摘要:
Regular memory cell arrays are arranged in divided regions in three rows and three columns except for the region located at the second row and the second column. The region located at the intersection of the second row and the second column is provided with a redundant memory cell array. The replacement operation of the regular memory cell arrays with the redundant memory cell array is provided for each memory cell block.
摘要:
In a parallel operational processing device having an operational processing unit arranged between memory blocks each having a plurality of memory cells arranged in rows and columns, the respective columns of each memory block are alternately connected to the operational processing units on the opposite sides of the memory block. By selecting one word line in one memory block, data can be transferred to two operational processing units. The number of the word lines selected per one operational processing unit is reduced, and power consumption is reduced. The bit operation units and sense amplifiers/write drivers of the operational processing units have arrangement pitch conditions mitigated and are reduced in number, and an isolation region between the memory blocks is not required and the layout area is reduced. Thus, the parallel operational processing device with a layout area and the power consumption reduced, can achieve a fast operation.