MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
    1.
    发明申请
    MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 审中-公开
    半导体器件的制造方法

    公开(公告)号:US20090246709A1

    公开(公告)日:2009-10-01

    申请号:US12407142

    申请日:2009-03-19

    IPC分类号: G03F7/20 B28B11/08

    摘要: A manufacturing method of a semiconductor device includes preparing a first circuit pattern original plate including a first pattern part of a mark pattern, preparing a second circuit pattern original plate including a second pattern part of the mark pattern, transferring the first pattern part to a mask film on an underlying area to form a first transfer pattern part in the mask film, transferring the second pattern part to the mask film to form a second transfer pattern part in the mask film, and patterning the underlying area by using the mask film including a transfer mark pattern, which is obtained by combining the first transfer pattern part and the second transfer pattern part, as a mask to form an underlying mark pattern in the underlying area.

    摘要翻译: 半导体器件的制造方法包括:制备包括标记图案的第一图案部分的第一电路图案原版,制备包括标记图案的第二图案部分的第二电路图案原版,将第一图案部分转印到掩模 在掩模膜上形成第一转印图案部分,将第二图案部分转印到掩模膜上,以在掩模膜中形成第二转印图案部分,并通过使用掩模膜对其下面的区域进行图案化 转印标记图案,其通过组合第一转印图案部分和第二转印图案部分而获得,作为掩模,以在下面的区域中形成下面的标记图案。

    OVERLAY/ALIGNMENT MEASUREMENT METHOD AND OVERLAY/ALIGNMENT MEASUREMENT APPARATUS
    2.
    发明申请
    OVERLAY/ALIGNMENT MEASUREMENT METHOD AND OVERLAY/ALIGNMENT MEASUREMENT APPARATUS 有权
    覆盖/对准测量方法和覆盖/对准测量装置

    公开(公告)号:US20120069337A1

    公开(公告)日:2012-03-22

    申请号:US13051460

    申请日:2011-03-18

    申请人: Kazutaka ISHIGO

    发明人: Kazutaka ISHIGO

    IPC分类号: G01B11/27

    摘要: According to one embodiment, a method includes preliminarily measuring the amount of overlay or alignment shift of the mark for overlay or alignment measurement while sequentially shifting a position of a measurement area relative to the mark for overlay or alignment measurement so as to position the mark for overlay or alignment measurement on each of a plurality of partial areas. The measurement area corresponds to a field angle of the optical measurement system, and an inside of the measurement area is two-dimensionally divided into the partial areas. The method includes calculating a tool-induced shift regarding a characteristic deviation of the optical measurement system for each of the plurality of partial areas based on a preliminarily measured result of the amount of overlay or alignment shift. The method includes determining a partial area to be used from among the plurality of partial areas on the basis of the tool-induced shift calculated for each of the plurality of partial areas.

    摘要翻译: 根据一个实施例,一种方法包括:在相对于用于覆盖或对准测量的标记顺序地移动测量区域的位置的同时,初步测量用于覆盖或对准测量的标记的覆盖或对准偏移量,以便将标记定位 在多个部分区域中的每一个上进行覆盖或对准测量。 测量区域对应于光学测量系统的视场角,并且测量区域的内部被二维地划分为部分区域。 该方法包括基于覆盖量或对准偏移量的预先测量结果来计算针对多个部分区域中的每一个的光学测量系统的特性偏差的工具引起的移位。 该方法包括基于为多个部分区域中的每一个计算的工具引起的移位来确定从多个部分区域中使用的部分区域。

    EXPOSURE APPARATUS, EXPOSURE CONTROL SYSTEM, AND EXPOSURE METHOD
    3.
    发明申请
    EXPOSURE APPARATUS, EXPOSURE CONTROL SYSTEM, AND EXPOSURE METHOD 有权
    曝光装置,曝光控制系统和曝光方法

    公开(公告)号:US20130222777A1

    公开(公告)日:2013-08-29

    申请号:US13601311

    申请日:2012-08-31

    申请人: Kazutaka ISHIGO

    发明人: Kazutaka ISHIGO

    IPC分类号: G03B27/68

    摘要: According to one embodiment, there is provided an exposure apparatus including an acquisition unit, and a calculation unit. The acquisition unit obtains a plurality of measured values. The plurality of measured values is measured for a plurality of focus offset quantities different from each other. Each of the plurality of measured values represents positional deviation distribution within a shot area. The calculation unit calculates a plurality of distortion errors from the plurality of measured values and obtains a correlation between the focus offset quantity and alignment compensation value to compensate for the distortion error, in response to the plurality of focus offset quantities and the plurality of distortion errors.

    摘要翻译: 根据一个实施例,提供一种包括获取单元和计算单元的曝光设备。 获取单元获得多个测量值。 对于彼此不同的多个聚焦偏移量来测量多个测量值。 多个测量值中的每一个表示拍摄区域内的位置偏差分布。 计算单元根据多个测量值计算多个失真误差,并且响应于多个聚焦偏移量和多个失真误差而获得聚焦偏移量和对准补偿值之间的相关性以补偿失真误差 。

    MASK AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
    4.
    发明申请
    MASK AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE 有权
    用于制造半导体器件的掩模和方法

    公开(公告)号:US20130252429A1

    公开(公告)日:2013-09-26

    申请号:US13569860

    申请日:2012-08-08

    IPC分类号: G03F1/00 G03F7/20 H01L21/302

    CPC分类号: G03F1/42

    摘要: A photo mask for exposing according to an embodiment includes a mark pattern arranged in a mark region that is different from an effective region to form a semiconductor device; and a regular pattern arranged in the mark region and around the mark pattern and smaller than the mark pattern in size and pitch.

    摘要翻译: 根据实施例的用于曝光的光掩模包括布置在与有效区域不同以形成半导体器件的标记区域中的标记图案; 以及布置在标记区域和标记图案周围的规则图案,并且尺寸和间距小于标记图案。

    PATTERN FORMING METHOD, PATTERN DESIGNING METHOD, AND MASK SET
    5.
    发明申请
    PATTERN FORMING METHOD, PATTERN DESIGNING METHOD, AND MASK SET 有权
    图案形成方法,图案设计方法和掩模设置

    公开(公告)号:US20100291477A1

    公开(公告)日:2010-11-18

    申请号:US12556967

    申请日:2009-09-10

    申请人: Kazutaka ISHIGO

    发明人: Kazutaka ISHIGO

    IPC分类号: G03F7/00 G03F1/00

    CPC分类号: G03F7/70683 G03F7/70633

    摘要: A pattern designing method according to an embodiment of the present invention includes: designing a first pattern for inspection formed by arraying a plurality of first mark rows, in which rectangular marks are arrayed at predetermined intervals in a first direction, in a second direction perpendicular to the first direction and designing a second pattern for inspection formed by arraying, in the second direction, a plurality of second mark rows in which rectangular marks are arranged among the marks arrayed in the first direction of the first mark row and a forming position in the second direction is arranged to overlap the first mark row by predetermined overlapping length.

    摘要翻译: 根据本发明实施例的图案设计方法包括:通过排列多个第一标记行来设计用于检查的第一图案,其中矩形标记沿着第一方向以预定间隔排列,在垂直于 第一方向并设计用于检查的第二图案,其在第二方向上排列多个第二标记行,其中在第一标记行的第一方向上排列的标记和第一标记行的形成位置之间布置有矩形标记 第二方向布置成与第一标记行重叠预定的重叠长度。