摘要:
A method for processing a plurality of substrates after forming a photosensitive film on each substrate includes carrying each substrate into a placement buffer including a plurality of supporters by a first transport mechanism; taking out each substrate from the placement buffer to an interface by a second transport mechanism; carrying each substrate into the exposure device; carrying each substrate out of the exposure device into the placement buffer by the second transport mechanism; taking out each substrate from the placement buffer to the processing section by the first transport mechanism; performing development processing on each substrate; making each substrate stand by at the placement buffer based on timing at which the exposure device can accept each substrate; and making each substrate stand by at the placement buffer based on timing at which the developing device can accept each substrate.
摘要:
An interface block is constituted by a cleaning/drying processing block and a carry-in/carry-out block. The cleaning/drying processing block includes cleaning/drying processing sections and a transport section. The transport section is provided with a transport mechanism. The carry-in/carry-out block is provided with a transport mechanism. The transport mechanism carries substrates in and out of an exposure device.
摘要:
The invention provides an image identification device uses a separating plane to classify block images into the categories. The image identification device includes a target image input unit inputting a target image, a block image generation unit generates block images, a feature quantity computing unit computes feature quantities of the block images, and a category determination unit determines whether the block images are classified into the categories or not. The feature quantity computing unit uses local feature quantities of the block images and a global feature quantity of the target image as a whole, and also in a feature quantity space using features of the block images as coordinate axes, uses coordinate positions of feature quantity vectors optional areas in the feature quantity space to count the block images and causes the global feature quantity to include the number of the block images thus counted.
摘要:
A backlight unit has a light source, a reflection sheet, a light guide plate, an air space, and a diffuser, wherein the reflection sheet, the light guide plate, the air space, and the diffuser are overlaid in this order. The light source is configured to arrange individual light sources having different spectra or different light emission quantities near an incident plane of the light guide plate, and on a plane facing the reflection sheet of the light guide plate, scatter dots are disposed which take light propagating through the light guide plate out of the reflection sheet side. The backlight unit and a liquid crystal display device including the same have excellent display quality.
摘要:
The invention provides a surface illuminator capable of achieving high display quality by employing an array of discrete light sources constituted by a plurality of LEDs and a liquid crystal display having the same. The surface illuminator includes an LED module which is a plurality of LEDs alternately and discretely provided along a light entrance surface and a color irregularity correcting resistor which is connected in parallel with a predetermined LED at an end of the LED module and which provides a bypass for a current supplied to the LED.
摘要:
A mode selection is carried out prior to the outward transfer of a substrate to be processed from an indexer block. When a “processing sequence priority mode” is selected, a transport path for the substrate is defined prior to the outward transfer of the substrate. The definition of the transport path is carried out by determining to which of a plurality of parallel processing parts for performing each parallel process the substrate is to be transported. Next, based on the defined transport path, an adjustment is made to a processing condition established for each substrate processing part included in the transport path. Thereafter, the unprocessed substrate is transferred outwardly from the indexer block, and is transported and processed along the defined transport path. On the other hand, when a “throughput priority mode” is selected, a substrate is transported to a vacant one of the plurality of parallel processing parts.
摘要:
A substrate processing apparatus and an information storage server are connected with each other through a network. A storage part of the substrate processing apparatus stores set information and a control program, for controlling operation of the substrate processing apparatus according to the set information and the control program. The substrate processing apparatus is provided with a schedule function, for transmitting a backup instructional command according to the schedule. In response to this instructional command, the substrate processing apparatus generates a duplicate of specified information stored in the aforementioned storage part and transfers the duplicate information to the information storage server through the network. The information storage server stores the received duplicate information in a hard disk as backup data. The information storage server can also store only differential data of the duplicate information. Thus, information for controlling the operation of the substrate processing apparatus can be efficiently backed up without burdening the user.
摘要:
A specified time is determined which is a worst-case (or the longest) time period assumed as a time interval required between the instant at which an interface block receives an exposed substrate from an exposure unit and the instant at which a post-exposure bake process of the substrate starts in a heating part. A waiting time is calculated by subtracting a transport time from the specified time. The transport time is a time interval actually required between the instant at which the interference block receives the substrate from the exposure unit and the instant at which the substrate reaches the heating part. The post-exposure bake process of the substrate starts in the heating part after a lapse of the above-mentioned calculated waiting time since the arrival of the substrate at the heating part.
摘要:
In an LED package, LED chips are connected in parallel by wires between lead frames connected to terminals. When an open circuit failure such as the coming off of the wire occurs in one of the LED chips in the LED package that is being energized, a current twice as high as that flowing through the other LED chip prior to the open circuit failure is passed through the other LED chip, and thus the amount of light emitted therefrom is increased about two-fold. Consequently, the amount of light emitted from the LED package does not change significantly.