公开(公告)号：US09978712B2

公开(公告)日：2018-05-22

申请号：US15164608

申请日：2016-05-25

申请人： Texas Instruments Incorporated

发明人： Danyang Zhu ,  Zhuang Ma ,  Xinyu Yin ,  Michael Dean Shilhanek ,  Steven Bolen ,  Albert Eardley ,  Abha Singh Kasper

IPC分类号： H01L23/00 ,  H01L21/66 ,  G01R31/04 ,  G01R31/28

CPC分类号： H01L24/85 ,  G01R31/041 ,  G01R31/2853 ,  H01L22/34 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/14252 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A multichip module (MCM) device include a first die including functional circuitry bonded by a plurality of inter-die bond wires (bond wires) to a second die having functional circuitry. A first channel (Channel A) and second channel (Channel B) each have separate top and bottom signal paths (signal paths) including one of the bond wires. A failure of any of the signal paths does not affect functionality of the device. The first die includes input pins including a first input pin (P1), a second input pin (P2), and coupling circuitry including cross-channel test circuitry positioned between the input pins and the functional circuitry. The coupling circuitry provides for Channel A and Channel B a first configuration for normal mode operation and a second configuration for test mode operation for single bond wire testing for checking continuity of any of the bond wires.