公开(公告)号：US10529702B2

公开(公告)日：2020-01-07

申请号：US14533432

申请日：2014-11-05

Applicant: Texas Instruments Incorporated

Inventor： Zhong Chen ,  Danyang Zhu ,  Zhuang Ma

IPC: H02H9/00 ,  H01L27/02

Abstract: An apparatus includes an integrated circuit, a plurality of bi-directional pins, and an electro-static discharge (ESD) clamp. The integrated circuit is configured to provide a ground potential. The plurality of bi-directional pins are configured to provide a differential input signal for the integrated circuit. The electro-static discharge (ESD) clamp is coupled between the ground potential and the plurality of bi-directional pins.

公开(公告)号：US20160126233A1

公开(公告)日：2016-05-05

申请号：US14533432

申请日：2014-11-05

Applicant: Texas Instruments Incorporated

Inventor： Zhong Chen ,  Danyang Zhu ,  Zhuang Ma

IPC: H01L27/02

Abstract: An apparatus includes an integrated circuit, a plurality of bi-directional pins, and an electro-static discharge (ESD) clamp. The integrated circuit is configured to provide a ground potential. The plurality of bi-directional pins are configured to provide a differential input signal for the integrated circuit. The electro-static discharge (ESD) clamp is coupled between the ground potential and the plurality of bi-directional pins.

Abstract translation: 一种装置包括集成电路，多个双向引脚和静电放电（ESD）钳位。 集成电路被配置为提供接地电位。 多个双向引脚被配置为提供用于集成电路的差分输入信号。 静电放电（ESD）钳位电极耦合在地电位和多个双向引脚之间。

公开(公告)号：US09978712B2

公开(公告)日：2018-05-22

申请号：US15164608

申请日：2016-05-25

Applicant: Texas Instruments Incorporated

Inventor： Danyang Zhu ,  Zhuang Ma ,  Xinyu Yin ,  Michael Dean Shilhanek ,  Steven Bolen ,  Albert Eardley ,  Abha Singh Kasper

IPC: H01L23/00 ,  H01L21/66 ,  G01R31/04 ,  G01R31/28

CPC classification number: H01L24/85 ,  G01R31/041 ,  G01R31/2853 ,  H01L22/34 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/14252 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A multichip module (MCM) device include a first die including functional circuitry bonded by a plurality of inter-die bond wires (bond wires) to a second die having functional circuitry. A first channel (Channel A) and second channel (Channel B) each have separate top and bottom signal paths (signal paths) including one of the bond wires. A failure of any of the signal paths does not affect functionality of the device. The first die includes input pins including a first input pin (P1), a second input pin (P2), and coupling circuitry including cross-channel test circuitry positioned between the input pins and the functional circuitry. The coupling circuitry provides for Channel A and Channel B a first configuration for normal mode operation and a second configuration for test mode operation for single bond wire testing for checking continuity of any of the bond wires.