PIEZOELECTRIC MEMS MICROPHONE
    1.
    发明申请

    公开(公告)号:US20200148532A1

    公开(公告)日:2020-05-14

    申请号:US16196922

    申请日:2018-11-20

    IPC分类号: B81B7/02 H04R17/02 B81B7/00

    摘要: A microphone including a casing having a front wall, a back wall, and a side wall joining the front wall to the back wall, a transducer mounted to the front wall, the transducer including a substrate and a transducing element, the transducing element having a transducer acoustic compliance dependent on the transducing element dimensions, a back cavity cooperatively defined between the back wall, the side wall, and the transducer, the back cavity having a back cavity acoustic compliance. The transducing element is dimensioned such that the transducing element length matches a predetermined resonant frequency and the transducing element width, thickness, and elasticity produces a transducer acoustic compliance within a given range of the back cavity acoustic compliance.

    Piezoelectric MEMS microphone
    2.
    发明授权

    公开(公告)号:US10170685B2

    公开(公告)日:2019-01-01

    申请号:US14208827

    申请日:2014-03-13

    摘要: A microphone including a casing having a front wall, a back wall, and a side wall joining the front wall to the back wall, a transducer mounted to the front wall, the transducer including a substrate and a transducing element, the transducing element having a transducer acoustic compliance dependent on the transducing element dimensions, a back cavity cooperatively defined between the back wall, the side wall, and the transducer, the back cavity having a back cavity acoustic compliance. The transducing element is dimensioned such that the transducing element length matches a predetermined resonant frequency and the transducing element width, thickness, and elasticity produces a transducer acoustic compliance within a given range of the back cavity acoustic compliance.

    PIEZOELECTRIC MEMS MICROPHONE
    4.
    发明申请

    公开(公告)号:US20210273152A1

    公开(公告)日:2021-09-02

    申请号:US17180193

    申请日:2021-02-19

    摘要: A microphone including a casing having a front wall, a back wall, and a side wall joining the front wall to the back wall, a transducer mounted to the front wall, the transducer including a substrate and a transducing element, the transducing element having a transducer acoustic compliance dependent on the transducing element dimensions, a back cavity cooperatively defined between the back wall, the side wall, and the transducer, the back cavity having a back cavity acoustic compliance. The transducing element is dimensioned such that the transducing element length matches a predetermined resonant frequency and the transducing element width, thickness, and elasticity produces a transducer acoustic compliance within a given range of the back cavity acoustic compliance.

    Piezoelectric MEMS microphone
    5.
    发明授权

    公开(公告)号:US10964880B2

    公开(公告)日:2021-03-30

    申请号:US16196922

    申请日:2018-11-20

    摘要: A microphone including a casing having a front wall, a back wall, and a side wall joining the front wall to the back wall, a transducer mounted to the front wall, the transducer including a substrate and a transducing element, the transducing element having a transducer acoustic compliance dependent on the transducing element dimensions, a back cavity cooperatively defined between the back wall, the side wall, and the transducer, the back cavity having a back cavity acoustic compliance. The transducing element is dimensioned such that the transducing element length matches a predetermined resonant frequency and the transducing element width, thickness, and elasticity produces a transducer acoustic compliance within a given range of the back cavity acoustic compliance.

    COCHLEAR IMPLANT
    7.
    发明申请

    公开(公告)号:US20150231394A1

    公开(公告)日:2015-08-20

    申请号:US14624391

    申请日:2015-02-17

    IPC分类号: A61N1/36 A61N1/378

    摘要: A device for implantation into a scalia tympani of a cochlea is disclosed. The device comprises blocks and compliant elements interconnecting the blocks with one of the compliant elements disposed between each pair of adjacent blocks. The compliant elements impart flexibility to the device in a plane of curvature of the cochlea and impart stiffness to the device out of the plane of curvature of the cochlea. The device further comprises piezoelectric elements with at least one of the elements disposed the blocks. Each piezoelectric element comprises at least one piezoelectric sensing unit and at least one electrode for transmitting the electrical signal to the auditory nerve. The device further comprises communication lines for transmitting an electrical signal through the device with one of the communication lines disposed between each pair of blocks and parallel to the compliant element.

    摘要翻译: 公开了一种用于植入耳蜗的鼓膜鼓膜的装置。 该装置包括块和顺应元件,将块与设置在每对相邻块之间的顺应元件之一相互连接。 顺应性元件赋予装置在耳蜗曲率平面中的柔性,并且将装置的刚度赋予耳蜗的曲率平面之外的刚度。 该装置还包括压电元件,其中至少一个元件设置在块体上。 每个压电元件包括​​至少一个压电感测单元和用于将电信号传输到听觉神经的至少一个电极。 该设备还包括用于通过设备发送电信号的通信线路,其中通信线路之一设置在每对块之间并且平行于柔性元件。

    Piezoelectric MEMS microphone
    8.
    发明授权
    Piezoelectric MEMS microphone 有权
    压电MEMS麦克风

    公开(公告)号:US08896184B2

    公开(公告)日:2014-11-25

    申请号:US13963661

    申请日:2013-08-09

    IPC分类号: H04R3/00

    摘要: A piezoelectric MEMS microphone comprising a multi-layer sensor that includes at least one piezoelectric layer between two electrode layers, with the sensor being dimensioned such that it provides a near maximized ratio of output energy to sensor area, as determined by an optimization parameter that accounts for input pressure, bandwidth, and characteristics of the piezoelectric and electrode materials. The sensor can be formed from single or stacked cantilevered beams separated from each other by a small gap, or can be a stress-relieved diaphragm that is formed by deposition onto a silicon substrate, with the diaphragm then being stress relieved by substantial detachment of the diaphragm from the substrate, and then followed by reattachment of the now stress relieved diaphragm.

    摘要翻译: 一种压电MEMS麦克风,包括多层传感器,其包括在两个电极层之间的至少一个压电层,传感器的尺寸被设计成使得其提供输出能量与传感器区域的接近最大的比率,如通过帐户的优化参数所确定的 用于压电和电极材料的输入压力,带宽和特性。 传感器可以由单个或堆叠的悬臂梁形成,它们通过小间隙彼此分开,或者可以是通过沉积到硅衬底上而形成的应力释放膜片,其中膜片然后通过实质上分离的应力消除 隔膜从衬底,然后重新连接现在的应力释放隔膜。

    PIEZOELECTRIC MEMS MICROPHONE
    9.
    发明申请
    PIEZOELECTRIC MEMS MICROPHONE 审中-公开
    压电MEMS麦克风

    公开(公告)号:US20140339657A1

    公开(公告)日:2014-11-20

    申请号:US14451670

    申请日:2014-08-05

    摘要: A piezoelectric MEMS microphone comprising a multi-layer sensor that includes at least one piezoelectric layer between two electrode layers, with the sensor being dimensioned such that it provides a near maximized ratio of output energy to sensor area, as determined by an optimization parameter that accounts for input pressure, bandwidth, and characteristics of the piezoelectric and electrode materials. The sensor can be formed from single or stacked cantilevered beams separated from each other by a small gap, or can be a stress-relieved diaphragm that is formed by deposition onto a silicon substrate, with the diaphragm then being stress relieved by substantial detachment of the diaphragm from the substrate, and then followed by reattachment of the now stress relieved diaphragm.

    摘要翻译: 一种压电MEMS麦克风,包括多层传感器,其包括在两个电极层之间的至少一个压电层,传感器的尺寸被设计成使得其提供输出能量与传感器区域的接近最大的比率,如通过帐户的优化参数所确定的 用于压电和电极材料的输入压力,带宽和特性。 传感器可以由单个或堆叠的悬臂梁形成,它们通过小间隙彼此分开,或者可以是通过沉积到硅衬底上而形成的应力释放膜片,其中膜片然后通过实质上分离的应力消除 隔膜从衬底,然后重新连接现在的应力释放隔膜。