公开(公告)号：US20240082920A1

公开(公告)日：2024-03-14

申请号：US18318670

申请日：2023-05-16

Applicant: The Research Foundation for The State University of New York

Inventor： Scott N. Schiffres ,  Arad Azizi ,  Changhong Ke ,  Bahgat Sammakia ,  Feilin Gou

IPC: B22F10/362 ,  B22F10/85 ,  B33Y40/10

CPC classification number: B22F10/362 ,  B22F10/85 ,  B33Y40/10 ,  B33Y50/02

Abstract: A technique for additively manufacturing with a segmentation exposure strategy is disclosed herein, which enables lower thermal stress and substrate temperatures, compared to conventional raster strategies. The technique enables manufacture of heat removal devices and other deposited structures, especially on heat sensitive substrates where coefficient of thermal expansion mismatch can be considerable. It also enables novel composites through additive manufacturing. This process can also be selectively applied to parts or material systems that have large thermal stresses with conventional raster and process parameters to reduce chances of thermal stress induced failure. The process enables reduction of heat concentration in selective laser melting or electron beam melting which results in lower residual stresses in the fabricated object.

公开(公告)号：US12122120B2

公开(公告)日：2024-10-22

申请号：US17521170

申请日：2021-11-08

Applicant: The Research Foundation for The State University of new York

Inventor： Scott N. Schiffres ,  Arad Azizi

IPC: F28F7/00 ,  B22F10/28 ,  B23K26/342 ,  B32B7/12 ,  B32B15/01 ,  B33Y10/00 ,  B33Y70/10 ,  B33Y80/00 ,  F28D15/00 ,  F28F21/00 ,  F28F21/02 ,  F28F21/04 ,  F28F21/08 ,  H01L21/283 ,  H01L23/367 ,  H01L23/373 ,  B22F10/36

CPC classification number: B32B15/01 ,  B22F10/28 ,  B23K26/342 ,  B32B7/12 ,  B33Y10/00 ,  B33Y70/10 ,  B33Y80/00 ,  F28D15/00 ,  F28F21/006 ,  F28F21/02 ,  F28F21/04 ,  F28F21/081 ,  H01L21/283 ,  H01L23/367 ,  H01L23/3735 ,  B22F10/36 ,  B32B2457/00 ,  F28F2210/00 ,  B22F2999/00 ,  B22F7/08 ,  B22F10/28

Abstract: A technique to additively print onto a dissimilar material, especially ceramics and glasses (e.g., semiconductors, graphite, diamond, other metals) is disclosed herein. The technique enables manufacture of heat removal devices and other deposited structures, especially on heat sensitive substrates. It also enables novel composites through additive manufacturing. The process enables rapid bonding, orders-of-magnitude faster than conventional techniques.

公开(公告)号：US20250065401A1

公开(公告)日：2025-02-27

申请号：US18814929

申请日：2024-08-26

Applicant: The Research Foundation for the State University of New York

Inventor： Scott N. Schiffres ,  Arad Azizi

IPC: B22F7/08 ,  B22F10/14 ,  B29C64/118 ,  B29L31/34 ,  B33Y10/00 ,  B33Y80/00 ,  H05K7/20

Abstract: A cooling device for electronics created ed by additive manufacturing directly on the surface of an electronic device, the colling device created by processes such as controlled focused energy of laser or electron beam, stereolithography, or fused deposition modeling. The cooling device is especially useful in being placed next to or packaged with high-power electronic chips requiring significant heat dissipation.

公开(公告)号：US11654635B2

公开(公告)日：2023-05-23

申请号：US16852290

申请日：2020-04-17

Applicant: The Research Foundation for the State University of New York

Inventor： Scott N. Schiffres ,  Matthias Daeumer ,  Jacob C. Simmons ,  Arad Azizi

IPC: G01N29/04 ,  G01N29/44 ,  G01N29/34 ,  B22F3/105 ,  B29C64/393 ,  B29C64/153 ,  G06N20/00 ,  B22F10/20 ,  G01N29/24 ,  G01N29/46 ,  G01N21/17 ,  B33Y50/02 ,  B33Y10/00 ,  B22F10/30 ,  G01N25/18

CPC classification number: G01N29/041 ,  B22F10/20 ,  B29C64/153 ,  B29C64/393 ,  G01N21/1717 ,  G01N29/2418 ,  G01N29/346 ,  G01N29/4409 ,  G01N29/46 ,  G06N20/00 ,  B22F10/30 ,  B33Y10/00 ,  B33Y50/02 ,  G01N25/18 ,  G01N2021/1731

Abstract: A system and method for measuring characteristics, comprising: a directed energy source having an energy output which changes over time, incident on an object undergoing additive manufacturing; a sensor configured to measure a dynamic thermal response of at least a portion of the object undergoing additive manufacturing proximate to a directed location of the directed energy source over time with respect distance from the directed location; and at least one processor, configured to analyze the measured dynamic thermal response to determine presence of a manufacturing defect in the object undergoing additive manufacturing, before completion of manufacturing.

公开(公告)号：US20200047288A1

公开(公告)日：2020-02-13

申请号：US16537361

申请日：2019-08-09

Applicant: The Research Foundation for the State University of new York

Inventor： Scott N. Schiffres ,  Arad Azizi

IPC: B23K26/342 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  H01L23/367 ,  H01L23/373 ,  H01L21/283

Abstract: A technique to additively print onto a dissimilar material, especially ceramics and glasses (e.g., semiconductors, graphite, diamond, other metals) is disclosed herein. The technique enables manufacture of heat removal devices and other deposited structures, especially on heat sensitive substrates. It also enables novel composites through additive manufacturing. The process enables rapid bonding, orders-of-magnitude faster than conventional techniques.

公开(公告)号：US20240390975A1

公开(公告)日：2024-11-28

申请号：US18669761

申请日：2024-05-21

Applicant: The Research Foundation for The State University of New York

Inventor： Scott N. Schiffres ,  Arad Azizi

IPC: B22F1/12 ,  B22F10/28 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00

Abstract: Additively manufactured non-metal particle and metal matrix composites are provided. An intermetallic compound interface layer, e.g., metal carbide, is formed between the non-metal particle, e.g., diamond, and the metal matrix, that enhances thermal transfer. One application of this is to form thermal management structures with high thermal conductivity via laser powder bed fusion. A powder material for additively manufacturing a structure, comprising metal particles; and non-metallic particles with thermal conductivities greater than 100 W/m-K and coefficient of thermal expansion less than 10 ppm/degree C., wherein the metal particles are fusible with heat to form a heterogeneous solid structure around the non-metallic particles with an intermetallic compound interface, the heterogeneous solid structure having enhanced thermal conductivity and lower coefficient of thermal expansion with respect to a homogeneous specimen of the fused metal particles alone.

公开(公告)号：US20240165885A1

公开(公告)日：2024-05-23

申请号：US18200492

申请日：2023-05-22

Applicant: The Research Foundation for the State University of New York

Inventor： Scott N. Schiffres ,  Matthias Daeumer ,  Jacob C. Simmons ,  Arad Azizi

IPC: B29C64/393 ,  B22F10/20 ,  B22F10/38 ,  B29C64/153 ,  G01N21/17 ,  G01N29/04 ,  G01N29/24 ,  G01N29/34 ,  G01N29/44 ,  G01N29/46 ,  G06N20/00

CPC classification number: B29C64/393 ,  B22F10/20 ,  B22F10/38 ,  B29C64/153 ,  G01N21/1717 ,  G01N29/041 ,  G01N29/2418 ,  G01N29/346 ,  G01N29/4409 ,  G01N29/46 ,  G06N20/00 ,  B33Y50/02

Abstract: A system and method for measuring characteristics, comprising: a directed energy source having an energy output which changes over time, incident on an object undergoing additive manufacturing; a sensor configured to measure a dynamic thermal response of at least a portion of the object undergoing additive manufacturing proximate to a directed location of the directed energy source over time with respect distance from the directed location; and at least one processor, configured to analyze the measured dynamic thermal response to determine presence of a manufacturing defect in the object undergoing additive manufacturing, before completion of manufacturing.

公开(公告)号：US11426818B2

公开(公告)日：2022-08-30

申请号：US16537361

申请日：2019-08-09

Applicant: The Research Foundation for the State University of new York

Inventor： Scott N. Schiffres ,  Arad Azizi

IPC: B33Y10/00 ,  B23K26/342 ,  B33Y70/00 ,  H01L21/283 ,  H01L23/367 ,  H01L23/373 ,  B33Y80/00 ,  F28F21/02 ,  B32B7/12 ,  F28D15/00 ,  B32B15/01 ,  F28F21/00 ,  F28F21/04 ,  F28F21/08

Abstract: A technique to additively print onto a dissimilar material, especially ceramics and glasses (e.g., semiconductors, graphite, diamond, other metals) is disclosed herein. The technique enables manufacture of heat removal devices and other deposited structures, especially on heat sensitive substrates. It also enables novel composites through additive manufacturing. The process enables rapid bonding, orders-of-magnitude faster than conventional techniques.

公开(公告)号：US11167375B2

公开(公告)日：2021-11-09

申请号：US16537373

申请日：2019-08-09

Applicant: The Research Foundation for the State University of New York

Inventor： Scott N. Schiffres ,  Arad Azizi

IPC: F28F7/00 ,  B23K26/342 ,  B33Y10/00 ,  B33Y70/00 ,  H01L21/283 ,  H01L23/367 ,  H01L23/373 ,  B33Y80/00 ,  F28F21/02 ,  B32B7/12 ,  F28D15/00 ,  B32B15/01 ,  F28F21/00 ,  F28F21/04 ,  F28F21/08

Abstract: A technique to additively print onto a dissimilar material, especially ceramics and glasses (e.g., semiconductors, graphite, diamond, other metals) is disclosed herein. The technique enables manufacture of heat removal devices and other deposited structures, especially on heat sensitive substrates. It also enables novel composites through additive manufacturing. The process enables rapid bonding, orders-of-magnitude faster than conventional techniques.

公开(公告)号：US12220874B2

公开(公告)日：2025-02-11

申请号：US18200492

申请日：2023-05-22

Applicant: The Research Foundation for the State University of New York

Inventor： Scott N. Schiffres ,  Matthias Daeumer ,  Jacob C. Simmons ,  Arad Azizi

IPC: B29C64/393 ,  B22F10/20 ,  B22F10/38 ,  B29C64/153 ,  G01N21/17 ,  G01N29/04 ,  G01N29/24 ,  G01N29/34 ,  G01N29/44 ,  G01N29/46 ,  G06N20/00 ,  B22F10/25 ,  B22F10/28 ,  B22F10/30 ,  B22F10/36 ,  B22F10/37 ,  B22F10/50 ,  B22F10/73 ,  B22F12/90 ,  B33Y10/00 ,  B33Y50/02 ,  G01N25/18

Abstract: A system and method for measuring characteristics, comprising: a directed energy source having an energy output which changes over time, incident on an object undergoing additive manufacturing; a sensor configured to measure a dynamic thermal response of at least a portion of the object undergoing additive manufacturing proximate to a directed location of the directed energy source over time with respect distance from the directed location; and at least one processor, configured to analyze the measured dynamic thermal response to determine presence of a manufacturing defect in the object undergoing additive manufacturing, before completion of manufacturing.