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1.发明申请METHOD FOR CONTACTING A PRINTED CIRCUIT BOARD HAVING ELECTRIC CONTACTS ON BOTH SIDES AND SUCH A PRINTED CIRCUIT BOARD 审中-公开用于接触印刷电路板的方法，该印刷电路板具有两面的电气接触，并且这样一个印刷电路板公开(公告)号：US20120276758A1
公开(公告)日：2012-11-01
申请号：US13512573
申请日：2010-11-12
申请人： Thomas Donauer , David Dussault , Harald Stoyan
发明人： Thomas Donauer , David Dussault , Harald Stoyan
IPC分类号： H01R12/72
CPC分类号： H05K1/117 , F21S4/24 , F21V19/003 , F21Y2115/10 , H05K1/118 , H05K3/0052 , H05K2201/0909 , H05K2201/10106 , H05K2201/10189
摘要： A method for contacting a printed circuit board (1; 14, 15) provided with electrical contacts (8a-8d) on both sides (2, 5), wherein the electrical contacts (8a-8d) on both sides (2, 5) of the printed circuit board (1; 14) are at least partially contacted by at least one ZIF connector (10a, 10b; 13).
摘要翻译： 一种用于接触在两侧（2,5）上设置有电触点（8a-8d）的印刷电路板（1; 14,15）的方法，其中两侧（2,5）上的电触点（8a-8d） 印刷电路板（1; 14）至少部分地被至少一个ZIF连接器（10a，10b; 13）接触。
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公开(公告)号：US08992046B2
公开(公告)日：2015-03-31
申请号：US13262806
申请日：2010-04-01
IPC分类号： F21S4/00 , F21V11/14 , F21S8/08 , F21V19/00 , F21V29/00 , F21K99/00 , F21V7/00 , F21Y101/02 , F21Y111/00
CPC分类号： F21V11/14 , F21K9/00 , F21S8/088 , F21V7/0058 , F21V19/001 , F21V29/004 , F21V29/70 , F21V29/74 , F21Y2107/10 , F21Y2115/10
摘要： A luminous means (1) comprising a multiplicity of light emitting diodes (10) arranged in a manner distributed three-dimensionally and a screen (11) formed from a radiation-opaque or translucent material, wherein the screen (11) encloses the light emitting diodes at least in places, wherein the screen (11) has a multiplicity of perforations disposed downstream of the light emitting diodes (10) in the emission direction, and wherein light emitted by the light emitting diodes (10) during operation of the luminous means passes through the perforations (12).
摘要翻译： 一种发光装置（1），包括以三维分布的方式布置的多个发光二极管（10）和由辐射不透明或半透明材料形成的屏幕（11），其中所述屏幕（11）包围所述发光 二极管至少在其中，其中屏幕（11）具有沿发射方向设置在发光二极管（10）下游的多个穿孔，并且其中在发光装置的操作期间由发光二极管（10）发射的光 穿过穿孔（12）。
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公开(公告)号：US20120182732A1
公开(公告)日：2012-07-19
申请号：US13262806
申请日：2010-04-01
CPC分类号： F21V11/14 , F21K9/00 , F21S8/088 , F21V7/0058 , F21V19/001 , F21V29/004 , F21V29/70 , F21V29/74 , F21Y2107/10 , F21Y2115/10
摘要： A luminous means (1) comprising a multiplicity of light emitting diodes (10) arranged in a manner distributed three-dimensionally and a screen (11) formed from a radiation-opaque or translucent material, wherein the screen (11) encloses the light emitting diodes at least in places, wherein the screen (11) has a multiplicity of perforations disposed downstream of the light emitting diodes (10) in the emission direction, and wherein light emitted by the light emitting diodes (10) during operation of the luminous means passes through the perforations (12).
摘要翻译： 一种发光装置（1），包括以三维分布的方式布置的多个发光二极管（10）和由辐射不透明或半透明材料形成的屏幕（11），其中所述屏幕（11）包围所述发光 二极管至少在其中，其中屏幕（11）具有沿发射方向设置在发光二极管（10）下游的多个穿孔，并且其中在发光装置的操作期间由发光二极管（10）发射的光 穿过穿孔（12）。
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4.发明申请CARRIER COMPRISING AT LEAST ONE SEMICONDUCTOR LUMINOUS DEVICE AND CARRIER SYSTEM 审中-公开包含至少一个半导体器件和载体系统的载体公开(公告)号：US20120002409A1
公开(公告)日：2012-01-05
申请号：US13256230
申请日：2010-03-15
申请人： Thomas Donauer
发明人： Thomas Donauer
CPC分类号： F21V33/0016 , A47H1/144 , A47H2/00 , A47H2001/042 , A47H2023/006 , F21S8/033 , F21V23/0442 , F21W2121/00 , F21Y2103/10 , F21Y2113/13 , F21Y2113/17 , F21Y2115/10
摘要： In various embodiments, a mount may include an elongated basic form which is configured to include at least two functionalities, of which at least one functionality is a lighting functionality, wherein to implement the at least one lighting functionality, the mount includes at least one semiconductor lighting device.
摘要翻译： 在各种实施例中，安装件可以包括细长的基本形式，其被配置为包括至少两个功能，其中至少一个功能是照明功能，其中为了实现所述至少一个照明功能，所述安装件包括至少一个半导体 照明装置。
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公开(公告)号：US20110291125A1
公开(公告)日：2011-12-01
申请号：US13147824
申请日：2010-01-25
IPC分类号： H01L33/08
CPC分类号： F21S4/006 , F21S4/24 , F21V31/005 , F21Y2115/10
摘要： A lighting module may include a lighting band with a band-shaped flexible substrate, wherein at least one semiconductor light source is applied to a top side of the substrate, wherein the lighting module is faced with a protective layer such that at least one emission area of the at least one semiconductor light source is exposed thereby.
摘要翻译： 照明模块可以包括具有带状柔性衬底的照明带，其中至少一个半导体光源被施加到衬底的顶侧，其中照明模块面对保护层，使得至少一个发射区域 的至少一个半导体光源被暴露。
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公开(公告)号：US08994039B2
公开(公告)日：2015-03-31
申请号：US13147824
申请日：2010-01-25
IPC分类号： H01L29/18 , H01L29/22 , F21S4/00 , F21V31/00 , F21Y101/02
CPC分类号： F21S4/006 , F21S4/24 , F21V31/005 , F21Y2115/10
摘要： A lighting module may include a lighting band with a band-shaped flexible substrate, wherein at least one semiconductor light source is applied to a top side of the substrate, wherein the lighting module is faced with a protective layer such that at least one emission area of the at least one semiconductor light source is exposed thereby.
摘要翻译： 照明模块可以包括具有带状柔性衬底的照明带，其中至少一个半导体光源被施加到衬底的顶侧，其中照明模块面对保护层，使得至少一个发射区域 的至少一个半导体光源被暴露。
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