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1.发明授权公开(公告)号：US07448034B2
公开(公告)日：2008-11-04
申请号：US10630257
申请日：2003-07-30
IPC分类号： G06F9/445
CPC分类号： G06F8/63
摘要： A replica image of a computer system is loaded to a target computer system being built. A detection program running on the target computer system detects configuration information and attached devices and provides this information to a build program. The build program provides needed program components, applications, prerequisites and device drivers for the target computer according to build rules defined for the target computer type/model. Optionally, the detection program further detects that there are updates required for the detection program and installs the updates before proceeding with the build process.
摘要翻译： 将计算机系统的副本映像加载到正在构建的目标计算机系统上。 在目标计算机系统上运行的检测程序检测配置信息和附加的设备，并将该信息提供给构建程序。 构建程序根据为目标计算机类型/模型定义的构建规则为目标计算机提供所需的程序组件，应用程序，先决条件和设备驱动程序。 可选地，检测程序进一步检测在进行构建处理之前存在检测程序所需的更新并安装更新。
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公开(公告)号：US07801693B2
公开(公告)日：2010-09-21
申请号：US11728206
申请日：2007-03-23
申请人： David L. Seid , Timothy M. Anderson
发明人： David L. Seid , Timothy M. Anderson
IPC分类号： G01L7/00
摘要： A method and apparatus for improving accuracy of measurement of fluid pressure at a fluid port, such as at a supply port or control port of a fluid control valve, involves a closed-loop precision pressure measurement method with barometric pressure and temperature compensation.
摘要翻译： 用于提高流体端口（例如在流体控制阀的供给口或控制口）处的流体压力的测量精度的方法和装置包括具有大气压力和温度补偿的闭环精密压力测量方法。
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公开(公告)号：US5615084A
公开(公告)日：1997-03-25
申请号：US497496
申请日：1995-06-30
IPC分类号： F28F3/12 , H01L23/467 , H05K7/20
CPC分类号： F28F3/12 , F28F9/026 , H01L23/467 , H01L2924/0002
摘要： A parallel plate heat sink used in conjunction with an air moving device which provides an annular flow of air against the heat sink is further provided with enhanced flow deflector means which selectively block potential exhaust paths so as to redirect the flow of air to the region under a central hub of the fan. This transforms otherwise stagnant air volume in the center of the heat sink into a primary cooling region thus lowering conduction losses and electronic component junction temperatures.
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4.发明授权Convertible heat exchanger for air or water cooling of electronic circuit components and the like 失效用于电子电路部件等的空气或水冷却的可换热换热器
公开(公告)号：US5482113A
公开(公告)日：1996-01-09
申请号：US111755
申请日：1993-08-25
申请人： Dereje Agonafer , Timothy M. Anderson , Gregory M. Chrysler , Richard C. Chu , Robert E. Simons , David T. Vader
发明人： Dereje Agonafer , Timothy M. Anderson , Gregory M. Chrysler , Richard C. Chu , Robert E. Simons , David T. Vader
CPC分类号： H05K7/20254 , F28B1/06 , F28D1/024 , F28D1/053 , F28F1/32 , F28F9/001 , F28F9/22 , H05K7/206 , H05K7/20609 , F28F2280/02
摘要： A heat exchanger, especially for use in conjunction with a wide range of computer systems ranging from work stations to massively parallel processors is employable with both air and water cooling systems. In particular, a heat exchanger is provided which is convertible from a heat sink modality to an air cooling modality and finally to a liquid cooling modality in response to either increased performance demands or an increase in the number of processors or circuit components employed. The conversion may be carried out in the field and provides a flexible and less costly upgradeability path for data processing customers.
摘要翻译： 特别是与从工作站到大规模并行处理器的广泛的计算机系统结合使用的热交换器可以与空气和水冷却系统一起使用。 特别地，提供了一种热交换器，其可以响应于增加的性能要求或使用的处理器或电路部件的数量的增加而从散热器模式转换为空气冷却模式，最后转换为液体冷却模式。 该转换可以在现场进行，并为数据处理客户提供灵活且成本较低的可升级路径。
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公开(公告)号：US5412536A
公开(公告)日：1995-05-02
申请号：US218534
申请日：1994-03-28
IPC分类号： H01L23/427 , H05K7/20 , H05T7/20
CPC分类号： H01L23/427 , H01L2224/16225 , Y10S165/908
摘要： Cooling module geometry provides a method for controlling local condensation for liquid impingement two-phase cooling of electrical and/or electronic circuit chips. The method and apparatus described herein uses vapor condensation in the exhaust flow from each chip site within a multi-chip module which utilizes direct liquid impingement with phase change.
摘要翻译： 冷却模块几何形状提供了一种用于控制电气和/或电子电路芯片的液体冲击两相冷却的局部冷凝的方法。 本文描述的方法和装置在多芯片模块中的每个芯片位置的排气流中使用蒸汽冷凝，其利用具有相变的直接液体冲击。
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公开(公告)号：US5609201A
公开(公告)日：1997-03-11
申请号：US651060
申请日：1996-05-21
IPC分类号： F28F3/12 , H01L23/467 , F28F13/12
CPC分类号： F28F3/12 , F28F9/026 , H01L23/467 , H01L2924/0002
摘要： A parallel plate heat sink used in conjunction with an air moving device which provides an annular flow of air against the heat sink is further provided with enhanced flow deflector means which selectively block potential exhaust paths so as to redirect the flow of air to the region under a central hub of the fan. This transforms otherwise stagnant air volume in the center of the heat sink into a primary cooling region thus lowering conduction losses and electronic component junction temperatures.
摘要翻译： 与空气移动装置结合使用的平行板式散热器，其提供环绕空气流动的散热器，还具有增强的导流装置，该导流装置选择性地阻挡潜在的排气路径，以将空气流重新定向到下面的区域 风扇的中心枢纽。 这样就将散热器中心的空气体积变成一个主要的冷却区域，从而降低传导损耗和电子部件结温度。
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7.发明授权Convertible cooling module for air or water cooling of electronic circuit components 失效可转换冷却模块，用于电子电路部件的空气或水冷
公开(公告)号：US5370178A
公开(公告)日：1994-12-06
申请号：US111675
申请日：1993-08-25
申请人： Dereje Agonafer , Timothy M. Anderson , Gregory M. Chrysler , Richard Chao-fan Chu , Robert E. Simons , David T. Vader
发明人： Dereje Agonafer , Timothy M. Anderson , Gregory M. Chrysler , Richard Chao-fan Chu , Robert E. Simons , David T. Vader
IPC分类号： F28F7/00 , H01L23/467 , H01L23/473
CPC分类号： H01L23/473 , H01L23/467 , H01L2924/0002
摘要： A convertible cooling module, especially for use in conjunction with a wide range of computer systems ranging from workstations to massively parallel processors is employable with both air and water cooling systems. In particular, a cooling module is convertible from a heat sink modality to an air cooling modality, and finally to a liquid cooling modality in response to either increased performance demands or an increase in the number of processors or circuit components employed. The conversion may be carried out in the field and provides a flexible and less costly upgradeability path for computer customers.
摘要翻译： 一个可转换冷却模块，特别适用于从工作站到大规模并行处理器的各种计算机系统，可与空气和水冷却系统一起使用。 特别地，冷却模块可以从散热器模式转换成空气冷却模式，最后可以响应于增加的性能要求或使用的处理器或电路组件的数量的增加而变为液体冷却模式。 该转换可以在现场进行，并为计算机客户提供灵活且成本较低的可升级路径。
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8.发明授权Peer controller management in a dual controller fibre channel storage enclosure 失效双控制器光纤通道存储机柜中的对等控制器管理公开(公告)号：US06477139B1
公开(公告)日：2002-11-05
申请号：US09192546
申请日：1998-11-15
IPC分类号： G01R3108
CPC分类号： G06F11/2017 , G06F11/2007 , G06F11/2035 , G06F11/2094
摘要： A method and system for facilitating reliable and fault-tolerant operation of a multi-peripheral-device enclosure for use in high-availability computer systems by redundant interconnection of redundant processors within the multi-peripheral-device enclosure. The redundant interconnection removes a potential single point of failure, and allows the redundant processors to share in control of other components within the multi-peripheral-device enclosure. The multi-peripheral-device enclosure can recover from failure of all but one of the redundant processors, as well as failure in all but one of the redundant busses used to interconnect the two processors.
摘要翻译： 一种用于通过多外围设备外壳内的冗余处理器的冗余互连来促进用于高可用性计算机系统的多外围设备外壳的可靠和容错操作的方法和系统。 冗余互连消除了潜在的单点故障，并允许冗余处理器共享控制多外围设备外壳内的其他组件。 多外围设备机箱可以从除了一个冗余处理器以外的所有故障中恢复，以及除了用于互连两个处理器的冗余总线之外的所有故障。
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公开(公告)号：US5609202A
公开(公告)日：1997-03-11
申请号：US651061
申请日：1996-05-21
IPC分类号： F28F3/12 , H01L23/467 , F28F13/12
CPC分类号： F28F3/12 , F28F9/026 , H01L23/467 , H01L2924/0002
摘要： A parallel plate heat sink used in conjunction with an air moving device which provides an annular flow of air against the heat sink is further provided with enhanced flow deflector means which selectively block potential exhaust paths so as to redirect the flow of air to the region under a central hub of the fan. This transforms otherwise stagnant air volume in the center of the heat sink into a primary cooling region thus lowering conduction losses and electronic component junction temperatures.
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