公开(公告)号：US20240159825A1

公开(公告)日：2024-05-16

申请号：US18282744

申请日：2022-03-16

Applicant: TOKYO ELECTRON LIMITED

Inventor： Tomoki NUKANOBU ,  Hiroyuki NAKAYAMA ,  Shigeru KASAI ,  Yoshiyuki MORIFUJI ,  Dai KOBAYASHI

IPC: G01R31/311

CPC classification number: G01R31/311

Abstract: There is provided an LED chuck comprising: a top plate on which an object to be inspected is mounted; an LED array substrate disposed to face the object to be inspected, and provided with a plurality of LEDs for heating the object to be inspected that is mounted on the top plate; a cooling plate disposed on a back side of the LED array substrate; an LED control substrate disposed on a back side of the cooling plate and controlling the plurality of LEDs; and a base plate disposed to surround the LED control substrate. A surface of the cooling plate facing the LED control substrate and a surface of the base plate facing the LED control substrate are formed of a magnetic material.

公开(公告)号：US20160109508A1

公开(公告)日：2016-04-21

申请号：US14779856

申请日：2014-03-18

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yutaka AKAIKE ,  Dai KOBAYASHI

IPC: G01R31/28 ,  G01R31/26 ,  G01R1/04

CPC classification number: G01R31/2874 ,  G01R1/04 ,  G01R31/2601 ,  H01L21/67109

Abstract: A substrate inspection apparatus includes a mounting table, an inspection unit, a temperature control unit and a medium channel. The mounting table mounts thereon a substrate on which a semiconductor device is formed. The inspection unit inspects electrical characteristics of the semiconductor device on the mounted substrate. The temperature control unit controls a temperature of the mounting table. The medium channel passes through the mounting table. The temperature control unit includes a high-temperature medium supply unit supplies a high-temperature medium to the medium channel, a low-temperature medium supply unit supplies a low-temperature medium to the medium channel and a medium mixing unit mixes the high-temperature medium and the low-temperature medium which are supplied to the medium channel.

Abstract translation: 基板检查装置包括安装台，检查单元，温度控制单元和介质通道。 安装台安装在其上形成半导体器件的基板上。 检查单元检查安装的基板上的半导体器件的电特性。 温度控制单元控制安装台的温度。 介质通道穿过安装台。 温度控制单元包括高温介质供应单元向介质通道供应高温介质，低温介质供应单元向介质通道供应低温介质，介质混合单元将高温介质 介质和低温介质供给到介质通道。

公开(公告)号：US20210407829A1

公开(公告)日：2021-12-30

申请号：US17356939

申请日：2021-06-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masahito KOBAYASHI ,  Hiroyuki NAKAYAMA ,  Dai KOBAYASHI

IPC: H01L21/67 ,  G01R31/28 ,  G01R31/26 ,  H01L21/683

Abstract: A substrate support includes a supporting unit and a light irradiation mechanism. The supporting unit includes a plate member on which an inspection target is placed and a transparent member. The light irradiation mechanism is configured to irradiate light to increase a temperature of the inspection target. Each of the plate member and the transparent member is made of a low thermal expansion material having a linear expansion coefficient of 1.0×10−6/K or less.

公开(公告)号：US20210156891A1

公开(公告)日：2021-05-27

申请号：US17101735

申请日：2020-11-23

Applicant: Tokyo Electron Limited

Inventor： Dai KOBAYASHI ,  Hiroyuki NAKAYAMA ,  Naoki AKIYAMA

IPC: G01R1/44 ,  G01R1/073 ,  G01R31/28

Abstract: A stage on which an inspection object having an electronic device against which a contact terminal of a probe card of an inspection apparatus is pressed by a load applied thereto is placed, includes a first cooling plate including a first coolant flow path formed therein, a heating source mounted on the first cooling plate and including a plurality of light emitting elements so as to heat the inspection object, a transparent member provided on the heating source and transmitting light output from the heating source, a second cooling plate provided on the transparent member so as to hold the inspection object and including a second coolant flow path formed therein, and a transparent resin layer filled between the first cooling plate and the transparent member so as to cover the heating source.

公开(公告)号：US20190025370A1

公开(公告)日：2019-01-24

申请号：US16033827

申请日：2018-07-12

Applicant: TOKYO ELECTRON LIMITED

Inventor： Dai KOBAYASHI

IPC: G01R31/28

CPC classification number: G01R31/2877 ,  G01R31/2886

Abstract: A substrate mounting table, which is used for an electrical characteristics inspection of a semiconductor device formed on a substrate, includes a plurality of layers partitioned in a direction perpendicular to a mounting surface on which the substrate is mounted, wherein coolant paths are formed on at least two layers among the plurality of layers, each of the coolant paths having an inlet port and an outlet port located in a circumferential portion of a corresponding one of the at least two layers.

公开(公告)号：US20210156890A1

公开(公告)日：2021-05-27

申请号：US16953814

申请日：2020-11-20

Applicant: Tokyo Electron Limited

Inventor： Dai KOBAYASHI ,  Hiroyuki NAKAYAMA ,  Yutaka AKAIKE

IPC: G01R1/44 ,  G01R1/04 ,  G01R31/28

Abstract: A stage on which an inspection object having an electronic device is placed, the electronic device being pressed against a contact terminal of a probe card of an inspection apparatus by applying a load, includes: a first cooling plate including a first coolant flow path formed in the first cooling plate; a heating source mounted on the first cooling plate and configured to heat the inspection object; a transmission member installed on the heating source and transmits light output from the heating source; and a second cooling plate installed on the transmission member, including a placement surface configured to vacuum-suction the inspection object and a second coolant flow path, made of ceramic, and subjected to a mirror polishing process on the placement surface.