公开(公告)号：US20210389366A1

公开(公告)日：2021-12-16

申请号：US17286959

申请日：2019-10-17

Applicant: Tokyo Electron Limited

Inventor： Naoki AKIYAMA ,  Susumu SAITO ,  Hiroyuki NAKAYAMA ,  Shigeru KASAI

IPC: G01R31/28 ,  G01R1/067 ,  G01R1/073

Abstract: In an inspection apparatus for inspecting an inspection target device formed on an inspection object, the inspection target device is a back-illuminated imaging device into which light is incident from a rear surface opposite to a side of a wiring layer. The inspection apparatus includes a stage having the inspection object placed such that the inspection object faces the rear surface. The stage includes a light transmitter made of a light-transmissive material. The inspection object is placed on the light transmitter below which a light illuminator is disposed. The light illuminator includes a flat light guide plate having a facing surface facing the inspection object. A light source is provided laterally outside the light guide plate configured to diffuse light emitted from the light source incident from a side end surface of the light guide plate, and to emit the light as planar light from the facing surface.

公开(公告)号：US20210156891A1

公开(公告)日：2021-05-27

申请号：US17101735

申请日：2020-11-23

Applicant: Tokyo Electron Limited

Inventor： Dai KOBAYASHI ,  Hiroyuki NAKAYAMA ,  Naoki AKIYAMA

IPC: G01R1/44 ,  G01R1/073 ,  G01R31/28

Abstract: A stage on which an inspection object having an electronic device against which a contact terminal of a probe card of an inspection apparatus is pressed by a load applied thereto is placed, includes a first cooling plate including a first coolant flow path formed therein, a heating source mounted on the first cooling plate and including a plurality of light emitting elements so as to heat the inspection object, a transparent member provided on the heating source and transmitting light output from the heating source, a second cooling plate provided on the transparent member so as to hold the inspection object and including a second coolant flow path formed therein, and a transparent resin layer filled between the first cooling plate and the transparent member so as to cover the heating source.

公开(公告)号：US20200286728A1

公开(公告)日：2020-09-10

申请号：US16806414

申请日：2020-03-02

Applicant: TOKYO ELECTRON LIMITED

Inventor： Hiroyuki NAKAYAMA

IPC: H01L21/02 ,  H01L21/324 ,  H01L21/66 ,  G01R31/26 ,  B08B5/02

Abstract: A cleaning method in an inspection apparatus that performs an electrical characteristic inspection on a device under test formed in an inspection object, includes: transferring, in a transfer process, a stage on which the inspection object is mounted to a position facing a probe card having probes, the probes being brought into contact with the device under test during the electrical characteristic inspection; subsequently, exhausting and depressurizing a space between the probe card and the stage facing the probe card in a peeling-off preparation process; introducing a gas into the space which has been depressurized and peeling off foreign substances adhering to a front surface of the stage and the probes in a foreign substance peeling-off process; and exhausting the space to discharge the foreign substances while continuously introducing the gas into the space in a foreign substance discharging process.

公开(公告)号：US20250112096A1

公开(公告)日：2025-04-03

申请号：US18981261

申请日：2024-12-13

Applicant: Tokyo Electron Limited

Inventor： Hiroyuki NAKAYAMA

IPC: H01L21/66 ,  H01L21/67

Abstract: Provided is an inspection method for inspecting an inspection object of a first substrate, comprising: (a) preparing the first substrate having a first electrode connected to the inspection object; (b) preparing a second substrate having a second electrode and a bonding portion which are formed on a first main surface, and having a third electrode formed on a second main surface opposite to the first main surface and electrically connected to the second electrode; (c) bringing the first electrode and the second electrode into electrical contact with each other and forming a sealed space between the first substrate and the second substrate by bonding the first substrate and the second substrate with an adhesive interposed therebetween; (d) curing the adhesive; (e) inspecting the inspection object; and (f) separating the first substrate from the second substrate.

公开(公告)号：US20220018898A1

公开(公告)日：2022-01-20

申请号：US17374660

申请日：2021-07-13

Applicant: TOKYO ELECTRON LIMITED

Inventor： Hiroyuki NAKAYAMA

IPC: G01R31/308 ,  G01R1/073 ,  G01R1/44

Abstract: An inspection apparatus includes a stage on which a substrate is placed, a cooler, a probe card, a light irradiator and a controller. The cooler cools the substrate placed on the stage. The probe card has probes to be in contact with the substrate to supply electric power. The light irradiator irradiates light to an upper surface of the substrate, opposite to a bottom surface of the substrate placed on the stage. Further, the controller controls the light irradiator.

公开(公告)号：US20210382105A1

公开(公告)日：2021-12-09

申请号：US17287836

申请日：2019-10-17

Applicant: Tokyo Electron Limited

Inventor： Naoki AKIYAMA ,  Susumu SAITO ,  Hiroyuki NAKAYAMA ,  Shigeru KASAI

IPC: G01R31/28 ,  G01R31/308

Abstract: An inspection apparatus for inspecting a backside irradiation type imaging device formed on an inspection object includes: a stage on which the inspection object is mounted such that the stage faces a rear surface of the backside irradiation type imaging device, wherein the stage includes: a transmitter including a flat plate formed of a light transmitting material, and configured to mount the inspection object on the transmitter; and a light emitter disposed at a location facing the inspection object with the transmitter interposed between the light emitter and the inspection object, and configured to emit light toward the transmitter, and wherein the transmitter transmits the light from the light emitter while diffusing the light.

公开(公告)号：US20210296145A1

公开(公告)日：2021-09-23

申请号：US17198704

申请日：2021-03-11

Applicant: TOKYO ELECTRON LIMITED

Inventor： Hiroyuki NAKAYAMA

IPC: H01L21/67 ,  H01L21/673

Abstract: A substrate support includes a top plate portion having a surface on which a substrate is placed; a light irradiation mechanism including light-emitting elements, disposed to face the substrate and heating the substrate using light from the light-emitting elements; a channel-forming member transmitting the light from the light-emitting elements and is bonded to a rear surface of the top plate portion so as to be interposed between the top plate portion and the light irradiation mechanism, and a temperature adjustment part for adjusting a temperature of the channel-forming member by using light having a wavelength absorbed by a light-transmitting material or the channel-forming member. Refrigerant channels are formed between the channel-forming member and the top plate portion, a refrigerant transmitting the light from the light-emitting elements flows through the refrigerant channels, and the top plate portion and the channel-forming member are made of materials having different thermal expansion coefficients.

公开(公告)号：US20240125843A1

公开(公告)日：2024-04-18

申请号：US18546832

申请日：2022-02-14

Applicant: Tokyo Electron Limited

Inventor： Hiroyuki NAKAYAMA

IPC: G01R31/28

CPC classification number: G01R31/2849 ,  G01R31/2831

Abstract: A test device according to one aspect of the present disclosure includes a stage configured to mount a substrate, a first temperature sensor configured to measure a surface temperature of the stage and a temperature of the substrate mounted on the stage, a second temperature sensor for controlling a temperature of the stage, and a controller configured to control the temperature of the stage by offsetting a control temperature of the second temperature sensor based on the surface temperature of the stage and the temperature of the substrate that are measured by the first temperature sensor.

公开(公告)号：US20220015193A1

公开(公告)日：2022-01-13

申请号：US17370347

申请日：2021-07-08

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shigeru KASAI ,  Hiroyuki NAKAYAMA ,  Yutaka AKAIKE ,  Hiroaki KOMIYA ,  Yoshiyasu KATO

IPC: H05B1/02 ,  H05B3/22 ,  G01R31/28

Abstract: A method for adjusting a temperature of a substrate support is provided. In an apparatus for inspecting a target device, a substrate placement surface of the substrate support is divided into multiple regions and a heater is disposed in each of the multiple regions. The method comprises controlling the heater in a main region corresponding to the target device such that a temperature of the main region becomes a set temperature, and controlling the heater in a sub-region adjacent to the main region. When overshoot has not occurred in the temperature of the main region, the heater in the sub-region is controlled such that a temperature difference between the main region and the sub-region becomes a predetermined value, and when overshoot has occurred, the heater of the sub-region is controlled such that a difference between the set temperature and the temperature in the sub-region becomes the predetermined value.

公开(公告)号：US20210407829A1

公开(公告)日：2021-12-30

申请号：US17356939

申请日：2021-06-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masahito KOBAYASHI ,  Hiroyuki NAKAYAMA ,  Dai KOBAYASHI

IPC: H01L21/67 ,  G01R31/28 ,  G01R31/26 ,  H01L21/683

Abstract: A substrate support includes a supporting unit and a light irradiation mechanism. The supporting unit includes a plate member on which an inspection target is placed and a transparent member. The light irradiation mechanism is configured to irradiate light to increase a temperature of the inspection target. Each of the plate member and the transparent member is made of a low thermal expansion material having a linear expansion coefficient of 1.0×10−6/K or less.