公开(公告)号：US20180095370A1

公开(公告)日：2018-04-05

申请号：US15720891

申请日：2017-09-29

Applicant: Tokyo Electron Limited

Inventor： Hideaki KASHIWAGI ,  Takafumi NIWA ,  Norihisa KOGA

IPC: G03F7/20 ,  G03F7/16 ,  H01L21/67 ,  G03F7/40 ,  H01L21/027

CPC classification number: G03F7/70991 ,  G03F7/168 ,  G03F7/2022 ,  G03F7/40 ,  H01L21/027 ,  H01L21/0274 ,  H01L21/67178 ,  H01L21/67225 ,  H01L21/67248 ,  H01L21/67253 ,  H01L22/20

Abstract: An auxiliary exposure apparatus is for performing auxiliary exposure of applying light of a predetermined wavelength from a laser light source to a resist film on a wafer, separately from exposure processing of transferring a pattern of a mask to the resist film applied on the wafer, and includes: a first total reflection mirror configured to reflect the light from the laser light source toward the wafer; and an imaging device including a light receiving part configured to receive light after reflected by the wafer.

公开(公告)号：US20230314960A1

公开(公告)日：2023-10-05

申请号：US18025170

申请日：2021-08-19

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masashi ENOMOTO ,  Hideaki KASHIWAGI ,  Naoto NAKAMURA

IPC: G03F7/20 ,  G06T7/62 ,  G06T7/13 ,  G06T7/73 ,  G01B11/03 ,  G01B11/02

CPC classification number: G03F7/70625 ,  G06T7/62 ,  G06T7/13 ,  G06T7/74 ,  G03F7/2028 ,  G03F7/7085 ,  G01B11/03 ,  G01B11/022 ,  G01B2210/56

Abstract: An apparatus includes: an capturing part that captures a peripheral edge portion of a substrate including a reference substrate and a workpiece substrate, so as to acquire captured images of the reference and workpiece substrates; a first calculation part that calculates a theoretical peripheral edge position of the reference substrate in the captured image of the reference substrate with reference to a center thereof, a second calculation part that calculates a theoretical peripheral edge position of the workpiece substrate in the captured image of the workpiece substrate based on the theoretical peripheral edge position of the reference substrate and the captured image of the workpiece substrate; a setting part that sets processing parameters for the peripheral edge portion of the substrate based on the theoretical peripheral edge position of the workpiece substrate; and a processing part that processes the peripheral edge portion of the substrate based on the processing parameters.