公开(公告)号：US09922859B2

公开(公告)日：2018-03-20

申请号：US14163015

申请日：2014-01-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shintaro Sugihara ,  Naoto Yoshitaka ,  Shigenori Kitahara ,  Keizo Hirose

IPC: B23Q3/08 ,  H01L21/673 ,  H01L21/683 ,  H01L21/67 ,  H01L21/68

Abstract: A joining device for joining substrates together includes a first holding member configured to vacuum-suck a first substrate to draw and hold the first substrate on a lower surface thereof, and a second holding member disposed below the first holding member and configured to vacuum-suck a second substrate to draw and hold the second substrate on an upper surface thereof. The second holding member includes a body portion formed into a size larger than the second substrate when seen in a plan view and configured to vacuum-suck the second substrate, a plurality of pins provided on the body portion and configured to make contact with a rear surface of the second substrate, and an outer wall portion annularly provided on the body portion at an outer side of the plurality of pins and configured to support an outer periphery portion of the rear surface of the second substrate.

公开(公告)号：US09960069B2

公开(公告)日：2018-05-01

申请号：US14163015

申请日：2014-01-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shintaro Sugihara ,  Naoto Yoshitaka ,  Shigenori Kitahara ,  Keizo Hirose

IPC: B23Q3/08 ,  H01L21/673 ,  H01L21/683 ,  H01L21/67 ,  H01L21/68

CPC classification number: H01L21/6838 ,  H01L21/67092 ,  H01L21/681 ,  Y10T29/53974

Abstract: A joining device for joining substrates together includes a first holding member configured to vacuum-suck a first substrate to draw and hold the first substrate on a lower surface thereof, and a second holding member disposed below the first holding member and configured to vacuum-suck a second substrate to draw and hold the second substrate on an upper surface thereof. The second holding member includes a body portion formed into a size larger than the second substrate when seen in a plan view and configured to vacuum-suck the second substrate, a plurality of pins provided on the body portion and configured to make contact with a rear surface of the second substrate, and an outer wall portion annularly provided on the body portion at an outer side of the plurality of pins and configured to support an outer periphery portion of the rear surface of the second substrate.

公开(公告)号：US11894246B2

公开(公告)日：2024-02-06

申请号：US17816810

申请日：2022-08-02

Applicant: Tokyo Electron Limited

Inventor： Norio Wada ,  Shintaro Sugihara

IPC: B32B43/00 ,  H01L21/67 ,  H01L21/687 ,  H01L21/683

CPC classification number: H01L21/67092 ,  H01L21/6838 ,  H01L21/68742 ,  B32B43/006 ,  Y10T156/1132 ,  Y10T156/1179 ,  Y10T156/1944 ,  Y10T156/1983

Abstract: A bonding apparatus includes a first holder, a second holder, an attracting pressure generator and a lift pin. The first holder is configured to hold a first substrate. The second holder, disposed at a position facing the first holder, has an attraction surface configured to attract a second substrate to be bonded to the first substrate. The attracting pressure generator is configured to generate an attracting pressure in the attraction surface. The lift pin is configured to space the second substrate on the attraction surface apart from the second holder. The second holder is provided with a space including an opening through which the lift pin passes, and the space is controlled to have a pressure lower than an atmospheric pressure.

公开(公告)号：US09694572B2

公开(公告)日：2017-07-04

申请号：US14532294

申请日：2014-11-04

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shintaro Sugihara ,  Hajime Furuya ,  Goro Furutani ,  Yasunobu Iwamoto

IPC: B32B38/10 ,  B32B38/18 ,  H01L21/67 ,  H01L21/68 ,  H01L21/687 ,  B32B38/00 ,  B32B37/10

CPC classification number: B32B38/1858 ,  B32B37/10 ,  B32B2038/0056 ,  B32B2038/1891 ,  B32B2309/10 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/681 ,  H01L21/6875 ,  Y10T156/1744

Abstract: Provided is a device of bonding substrates together, which includes a first holding unit configured to vacuum-draw a first substrate and to adsorptively hold the first substrate on a lower surface thereof and a second holding unit installed below the first holding unit and configured to vacuum-draw a second substrate and to adsorptively hold the second substrate on an upper surface thereof. The second holding unit includes: a body portion configured to vacuum-draw the entire surface of the second substrate; a plurality of pins installed on the body portion and configured to make contact with a rear surface of the second substrate; and a support portion installed on the body portion at the outer side of the pins, the support portion having a reduced contact area over which the support portion makes contact with an outer peripheral portion of the second substrate.

公开(公告)号：US20240282617A1

公开(公告)日：2024-08-22

申请号：US18442522

申请日：2024-02-15

Applicant: Tokyo Electron Limited

Inventor： Kimio Motoda ,  Kenji Sugakawa ,  Norifumi Kohama ,  Hideyuki Fukushima ,  Shintaro Sugihara ,  Norio Wada

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/68 ,  H01L21/687

CPC classification number: H01L21/6838 ,  H01L21/67288 ,  H01L21/681 ,  H01L21/68785

Abstract: A substrate processing apparatus is equipped with a holder having, on an attraction surface configured to attract a substrate, a circular central region and an annular outer region disposed outside the central region. The holder includes a first attracting pressure generator configured to generate an attracting pressure in the central region to attract the substrate to the holder; a second attracting pressure generator configured to generate an attracting pressure in the outer region to attract the substrate to the holder; and an external force applier configured to apply an external force to the substrate in the outer region in a direction in which the substrate becomes farther from the holder.

公开(公告)号：US20230039173A1

公开(公告)日：2023-02-09

申请号：US17816810

申请日：2022-08-02

Applicant: Tokyo Electron Limited

Inventor： Norio Wada ,  Shintaro Sugihara

IPC: H01L21/67 ,  H01L21/683 ,  H01L21/687

Abstract: A bonding apparatus includes a first holder, a second holder, an attracting pressure generator and a lift pin. The first holder is configured to hold a first substrate. The second holder, disposed at a position facing the first holder, has an attraction surface configured to attract a second substrate to be bonded to the first substrate. The attracting pressure generator is configured to generate an attracting pressure in the attraction surface. The lift pin is configured to space the second substrate on the attraction surface apart from the second holder. The second holder is provided with a space including an opening through which the lift pin passes, and the space is controlled to have a pressure lower than an atmospheric pressure.

公开(公告)号：US09263268B2

公开(公告)日：2016-02-16

申请号：US14281152

申请日：2014-05-19

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masahiro Yamamoto ,  Shintaro Sugihara ,  Hajime Furuya

IPC: H01L21/00 ,  H01L21/18 ,  H01L21/68 ,  H01L21/67

CPC classification number: H01L21/187 ,  H01L21/67092 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/68

Abstract: A joining device for joining substrates with an intermolecular force includes a first holding unit configured to hold a first substrate on a lower surface thereof, a second holding unit installed below the first holding unit and configured to hold a second substrate on an upper surface thereof, and a temperature adjustment mechanism configured to adjust a temperature of the first substrate before the first substrate is held in the first holding unit and a temperature of the second substrate before the second substrate is held in the second holding unit to a predetermined temperature.

Abstract translation: 用于使基板与分子间力接合的接合装置包括：第一保持单元，其构造成在其下表面上保持第一基板;第二保持单元，安装在第一保持单元下方，并且构造成在其上表面上保持第二基板; 以及温度调节机构，其被配置为在所述第一基板被保持在所述第一保持单元之前调节所述第一基板的温度，并且将所述第二基板的温度保持在所述第二保持单元中之前的温度达到预定温度。