公开(公告)号：US10201826B2

公开(公告)日：2019-02-12

申请号：US14729385

申请日：2015-06-03

Applicant: Tokyo Electron Limited

Inventor： Katsunori Ichino ,  Takayuki Ishii ,  Kouzou Kawahara ,  Daisuke Simokawa ,  Kazuyuki Tashiro

IPC: B05D3/12 ,  B05C5/02 ,  B05C11/10 ,  B05D1/00 ,  G03F7/16 ,  H01L21/67

Abstract: Disclosed is a liquid coating method. The method executes processes of: coating a coating liquid in a spiral form on a surface of a substrate by ejecting the coating liquid from the ejection nozzle while moving the ejection nozzle in a predetermined direction between the rotary axis and a peripheral edge of the substrate during rotation of the substrate; making a linear velocity at an ejection position of the coating liquid from the ejection nozzle substantially constant by reducing a number of rotations of the substrate as the ejection position is positioned closer to the peripheral edge of the substrate; and making an ejection flow rate of the coating liquid ejected from the ejection nozzle substantially constant by changing a gap between the ejection port of the ejection nozzle and the surface of the substrate based on a flow rate of the coating liquid before ejection from the ejection nozzle.

公开(公告)号：US09082614B1

公开(公告)日：2015-07-14

申请号：US14682268

申请日：2015-04-09

Applicant: Tokyo Electron Limited

Inventor： Shinichi Hatakeyama ,  Yoshitomo Sato ,  Kazuyuki Tashiro ,  Naofumi Kishita

IPC: H01L21/31 ,  H01L21/02

CPC classification number: H01L21/02282 ,  H01L21/6715

Abstract: There is provided a periphery coating method of coating a coating liquid on a periphery region of a substrate. The method includes performing a scan-in process of moving the coating liquid nozzle from an outside of an edge of the substrate to a position above the periphery region of the substrate while rotating the substrate and discharging the coating liquid from the coating liquid nozzle; and performing a scan-out process of moving the coating liquid nozzle from the position above the periphery region of the substrate to the outside of the edge of the substrate while rotating the substrate and discharging the coating liquid from the coating liquid nozzle. Further, in the scan-out process, the coating liquid nozzle is moved at a speed lower than a speed at which the coating liquid is moved to a side of an edge of the substrate.

Abstract translation: 提供了在基板的周边区域上涂布涂布液的周边涂布方法。 该方法包括：在旋转基板并从涂布液喷嘴排出涂布液的同时，将涂布液喷嘴从基板的边缘的外侧移动到基板的周边区域以上的位置的扫描过程; 并且在旋转基板并从涂布液喷嘴排出涂布液的同时执行将涂布液喷嘴从基板的周边区域上方的位置移动到基板的边缘的外部的扫描处理。 此外，在扫描过程中，涂布液喷嘴以比涂布液移动到基板的边缘侧的速度低的速度移动。

公开(公告)号：US09027508B2

公开(公告)日：2015-05-12

申请号：US14095054

申请日：2013-12-03

Applicant: Tokyo Electron Limited

Inventor： Shinichi Hatakeyama ,  Yoshitomo Sato ,  Kazuyuki Tashiro ,  Naofumi Kishita

IPC: B05C11/00 ,  H01L21/67

CPC classification number: H01L21/02282 ,  H01L21/6715

Abstract: A periphery coating unit performs a scan-in process of moving a resist liquid nozzle 27 from an outside of an edge Wb of a wafer W to a position above a periphery region Wc of the wafer W while rotating the wafer W and discharging a resist liquid from the resist liquid nozzle 27; and a scan-out process of moving the resist liquid nozzle 27 from the position above the periphery region Wc of the wafer W to the outside of the edge Wb of the wafer W while rotating the wafer W and discharging the resist liquid from the resist liquid nozzle 27. Further, in the scan-out process, the resist liquid nozzle 27 is moved at a speed v2 lower than a speed v3 at which the resist liquid is moved to a side of the edge Wb of the wafer W.

Abstract translation: 周边涂布单元执行扫描过程，其将抗蚀剂液体喷嘴27从晶片W的边缘Wb的外侧移动到晶片W的周边区域Wc上方的位置，同时旋转晶片W并且将抗蚀剂液体 来自抗蚀液喷嘴27; 以及扫描输出处理，其将抗蚀剂液体喷嘴27从晶片W的周边区域Wc上方的位置移动到晶片W的边缘Wb的外侧，同时旋转晶片W并从抗蚀剂液体排出抗蚀剂液体 此外，在扫描输出处理中，抗蚀剂液体喷嘴27以比抗蚀剂液体移动到晶片W的边缘Wb侧的速度v3的速度V2移动。

公开(公告)号：US20150352587A1

公开(公告)日：2015-12-10

申请号：US14729385

申请日：2015-06-03

Applicant: Tokyo Electron Limited

Inventor： Katsunori Ichino ,  Takayuki Ishii ,  Kouzou Kawahara ,  Daisuke Simokawa ,  Kazuyuki Tashiro

IPC: B05C5/02 ,  B05D1/00 ,  B05D1/26 ,  B05C11/10

CPC classification number: B05C5/0216 ,  B05C5/0225 ,  B05C11/1002 ,  B05D1/002 ,  B05D1/005 ,  G03F7/162 ,  H01L21/6715

Abstract: Disclosed is a liquid coating method. The method executes processes of: coating a coating liquid in a spiral form on a surface of a substrate by ejecting the coating liquid from the ejection nozzle while moving the ejection nozzle in a predetermined direction between the rotary axis and a peripheral edge of the substrate during rotation of the substrate; making a linear velocity at an ejection position of the coating liquid from the ejection nozzle substantially constant by reducing a number of rotations of the substrate as the ejection position is positioned closer to the peripheral edge of the substrate; and making an ejection flow rate of the coating liquid ejected from the ejection nozzle substantially constant by changing a gap between the ejection port of the ejection nozzle and the surface of the substrate based on a flow rate of the coating liquid before ejection from the ejection nozzle.

Abstract translation: 公开了一种液体涂布方法。 该方法执行以下处理：在衬底的表面上涂布涂布液，从喷嘴喷射涂布液，同时在旋转轴与衬底的周缘之间沿预定方向移动喷嘴， 基板旋转; 通过当喷射位置更靠近基板的周缘定位时，通过减少基板的旋转数来使来自喷嘴的涂布液的喷射位置处的线速度基本上恒定; 并且通过基于喷射喷嘴之前的涂布液的流量来改变喷射嘴的喷射口和基板的表面之间的间隙，使从喷嘴喷出的涂布液的喷射流量基本上恒定 。

公开(公告)号：US20150214046A1

公开(公告)日：2015-07-30

申请号：US14682268

申请日：2015-04-09

Applicant: Tokyo Electron Limited

Inventor： Shinichi Hatakeyama ,  Yoshitomo Sato ,  Kazuyuki Tashiro ,  Naofumi Kishita

IPC: H01L21/02

CPC classification number: H01L21/02282 ,  H01L21/6715

Abstract: There is provided a periphery coating method of coating a coating liquid on a periphery region of a substrate. The method includes performing a scan-in process of moving the coating liquid nozzle from an outside of an edge of the substrate to a position above the periphery region of the substrate while rotating the substrate and discharging the coating liquid from the coating liquid nozzle; and performing a scan-out process of moving the coating liquid nozzle from the position above the periphery region of the substrate to the outside of the edge of the substrate while rotating the substrate and discharging the coating liquid from the coating liquid nozzle. Further, in the scan-out process, the coating liquid nozzle is moved at a speed lower than a speed at which the coating liquid is moved to a side of an edge of the substrate.

Abstract translation: 提供了在基板的周边区域上涂布涂布液的周边涂布方法。 该方法包括：在旋转基板并从涂布液喷嘴排出涂布液的同时，将涂布液喷嘴从基板的边缘的外侧移动到基板的周边区域以上的位置的扫描过程; 并且在旋转基板并从涂布液喷嘴排出涂布液的同时执行将涂布液喷嘴从基板的周边区域上方的位置移动到基板的边缘的外部的扫描处理。 此外，在扫描过程中，涂布液喷嘴以比涂布液移动到基板的边缘侧的速度低的速度移动。

公开(公告)号：US20140154890A1

公开(公告)日：2014-06-05

申请号：US14095054

申请日：2013-12-03

Applicant: Tokyo Electron Limited

Inventor： Shinichi Hatakeyama ,  Yoshitomo Sato ,  Kazuyuki Tashiro ,  Naofumi Kishita

IPC: H01L21/02 ,  H01L21/67

CPC classification number: H01L21/02282 ,  H01L21/6715

Abstract: A periphery coating unit performs a scan-in process of moving a resist liquid nozzle 27 from an outside of an edge Wb of a wafer W to a position above a periphery region Wc of the wafer W while rotating the wafer W and discharging a resist liquid from the resist liquid nozzle 27; and a scan-out process of moving the resist liquid nozzle 27 from the position above the periphery region Wc of the wafer W to the outside of the edge Wb of the wafer W while rotating the wafer W and discharging the resist liquid from the resist liquid nozzle 27. Further, in the scan-out process, the resist liquid nozzle 27 is moved at a speed v2 lower than a speed v3 at which the resist liquid is moved to a side of the edge Wb of the wafer W.

Abstract translation: 周边涂布单元执行扫描过程，其将抗蚀剂液体喷嘴27从晶片W的边缘Wb的外侧移动到晶片W的周边区域Wc上方的位置，同时旋转晶片W并且将抗蚀剂液体 来自抗蚀液喷嘴27; 以及扫描输出处理，其将抗蚀剂液体喷嘴27从晶片W的周边区域Wc上方的位置移动到晶片W的边缘Wb的外侧，同时旋转晶片W并从抗蚀剂液体排出抗蚀剂液体 此外，在扫描输出处理中，抗蚀剂液体喷嘴27以比抗蚀剂液体移动到晶片W的边缘Wb侧的速度v3的速度V2移动。