公开(公告)号：US20150352587A1

公开(公告)日：2015-12-10

申请号：US14729385

申请日：2015-06-03

Applicant: Tokyo Electron Limited

Inventor： Katsunori Ichino ,  Takayuki Ishii ,  Kouzou Kawahara ,  Daisuke Simokawa ,  Kazuyuki Tashiro

IPC: B05C5/02 ,  B05D1/00 ,  B05D1/26 ,  B05C11/10

CPC classification number: B05C5/0216 ,  B05C5/0225 ,  B05C11/1002 ,  B05D1/002 ,  B05D1/005 ,  G03F7/162 ,  H01L21/6715

Abstract: Disclosed is a liquid coating method. The method executes processes of: coating a coating liquid in a spiral form on a surface of a substrate by ejecting the coating liquid from the ejection nozzle while moving the ejection nozzle in a predetermined direction between the rotary axis and a peripheral edge of the substrate during rotation of the substrate; making a linear velocity at an ejection position of the coating liquid from the ejection nozzle substantially constant by reducing a number of rotations of the substrate as the ejection position is positioned closer to the peripheral edge of the substrate; and making an ejection flow rate of the coating liquid ejected from the ejection nozzle substantially constant by changing a gap between the ejection port of the ejection nozzle and the surface of the substrate based on a flow rate of the coating liquid before ejection from the ejection nozzle.

Abstract translation: 公开了一种液体涂布方法。 该方法执行以下处理：在衬底的表面上涂布涂布液，从喷嘴喷射涂布液，同时在旋转轴与衬底的周缘之间沿预定方向移动喷嘴， 基板旋转; 通过当喷射位置更靠近基板的周缘定位时，通过减少基板的旋转数来使来自喷嘴的涂布液的喷射位置处的线速度基本上恒定; 并且通过基于喷射喷嘴之前的涂布液的流量来改变喷射嘴的喷射口和基板的表面之间的间隙，使从喷嘴喷出的涂布液的喷射流量基本上恒定 。

公开(公告)号：US11510284B2

公开(公告)日：2022-11-22

申请号：US16583662

申请日：2019-09-26

Applicant: Tokyo Electron Limited

Inventor： Satoshi Morita ,  Masami Akimoto ,  Katsuhiro Morikawa ,  Kouichi Mizunaga ,  Kouzou Kawahara

IPC: H05B3/68 ,  H05B1/02 ,  H01L21/687 ,  H01L21/67

Abstract: A substrate processing apparatus includes a rotary table configured to hold and rotate a substrate; an electronic component provided at the rotary table and configured to be rotated along with the rotary table; a first electrode unit provided at the rotary table and configured to be rotated along with the rotary table, the first electrode unit comprising multiple first electrodes electrically connected to the electronic component via multiple first conductive lines; an electric device configured to perform a power supply to the electronic component and a transmission/reception of signals; a second electrode unit comprising multiple second electrodes electrically connected to the electric device via multiple second conductive lines and arranged at positions respectively corresponding to the multiple first electrodes to be brought into contact with the multiple first electrodes; and an electrode moving device configured to connect/disconnect the first electrode unit to/from the second electrode unit.

公开(公告)号：US11862489B2

公开(公告)日：2024-01-02

申请号：US17063828

申请日：2020-10-06

Applicant: Tokyo Electron Limited

Inventor： Satoshi Morita ,  Kouzou Kawahara

IPC: H01L21/67 ,  H01L21/687 ,  H05B6/10

CPC classification number: H01L21/67103 ,  H01L21/68785 ,  H05B6/10 ,  H01L21/67023

Abstract: A substrate processing apparatus includes: a rotary stage configured to hold a substrate; a rotary driver configured to rotate the rotary stage around a rotation axis; at least one electric heater installed in the rotary stage; at least one power receiving coil installed in the rotary stage and electrically connected to the electric heater; at least one power feeding coil installed to face the power receiving coil in a direction of the rotation axis with a gap between the power feeding coil and the power receiving coil; and a radio-frequency power supply unit configured to supply radio-frequency power to the power feeding coil.

公开(公告)号：US10201826B2

公开(公告)日：2019-02-12

申请号：US14729385

申请日：2015-06-03

Applicant: Tokyo Electron Limited

Inventor： Katsunori Ichino ,  Takayuki Ishii ,  Kouzou Kawahara ,  Daisuke Simokawa ,  Kazuyuki Tashiro

IPC: B05D3/12 ,  B05C5/02 ,  B05C11/10 ,  B05D1/00 ,  G03F7/16 ,  H01L21/67

Abstract: Disclosed is a liquid coating method. The method executes processes of: coating a coating liquid in a spiral form on a surface of a substrate by ejecting the coating liquid from the ejection nozzle while moving the ejection nozzle in a predetermined direction between the rotary axis and a peripheral edge of the substrate during rotation of the substrate; making a linear velocity at an ejection position of the coating liquid from the ejection nozzle substantially constant by reducing a number of rotations of the substrate as the ejection position is positioned closer to the peripheral edge of the substrate; and making an ejection flow rate of the coating liquid ejected from the ejection nozzle substantially constant by changing a gap between the ejection port of the ejection nozzle and the surface of the substrate based on a flow rate of the coating liquid before ejection from the ejection nozzle.