公开(公告)号：US20210005502A1

公开(公告)日：2021-01-07

申请号：US16909228

申请日：2020-06-23

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yuichiro WAGATSUMA ,  Kentaro ASAKURA ,  Tetsuya SAITOU ,  Masahisa WATANABE

IPC: H01L21/687 ,  C23C16/455

Abstract: A stage on which a substrate is mounted, includes a stage body having an upper surface on which the substrate is mounted, a cover member configured to cover an outer edge portion of the upper surface of the stage body, and a positional deviation preventing member provided between the upper surface of the stage body and a lower surface of the cover member and configured to roll or slide. A body-side recess configured to accommodate the positional deviation preventing member is formed on the upper surface of the stage body. A cover-side recess configured to accommodate the positional deviation preventing member accommodated in the body-side recess is formed on the lower surface of the cover member. At least one of the body-side recess and the cover-side recess is formed in a bowl shape having an inclined surface extending along a radial direction of the stage body.

公开(公告)号：US20210005505A1

公开(公告)日：2021-01-07

申请号：US16915046

申请日：2020-06-29

Applicant: Tokyo Electron Limited

Inventor： Yuichiro WAGATSUMA ,  Kentaro ASAKURA ,  Tetsuya SAITOU ,  Masahisa WATANABE

IPC: H01L21/687 ,  H01L21/677 ,  H01L21/67

Abstract: A substrate processing apparatus includes: a stage for performing at least one of heating and cooling on a substrate placed thereon and having a through-hole vertically penetrating the stage; a substrate support pin having an insertion portion inserted into the through-hole and configured so that the insertion portion protrudes from an upper surface of the stage through the through-hole; and a pin support member for supporting the substrate support pin. The substrate support pin has a flange portion located below a lower surface of the stage. The support member supports the substrate support pin by engagement with the flange portion. The through-hole is smaller than the flange portion. The substrate support pin includes a first member including the flange portion and a second member having the insertion portion. The first member has a sliding surface which slidably supports the second member.

公开(公告)号：US20230122317A1

公开(公告)日：2023-04-20

申请号：US17964708

申请日：2022-10-12

Applicant: Tokyo Electron Limited

Inventor： Koichi NAKAJIMA ,  Kentaro ASAKURA ,  Yasuyuki KAGAYA

IPC: H01L21/687 ,  H01L21/683 ,  H01L21/67

Abstract: There is a substrate placing method for placing a substrate on a placing surface of a placing table in a chamber of a substrate processing apparatus for processing a substrate, the placing table having the placing surface on which a substrate is placed and a tapered surface for guiding the substrate disposed at an outer periphery of the placing surface, the method comprising, locating a lift pin to a substrate transfer position over the placing surface, the lift pin being capable of protruding from and retracting below the placing surface, and transferring the substrate onto the lift pin; lowering the lift pin, on which the substrate is placed, to a substrate placing position lower than the placing surface; and raising the lift pin by a short distance and then returning the lift pin to the substrate placing position.

公开(公告)号：US20220013402A1

公开(公告)日：2022-01-13

申请号：US17363401

申请日：2021-06-30

Applicant: Tokyo Electron Limited

Inventor： Melvin VERBAAS ,  Einosuke TSUDA ,  Kentaro ASAKURA

IPC: H01L21/687 ,  H05B3/22

Abstract: A stage device includes: a stage having a pin hole provided therein and a placement surface on which a substrate is placed; and at least one lift pin configured to move up and down through the pin hole; and a lifter configured to raise and lower the at least one lift pin, wherein the stage includes a first heating part provided therein and configured to heat the stage, and the at least one lift pin includes a second heating part provided therein or therearound and configured to heat the at least one lift pin.

公开(公告)号：US20160083837A1

公开(公告)日：2016-03-24

申请号：US14787860

申请日：2014-02-10

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kensaku NARUSHIMA ,  Daisuke TORIYA ,  Kentaro ASAKURA ,  Seishi MURAKAMI

IPC: C23C16/44 ,  C23C16/455 ,  C23C16/34 ,  C23C16/458

CPC classification number: C23C16/4408 ,  C23C16/34 ,  C23C16/4405 ,  C23C16/4409 ,  C23C16/4412 ,  C23C16/45544 ,  C23C16/4583 ,  H01L21/68742 ,  H01L21/68792

Abstract: A film formation device includes: a processing vessel; a mounting stand installed within the processing vessel and configured to mount a substrate thereon; an elevating shaft installed so as to extend in an up-down direction while supporting the mounting stand and connected to an external elevator mechanism through a through-hole formed in the processing vessel; a bellows installed between the processing vessel and the elevator mechanism and configured to cover a periphery of the elevating shaft at a lateral side of the elevating shaft; a lid member disposed so as to surround the elevating shaft with a gap left between a lateral circumferential surface of the elevating shaft and the lid member; and a purge gas supply part configured to supply a purge gas into the bellows so that a gas flow from the bellows toward the processing vessel through the gap is formed.

Abstract translation: 一种成膜装置，包括：处理容器; 安装台，其安装在所述处理容器内并构造成在其上安装基板; 安装成沿着上下方向延伸的升降轴，同时支撑安装台并通过形成在处理容器中的通孔连接到外部升降机构; 安装在处理容器和升降机构之间的波纹管，其构造成在升降轴的侧面覆盖升降轴的周边; 盖构件，其设置成围绕所述升降轴，所述间隙留在所述升降轴的侧向周面和所述盖构件之间; 以及净化气体供给部，其构造成将吹扫气体供给到所述波纹管中，使得形成从所述波纹管到所述处理容器的气体通过所述间隙流动。