公开(公告)号：US20230173557A1

公开(公告)日：2023-06-08

申请号：US17906368

申请日：2021-03-03

Applicant: Tokyo Electron Limited

Inventor： Koichi NAKAJIMA ,  Satoshi CHIDA ,  Satoshi CHINO

IPC: B08B7/00 ,  H01J37/32 ,  H01L21/3205 ,  H01L21/683 ,  C23C16/458 ,  C23C16/44 ,  C23C16/06 ,  C23C16/509

CPC classification number: B08B7/0035 ,  H01J37/32715 ,  H01J37/32082 ,  H01L21/32051 ,  H01L21/6831 ,  C23C16/4586 ,  C23C16/4405 ,  C23C16/06 ,  C23C16/509 ,  H01J2237/335 ,  H01J2237/3321 ,  H01J2237/2007

Abstract: A cleaning method according to one aspect of the present disclosure which cleans an electrostatic chuck includes exposing the electrostatic chuck to plasma and maintaining a relationship between a potential of the electrostatic chuck and a potential of the plasma such that electron current is introduced from the plasma toward the electrostatic chuck.

公开(公告)号：US20230122317A1

公开(公告)日：2023-04-20

申请号：US17964708

申请日：2022-10-12

Applicant: Tokyo Electron Limited

Inventor： Koichi NAKAJIMA ,  Kentaro ASAKURA ,  Yasuyuki KAGAYA

IPC: H01L21/687 ,  H01L21/683 ,  H01L21/67

Abstract: There is a substrate placing method for placing a substrate on a placing surface of a placing table in a chamber of a substrate processing apparatus for processing a substrate, the placing table having the placing surface on which a substrate is placed and a tapered surface for guiding the substrate disposed at an outer periphery of the placing surface, the method comprising, locating a lift pin to a substrate transfer position over the placing surface, the lift pin being capable of protruding from and retracting below the placing surface, and transferring the substrate onto the lift pin; lowering the lift pin, on which the substrate is placed, to a substrate placing position lower than the placing surface; and raising the lift pin by a short distance and then returning the lift pin to the substrate placing position.