公开(公告)号：US10128136B2

公开(公告)日：2018-11-13

申请号：US15671325

申请日：2017-08-08

申请人： Tokyo Electron Limited

发明人： Masahiro Fukuda ,  Hiroshi Ichinomiya ,  Koichi Obata ,  Taro Yamamoto ,  Kouichirou Tanaka

IPC分类号： H01L21/76 ,  H01L21/67 ,  B05C5/02 ,  B05C11/08 ,  B05C11/10 ,  B08B3/08 ,  B08B3/10 ,  G03F7/16 ,  H01L21/027 ,  G03F7/30

摘要： There is provided a guide member 3 in which an inclined surface 32 thereof is inclined downwardly outwards from an edge portion of a rear surface of a horizontally held wafer W; and a cylindrical surrounding member 2 which surrounds the wafer W and in which an upper peripheral portion thereof is inwardly extended obliquely upwards. Further, the surrounding member 2 has, at an inner surface side thereof, two groove portions 23 extended along an entire circumference and located above a height position of the horizontally held wafer W. If an air flow flows along the surrounding member 2, a vortex flow is formed within the groove portions 23 and stays therein. Thus, mist can be captured, so that the flow of the mist to the outside of a cup body 1 can be suppressed. Accordingly, the adhesion of the mist to the wafer W can be suppressed.

公开(公告)号：US20180047592A1

公开(公告)日：2018-02-15

申请号：US15671325

申请日：2017-08-08

申请人： Tokyo Electron Limited

发明人： Masahiro Fukuda ,  Hiroshi Ichinomiya ,  Koichi Obata ,  Taro Yamamoto ,  Kouichirou Tanaka

IPC分类号： H01L21/67 ,  B05C11/08 ,  G03F7/16 ,  B05C11/10 ,  B08B3/08 ,  B08B3/10 ,  H01L21/027 ,  B05C5/02

CPC分类号： H01L21/6715 ,  B05C5/0258 ,  B05C11/08 ,  B05C11/1002 ,  B08B3/08 ,  B08B3/10 ,  G03F7/162 ,  G03F7/3021 ,  H01L21/0273 ,  H01L21/67051 ,  H01L21/67178

摘要： There is provided a guide member 3 in which an inclined surface 32 thereof is inclined downwardly outwards from an edge portion of a rear surface of a horizontally held wafer W; and a cylindrical surrounding member 2 which surrounds the wafer W and in which an upper peripheral portion thereof is inwardly extended obliquely upwards. Further, the surrounding member 2 has, at an inner surface side thereof, two groove portions 23 extended along an entire circumference and located above a height position of the horizontally held wafer W. If an air flow flows along the surrounding member 2, a vortex flow is formed within the groove portions 23 and stays therein. Thus, mist can be captured, so that the flow of the mist to the outside of a cup body 1 can be suppressed. Accordingly, the adhesion of the mist to the wafer W can be suppressed.