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公开(公告)号：US20200227287A1
公开(公告)日：2020-07-16
申请号：US16736241
申请日：2020-01-07
Applicant: TOKYO ELECTRON LIMITED
Inventor： Masato KADOBE
Abstract: There is provided a processing apparatus including: a processing part including a plurality of process modules connected to each other in a first room, and a loader module provided in the first room and accommodating a carrier which receives a substrate processed by each of the plurality of process modules; and a plurality of pump units corresponding to the plurality of process modules, respectively, and arranged in a second room adjacent to the first room, wherein an installation area of the plurality of pump units is equal to or smaller than that of the processing part.
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公开(公告)号：US20240376603A1
公开(公告)日：2024-11-14
申请号：US18648828
申请日：2024-04-29
Applicant: Tokyo Electron Limited
Inventor： Masato KADOBE
Abstract: A substrate processing apparatus, includes a processing container capable of accommodating a substrate holder configured to hold substrates; a pipe extending in a horizontal direction from a side wall of the processing container; and a heating mechanism provided around the processing container. The heating mechanism includes a first heating mechanism configured to cover a first region of the side wall of the processing container where the pipe is provided, and a second heating mechanism configured to cover a second region of the side wall of the processing container excluding the first region. The first heating mechanism has a first insertion hole through which the pipe is inserted, and the first heating mechanism is movable in the horizontal direction between a position where the pipe passes through the first insertion hole and a position where the pipe does not pass through the first insertion hole.
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公开(公告)号：US20230253230A1
公开(公告)日：2023-08-10
申请号：US18159306
申请日：2023-01-25
Applicant: Tokyo Electron Limited
Inventor： Masato KADOBE , Hiromi NITADORI , Kaoru SATO , Kiyohiko GOKON
IPC: H01L21/677 , H01L21/67
CPC classification number: H01L21/67781 , H01L21/67742 , H01L21/67017 , H01L21/6719
Abstract: A substrate processing apparatus includes a loading and unloading unit having a first side surface through which a container accommodating a substrate is loaded and unloaded, and a second side surface opposite to the first side surface, a substrate transport unit extending along a first horizontal direction perpendicular to the second side surface, and a plurality of batch processing units adjacent to one another along a longitudinal direction of the substrate transport unit. Each of the plurality of batch processing units includes a processing container configured to accommodate and process a plurality of substrates, a gas supply unit configured to supply a gas into the processing container, and an exhaust unit configured to exhaust the gas inside the processing container. A first maintenance area, used for attending to a maintenance of the plurality of batch processing units, is provided above the exhaust unit.
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公开(公告)号：US20230253221A1
公开(公告)日：2023-08-10
申请号：US18159295
申请日：2023-01-25
Applicant: Tokyo Electron Limited
Inventor： Masato KADOBE , Hiromi NITADORI , Kaoru SATO , Kiyohiko GOKON
IPC: H01L21/67
CPC classification number: H01L21/67201
Abstract: A substrate processing apparatus includes a loading and unloading unit having a first side surface through which a container accommodating a substrate is loaded and unloaded, and a second side surface opposite to the first side surface, a substrate transport unit extending along a first direction perpendicular to the second side surface, and a plurality of batch processing units adjacent to one another along a longitudinal direction of the substrate transport unit. Each of the plurality of batch processing units includes a processing container configured to accommodate and process a plurality of substrates, a gas supply unit configured to supply a gas into the processing container, and an exhaust unit configured to exhaust the gas inside the processing container. The gas supply unit and the exhaust unit are provided on one side of the processing container.
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Patent Agency Ranking
公开(公告)号：US20250101588A1
公开(公告)日：2025-03-27
申请号：US18893142
申请日：2024-09-23
Applicant: Tokyo Electron Limited
Inventor： Masato KADOBE , Tatsuya YAMAGUCHI
IPC: C23C16/455
Abstract: A substrate processing apparatus includes a processing container body capable of accommodating a substrate holder that holds a substrate, a pipe branching from the processing container body and extending horizontally from a sidewall of the processing container body, a temperature adjustment mechanism having a housing surrounding the pipe and configured to adjust a temperature of the pipe, and an injector arranged in the pipe.
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公开(公告)号：US20240295024A1
公开(公告)日：2024-09-05
申请号：US18588315
申请日：2024-02-27
Applicant: Tokyo Electron Limited
Inventor： Makoto TAKAHASHI , Masato KADOBE , Tatsuya YAMAGUCHI
IPC: C23C16/455 , C23C16/48
CPC classification number: C23C16/45548 , C23C16/4557 , C23C16/45578 , C23C16/481
Abstract: A substrate processing apparatus includes: a processing container capable of accommodating a substrate holder that holds substrates; a gas supply chamber provided in a side wall of the processing container, a supply-side pipe extending horizontally from the gas supply chamber, and an injector detachably disposed spanning through the gas supply chamber and the supply-side pipe.
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公开(公告)号：US20240116709A1
公开(公告)日：2024-04-11
申请号：US18483050
申请日：2023-10-09
Applicant: Tokyo Electron Limited
Inventor： Masato KADOBE , Hiromi NITADORI , Takahiro ABE , Junichi SATO
CPC classification number: B65G1/10 , B65G49/061 , B65G49/062 , B65G2201/0297
Abstract: A substrate processing apparatus includes: a loading/unloading part having a first side surface into or from which a container accommodating a substrate is loaded or unloaded and a second side surface opposite to the first side surface; a substrate transfer part extending in a first direction orthogonal to the second side surface; and a plurality of batch processors adjacent to each other in a length direction of the substrate transfer part. The loading/unloading part includes: a first transfer device and a second transfer device configured to transfer the container; a first area accessible to the first transfer device and having a plurality of first storage shelves configured to store the container, a second area accessible to the second transfer device and having a plurality of second storage shelves configured to store the container; and a movable shelf configured to be movable between the first area and the second area.
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公开(公告)号：US20220307627A1
公开(公告)日：2022-09-29
申请号：US17700894
申请日：2022-03-22
Applicant: Tokyo Electron Limited
Inventor： Masato KADOBE , Hiromi NITADORI
Abstract: A piping structure includes a plurality of pipes that connects a plurality of process modules disposed adjacent to each other at a first room and a plurality of vacuum pumps disposed at a second room below the first room to be corresponding to the plurality of process modules, respectively. The plurality of pipes are divided into a plurality of blocks in a height direction, and the plurality of pipes used for blocks in an identical height have an identical shape.
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公开(公告)号：US20200227293A1
公开(公告)日：2020-07-16
申请号：US16737512
申请日：2020-01-08
Applicant: TOKYO ELECTRON LIMITED
Inventor： Masato KADOBE , Shinya NASUKAWA , Hiromi NITADORI , Kazuyuki KIKUCHI , Hirofumi KANEKO
Abstract: A processing apparatus includes: a plurality of process modules concatenated with one another; and a loader module configured to receive a carrier accommodating a plurality of substrates to be processed by the plurality of process modules, wherein each of the plurality of process modules includes: a heat treatment unit including a processing container configured to accommodate the plurality of substrates and perform a heat treatment on the plurality of substrates; and a gas supply unit disposed on one side surface of the heat treatment unit and configured to supply a gas into the processing container.
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