公开(公告)号：US20190006207A1

公开(公告)日：2019-01-03

申请号：US16114743

申请日：2018-08-28

Applicant: TOKYO ELECTRON LIMITED

Inventor： Manabu AMIKURA ,  Toshiki HINATA

IPC: H01L21/67 ,  H01J37/32 ,  C23C16/44 ,  C23C16/455

Abstract: A substrate processing apparatus includes a processing container configured to air-tightly accommodate substrates, a plurality of mounting stands configured to mount the substrates, a process gas supply part configured to supply a process gas to the mounting stands, an exhaust mechanism configured to evacuate an interior of the processing container, a partition wall configured to independently surround the mounting stands with a gap left between the partition wall and each of the mounting stands, and cylindrical inner walls configured to independently surround the mounting stands with a gap left between each of the inner walls and each of the mounting stands. Slits are formed in the inner walls. The process gas in the processing spaces is exhausted via the slits. The inner walls include partition plates for bypassing the process gas so that the process gas does not directly flow into the slits.

公开(公告)号：US20210035823A1

公开(公告)日：2021-02-04

申请号：US16766967

申请日：2018-11-16

Applicant: Tokyo Electron Limited

Inventor： Yuji ASAKAWA ,  Manabu AMIKURA

IPC: H01L21/67

Abstract: A substrate processing device for processing a substrate is provided. The substrate processing device includes: a processing container configured to accommodate a substrate; a placement stage on which the substrate is mounted in the processing container; an exhauster configured to exhaust a processing gas in the processing container; and a partition wall disposed in the processing container and surrounding the placement stage, wherein, inside the partition wall, an exhaust flow path, which communicates with the exhauster, is formed to extend in a vertical direction over an entire circumference of the partition wall, and a plurality of openings, which communicates with a substrate processing space formed inside the partition wall above the placement stage and communicates with the exhaust flow path, is formed at regular intervals in an inner circumferential direction of the partition wall.

公开(公告)号：US20160355928A1

公开(公告)日：2016-12-08

申请号：US15243048

申请日：2016-08-22

Applicant: TOKYO ELECTRON LIMITED

Inventor： Daisuke TORIYA ,  Eiichi KOMORI ,  Manabu AMIKURA

IPC: C23C16/455 ,  H01L21/687 ,  H01L21/02 ,  C23C16/44 ,  C23C16/458

CPC classification number: C23C16/45544 ,  C23C16/4412 ,  C23C16/45565 ,  C23C16/45574 ,  C23C16/4585 ,  H01L21/02175 ,  H01L21/68721

Abstract: A film forming apparatus includes: a mounting table that is lifted/lowered between a processing location and a delivery location below the processing location; an encompassing member for encompassing the mounting table positioned at the processing location and to divide an inside of a processing container into a processing space of an upper space and a space of a lower side; an exhaust part for evacuating the inside of the processing container through the processing space; a purge gas supply unit configured to supply a purge gas to the lower side space; a clamp ring stacked on an upper surface of the encompassing member when the mounting table is positioned at the delivery location; and a guiding part formed at the encompassing member to be extended between an upper side of the mounting table and a lower side of the clamp ring and to guide a flow of the purge gas.

Abstract translation: 一种成膜设备包括：安装台，其在处理位置和处理位置下方的传送位置之间升降; 用于包围位于处理位置处的安装台并将处理容器的内部分成上侧空间和下侧空间的处理空间的包围构件; 排气部，其通过处理空间排出处理容器的内部; 净化气体供给单元，其构造成向下侧空间供给净化气体; 夹紧环，当所述安装台位于所述传送位置时，堆叠在所述包围构件的上表面上; 以及形成在所述封闭构件上以在所述安装台的上侧和所述夹紧环的下侧之间延伸并且引导所述吹扫气体的流动的引导部。

公开(公告)号：US20160189987A1

公开(公告)日：2016-06-30

申请号：US14971708

申请日：2015-12-16

Applicant: TOKYO ELECTRON LIMITED

Inventor： Manabu AMIKURA ,  Toshiki HINATA

IPC: H01L21/67

CPC classification number: H01L21/67069 ,  C23C16/4404 ,  C23C16/4409 ,  C23C16/4412 ,  C23C16/45587 ,  H01J37/32449 ,  H01J2237/0268 ,  H01J2237/16 ,  H01L21/67017 ,  H01L21/6719

Abstract: A substrate processing apparatus includes a processing container configured to air-tightly accommodate substrates, a plurality of mounting stands configured to mount the substrates, a process gas supply part configured to supply a process gas to the mounting stands, an exhaust mechanism configured to evacuate an interior of the processing container, a partition wall configured to independently surround the mounting stands with a gap left between the partition wall and each of the mounting stands, and cylindrical inner walls configured to independently surround the mounting stands with a gap left between each of the inner walls and each of the mounting stands. Slits are formed in the inner walls. The process gas in the processing spaces is exhausted via the slits. The inner walls include partition plates for bypassing the process gas so that the process gas does not directly flow into the slits.

Abstract translation: 一种基板处理装置，包括：配置为气密地容纳基板的处理容器;被配置为安装基板的多个安装支架;配置成向所述安装台供给处理气体的处理气体供给部;排气机构， 处理容器的内部，分隔壁，被配置为独立地围绕安装台，间隔留在分隔壁和每个安装台之间，并且圆筒形内壁被构造成独立地围绕安装台，其间留有间隙 内壁和每个安装架。 狭缝形成在内壁上。 处理空间中的处理气体经由狭缝排出。 内壁包括用于旁路工艺气体的隔板，使得工艺气体不直接流入狭缝。

公开(公告)号：US20140130743A1

公开(公告)日：2014-05-15

申请号：US14074302

申请日：2013-11-07

Applicant: TOKYO ELECTRON LIMITED

Inventor： Daisuke TORIYA ,  Eiichi KOMORI ,  Manabu AMIKURA

IPC: H01L21/02

CPC classification number: C23C16/45544 ,  C23C16/4412 ,  C23C16/45565 ,  C23C16/45574 ,  C23C16/4585 ,  H01L21/02175 ,  H01L21/68721

Abstract: A film forming apparatus that includes a mounting table for loading a wafer, a encompassing member surrounding the mounting table and dividing an inside of a process container, an exhaust part that vacuum exhausts the process container, a clamp ring loaded upon an upper space of the encompassing member and lifted from the upper space of the encompassing member while contacting an inner circumference part thereof with an outer circumference of the wafer loaded on the mounting table, and a cylindrical wall extended downward from the clamp ring, formed along a circumference of the clamp ring into a cylinder shape, and positioned between an outer circumference surface of the mounting table and an inner circumference surface of the encompassing member.

Abstract translation: 一种成膜装置，包括用于装载晶片的安装台，围绕安装台并分隔处理容器内部的包围构件，真空排出处理容器的排气部分，装载在工作容器的上部空间的夹紧环 包围构件，并且在包围构件的上部空间中被提升，同时使其内周部分与装载在安装台上的晶片的外周接触，并且沿着夹具的圆周形成从夹紧环向下延伸的圆柱形壁 环形成圆柱形，并且定位在安装台的外周表面和包围构件的内圆周表面之间。