公开(公告)号：US20240248417A1

公开(公告)日：2024-07-25

申请号：US18412739

申请日：2024-01-15

Applicant: Tokyo Electron Limited

Inventor： Yoji SAKATA ,  Shingo KATSUKI ,  Ryohei FUJISE ,  Kenichirou MATSUYAMA ,  Shinsuke TAKAKI ,  Hiroyuki IWAKI ,  Hiroki TADATOMO ,  Tomoya ONITSUKA

IPC: G03F7/00

CPC classification number: G03F7/70866 ,  G03F7/70716 ,  G03F7/7075 ,  G03F7/70808

Abstract: A substrate processing apparatus includes a first transfer path that is a transfer path for a substrate after MOR film formation and before exposure, and a second transfer path that is a transfer path for the substrate after exposure; and one or a plurality of nitrogen atmosphere placement stages provided on at least one of the first transfer path and the second transfer path and configured to place the substrate in an environment with a nitrogen concentration of an atmosphere set higher than that of air.

公开(公告)号：US20180019153A1

公开(公告)日：2018-01-18

申请号：US15644318

申请日：2017-07-07

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masataka MATSUNAGA ,  Takahiro MASUNAGA ,  Takashi KOGA ,  Yasuharu IWASHITA ,  Shingo KATSUKI ,  Masaaki UMITSUKI ,  Kazutoshi ISHIMARU ,  Fumio SAKATA

IPC: H01L21/683 ,  H01L21/68 ,  H01L21/67

Abstract: A substrate transfer device for transferring a first substrate and a second substrate to a bonding apparatus configured to bond the first substrate and the second substrate, includes a first holding part configured to hold the first substrate from an upper surface side, a lower surface of the first substrate serving as a bonding surface, and a second holding part provided below the first holding part and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate, a upper surface of the second substrate serving as a bonding surface to be bonded to the lower surface of the first substrate.