公开(公告)号：US20240162072A1

公开(公告)日：2024-05-16

申请号：US18418506

申请日：2024-01-22

Applicant: Tokyo Electron Limited

Inventor： Kenichirou MATSUYAMA ,  Yuichiro KAWASAKI

IPC: H01L21/677

CPC classification number: H01L21/67745 ,  H01L21/6773 ,  H01L21/67276

Abstract: A substrate treatment apparatus includes: treatment parts each of which performs a predetermined treatment; and a transfer mechanism which transfers a transfer object. Transfer objects are transferred in a predetermined transfer-in order into the substrate treatment apparatus. The substrate treatment apparatus includes a controller which acquires a process job. The controller determines before starting transfer of one transfer object to the treatment part, when the process job is different between the one transfer object and a preceding transfer object transferred into the substrate treatment apparatus prior to the one transfer object and a same kind of treatment is included in the respective process jobs thereof, a possibility of performing preceding execution of executing the same kind of treatment on the one transfer object previous to completion of the same kind of treatment on the preceding transfer object.

公开(公告)号：US20230152716A1

公开(公告)日：2023-05-18

申请号：US17917503

申请日：2021-03-26

Applicant: Tokyo Electron Limited

Inventor： Kenichirou MATSUYAMA

IPC: G03F7/20 ,  H01L21/677

CPC classification number: G03F7/70733 ,  H01L21/67745

Abstract: A substrate processing apparatus includes: a group of modules including a plurality of processing modules that process a substrate and a plurality of relay modules on which the substrates are disposed to be transferred among the plurality of processing modules; a plurality of transfer mechanisms that transfer the substrates in an assigned section of a transfer path; a shared transfer mechanism shared for transfer in a first section and a second section separated from each other in the transfer path of the substrate; and a determination unit that determines a transfer destination of the substrates by the shared transfer mechanism between the first relay module and the second relay module based on a transfer status of the substrate in each section.

公开(公告)号：US20130236838A1

公开(公告)日：2013-09-12

申请号：US13862526

申请日：2013-04-15

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kenichirou MATSUYAMA ,  Tomohiro KANEKO

IPC: G03F7/20

CPC classification number: G03F7/20 ,  H01L21/6715 ,  H01L21/67178 ,  H01L21/67276 ,  H01L21/67745 ,  H01L21/67769

Abstract: A substrate processing apparatus is disclosed equipped with a transfer mechanism that transfers a substrate processed at a processing block to a carrier so that the increase of the number of transfer process is suppressed, improving the processing efficiency. The substrate processing apparatus is configured in such a way that, when a second-transfer module houses at least one substrate and a carrier that can house the at least one substrate is not placed in a carrier-placement unit, the at least one substrate is transferred to a buffer module. When the second transfer module houses at least one substrate and the carrier that can house the at least one substrate is placed in the carrier-placement unit, the at least one substrate is transferred to the carrier, regardless of whether or not a substrate is being transferred from the buffer module to the carrier.

Abstract translation: 公开了一种基板处理装置，其具有将在处理块处理的基板传送到载体的转印机构，从而抑制转印处理次数的增加，提高处理效率。 衬底处理装置被配置成使得当第二转移模块容纳至少一个衬底时，可以容纳至少一个衬底的载体不被放置在载体放置单元中时，所述至少一个衬底是 转移到缓冲模块。 当第二转移模块容纳至少一个基底并且能够容纳至少一个基底的载体被放置在载体放置单元中时，至少一个基底被转移到载体，而不管基底是否是 从缓冲模块传输到载体。

公开(公告)号：US20240021457A1

公开(公告)日：2024-01-18

申请号：US18036079

申请日：2021-11-02

Applicant: Tokyo Electron Limited

Inventor： Kenichirou MATSUYAMA

IPC: H01L21/677 ,  H01L21/687 ,  G03F7/00

CPC classification number: H01L21/67745 ,  H01L21/68707 ,  G03F7/70725

Abstract: A substrate processing apparatus includes a carrier block that disposes a carrier; a processing block including a processing module that processes a substrate; a carry-in port and a carry-out port; a substrate discharge port and a substrate reception port provided in the carrier block and mounts the carrier thereon; a first temporary carrier mount stage and a second temporary carrier mount stage that temporarily mount the carrier thereon; a carrier transfer mechanism that transfers the carrier among the carry-in port, the carry-out port, the substrate reception port, the substrate discharge port, the first temporary carrier mount stage, and the second temporary carrier mount stage; and a controller that compares a transfer time via the first temporary carrier mount stage and a transfer time via the second temporary carrier mount stage, and output a control signal for controlling an operation of the carrier transfer mechanism.

公开(公告)号：US20240310740A1

公开(公告)日：2024-09-19

申请号：US18599619

申请日：2024-03-08

Applicant: Tokyo Electron Limited

Inventor： Kenichirou MATSUYAMA ,  Hiroki TADATOMO ,  Yoji SAKATA ,  Shinsuke TAKAKI

IPC: G03F7/00 ,  B65G47/90 ,  G03F7/38 ,  H01L21/677

CPC classification number: G03F7/7075 ,  B65G47/90 ,  G03F7/38 ,  G03F7/70533 ,  G03F7/7085 ,  G03F7/70875 ,  G03F7/70991 ,  H01L21/67703

Abstract: A substrate transfer method of transferring a substrate on which a metal-containing resist film is formed from a first placement part to a second placement part, includes transferring, depending on an abnormality in a transfer path, the substrate to a standby chamber in which a second atmosphere different from a first atmosphere of the first placement part is formed, without transferring the substrate to the second placement part, and putting the substrate on standby in the second atmosphere.

公开(公告)号：US20240248417A1

公开(公告)日：2024-07-25

申请号：US18412739

申请日：2024-01-15

Applicant: Tokyo Electron Limited

Inventor： Yoji SAKATA ,  Shingo KATSUKI ,  Ryohei FUJISE ,  Kenichirou MATSUYAMA ,  Shinsuke TAKAKI ,  Hiroyuki IWAKI ,  Hiroki TADATOMO ,  Tomoya ONITSUKA

IPC: G03F7/00

CPC classification number: G03F7/70866 ,  G03F7/70716 ,  G03F7/7075 ,  G03F7/70808

Abstract: A substrate processing apparatus includes a first transfer path that is a transfer path for a substrate after MOR film formation and before exposure, and a second transfer path that is a transfer path for the substrate after exposure; and one or a plurality of nitrogen atmosphere placement stages provided on at least one of the first transfer path and the second transfer path and configured to place the substrate in an environment with a nitrogen concentration of an atmosphere set higher than that of air.

公开(公告)号：US20200371440A1

公开(公告)日：2020-11-26

申请号：US16878171

申请日：2020-05-19

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kenichirou MATSUYAMA

IPC: G03F7/30 ,  H01L21/677

Abstract: A substrate processing apparatus includes: a plurality of unit blocks, each having a plurality of modules for processing substrates and a substrate transfer path; a plurality of main transfer mechanisms, each being provided on the substrate transfer path, and configured to transfer the substrates among the plurality of modules; a loading and unloading transfer mechanism configured to load and unload the substrates with respect to each of the unit blocks; a memory configured to store substrate transfer history for each of the unit blocks; and a setting part configured to update a cycle time, which is a time required for a corresponding one of the main transfer mechanisms to move around the substrate transfer path once, of each of the unit blocks based on the substrate transfer history, and configured to set a transfer schedule of the substrates in each of the unit blocks based on the updated cycle time.

公开(公告)号：US20130202386A1

公开(公告)日：2013-08-08

申请号：US13748295

申请日：2013-01-23

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kenichirou MATSUYAMA

IPC: H01L21/677 ,  H01L21/027

CPC classification number: H01L21/67712 ,  H01L21/027 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/67745

Abstract: A substrate processing apparatus includes a control unit performing loading substrates into a second unit block when a trouble occurs in a module of a first unit block; determining whether it is before a leading substrate of a next lot of the lot where a standby substrate positioned in upper stream side than the troubled module belongs is loaded into the module in the uppermost stage of the second unit block; loading the standby substrate into the module in the uppermost stage of the second unit block when determined it is before the loading of the leading substrate and loading the standby substrate into the module in the uppermost stage of the second unit block after a rearmost substrate of the next lot is loaded into the module in the uppermost stage of the second unit block when determined otherwise; and performing a series of processing on the standby substrate.

Abstract translation: 一种基板处理装置，包括当在第一单元块的模块中发生故障时，将加载基板执行到第二单位块中的控制单元; 确定在位于上游侧的备用基板位于故障模块所属的下一批批次的前导基板之前是否被装载到第二单元块的最上层的模块中; 将备用基板装载到第二单元块的最上层中的模块中，当确定它是在引导基板的装载之前并且将备用基板装载到第二单元块的最上层中的模块中之后，在第二单元块的最后阶段 否则在下一批次加载到第二单元块最上段的模块中; 并对备用基板进行一系列处理。